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Samsung Foundry business is set to announce its technology roadmap and plans to strengthen the foundry ecosystem at the Foundry and SAFE Forum in Silicon Valley from June 12 to 13. Notably, Samsung is expected to advance its 1 nm process mass production plan, originally scheduled for 2027, to 2026. This move could look like a surprise since recent rumors (denied by Samsung) emerged about HBM3 and HBM3E chips running too hot and failing to be validated by NVIDIA.
Previously, Samsung successfully mass-produced the world's first 3 nm wafer foundry in June 2022. The company plans to start mass production of its second-generation 3 nm process in 2024 and 2 nm process in 2025. Speculations suggest Samsung may integrate these nodes and potentially begin mass-producing 2 nm chips as early as the second half of 2024. In comparison, rival TSMC aims to reach the A16 node (1.6 nm) in 2027 and start mass production of its 1.4 nm process around 2027-2028.
View at TechPowerUp Main Site | Source
Previously, Samsung successfully mass-produced the world's first 3 nm wafer foundry in June 2022. The company plans to start mass production of its second-generation 3 nm process in 2024 and 2 nm process in 2025. Speculations suggest Samsung may integrate these nodes and potentially begin mass-producing 2 nm chips as early as the second half of 2024. In comparison, rival TSMC aims to reach the A16 node (1.6 nm) in 2027 and start mass production of its 1.4 nm process around 2027-2028.
View at TechPowerUp Main Site | Source