Chinese company Biren Technology has recently unveiled the Biren BR100 HPC GPU during their Biren Explore Summit 2022 event. The Biren BR100 features an in-house chiplet architecture with 77 billion transistors and is manufactured on a 7 nm process using TSMC's 2.5D CoWoS packaging technology. The card is equipped with 300 MB of onboard cache alongside 64 GB of HBM2E memory running at 2.3 TFLOPs. This combination delivers performance above that of the NVIDIA Ampere A100 achieving 1024 TFLOPs in 16-bit floating point operations.
The company also announced the BR104 which features a monolithic design and should offer approximately half the performance of the BR100 at a TDP of 300 W. The Biren BR104 will be available as a standard PCIe card while the BR100 will come in the form of an OAM compatible board with a custom tower cooler. The pricing and availability information for these cards is currently unknown.
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The company also announced the BR104 which features a monolithic design and should offer approximately half the performance of the BR100 at a TDP of 300 W. The Biren BR104 will be available as a standard PCIe card while the BR100 will come in the form of an OAM compatible board with a custom tower cooler. The pricing and availability information for these cards is currently unknown.
View at TechPowerUp Main Site | Source