They say 5nm but as far as I know (whatever I know, I've learned from semianalysis and semiengineering), 5nm is barely possible with DUV. Not impossible but costly and slow, with lots of multiple patterning.
Canon is farther behind, this is their best:
This page provides information on High Resolution / High Productivity KrF Scanner "FPA-6300ES6a."
global.canon
But I noticed Canon has "i-line Steppers for Back-End-Of-the-Line (BEOL) and Advanced Packaging Applications" with a 52 x 68 mm exposure field. That's the size of interposers they should be able to make. So interposers aren't limited by the same 26 x 33 mm size as chips are.
It was ASML's customers that helped create this monopoly. Intel, TSMC and Samsung all invested in it in 2012, when it needed money to develop EUV.
That's why I said "under 14nm".
The complexity of getting high yield on ASML DUV systems at 10nm is why Intel had such a hard and long time getting there, but obviously it can be done, and done in volume with good yield.
And just to note, TSMC "N7" is actually a 10nm node. I'm going to refer to the 'real' 10nm, which includes N7, N6, and Intel 7. This is actually the crossover point where it seems DUV can't be stretched much more.
Unlike the ASML systems, where ASML went for EUV on sub 14nm nodes, Nikon's equipment appears to be specifically designed to use DUV and multiple patterning to achieve higher density.
Nikon's claim 275 wafers/hour using multiple patterning - which is just a few percent below ASMLs top end DUV equipment's max speed which is usually hovering just below 300 wafers/hr.
Intel used ASMLs DUV systems, since Nikon's equipment wasn't out until 2019 and Intel was already making its first gen 10nm chips at that time (Ice Lake). ASML had EUV systems out two years earlier (2017) that could do 10nm, vs Nikon in 2019.
That's not really much difference.
Mainly my point was that there are in fact other competitors in this space, ASML is not the only one, and not everyone has to use an approach identical to ASML to achieve similar results.
As far as competing with China in this space, the west dominates right now. I'd be a lot more concerned about where people are going to get a MOSFET or LCD display if for example, trade with China were to stop for whatever reason.
We'd probably wind up with a glut of 7nm chips, which are useless without all those other not so sexy parts like capacitors, resistors, diodes, power switching transistors, LCD displays and so on that we *don't* make in the west.
Here's an interesting picture of Shanghai, 1990 vs 2010 :