KLEVV FIT V DDR5-6000 32 GB CL32

[ir_cow]

KLEVV has brought the FIT series to DDR5. Targeting PC gamers, the FIT V is a low-profile memory kit that keeps aesthetics simple. But don't be fooled by looks alone! The dual rank KLEVV FIT V is a solid contender for one of the best DDR5-6000 memory kits available. Follow along as we benchmark and compare this memory kit on both Intel and AMD systems.

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[Event Horizon]

Possibly one of the most slept on memory kit vendors.

 

[Sarajiel]

Dual-Rank DIMMs lowers compatibility

Not sure why you think these are dual-rank modules? From your pictures they look like any other x8 single-rank DDR5 module that is commonly organized in 2x 32b sub-channels.
Dual-rank x16 DDR5 modules don't exist to my knowledge, since they are redundant, which would require 2x 32b sub-channels per rank, aka a memory stick that would have 2x 2 ICs on each side of the module, instead of 2x 4 ICs on one side of the module.

Possibly one of the most slept on memory kit vendors.

It's the consumer brand of SK Hynix. Probably to avoid confusion with the OEM memory business that sells their modules under the proper SK Hynix brand. It's similar to what Micron does with their Crucial brand.

 

[Onasi]

It's the consumer brand of SK Hynix. Probably to avoid confusion with the OEM memory business that sells their modules under the proper SK Hynix brand. It's similar to what Micron does with their Crucial brand.

Kinda. AFAIK Essencore is treated as an affiliate separate company from Hynix. It’s a mess of a corporate nesting doll.

 

[bonehead123]

As usual for Klevv, these are slick, neat and smooth looking, and reasonably priced, WITHOUT any rainbow circus puke to gamr-boi it up...

And as mentioned, hopefully they will make some larger kits soon, like 64, 128, 256GB

 

[harm9963]

What stands out at 4K, DDR4 !

 

[ir_cow]

Not sure why you think these are dual-rank modules? From your pictures they look like any other x8 single-rank DDR5 module that is commonly organized in 2x 32b sub-channels.
Dual-rank x16 DDR5 modules don't exist to my knowledge, since they are redundant, which would require 2x 32b sub-channels per rank, aka a memory stick that would have 2x 2 ICs on each side of the module, instead of 2x 4 ICs on one side of the module.

I can assume you it is dual-rank with modules on both sides (lazy me). I just didn't take a photo of the other side. This means its 8x1 on one side and 8x1 on the other to make a total of 16GB per DIMM.

Also dual-rank DDR5 exists. Its all 64GB and 96GB kits on the market right now.

 

[Sarajiel]

Also dual-rank DDR5 exists. Its all 64GB and 96GB kits on the market right now.

I'm aware of that... I'm even running quad-rank 128GB DDR5 in one of my AM5 systems.

I just didn't take a photo of the other side. This means its 8x1 on one side and 8x1 on the other to make a total of 16GB per DIMM.

Wow, I didn't even know that 8Gb DDR5 ICs existed. I always assumed that the DDR5 JEDEC standard defined 16Gb ICs as baseline density. That's why all 16GB kits are x16 (4 ICs) instead of x8 (8 ICs), or atleast the ones I came across so far.
Sounds almost like these ICs are the bottom bin of M-die or A-die, just cut in half.

 

[ir_cow]

Wow, I didn't even know that 8Gb DDR5 ICs existed. I always assumed that the DDR5 JEDEC standard defined 16Gb ICs as baseline density. That's why all 16GB kits are x16 (4 ICs) instead of x8 (8 ICs), or atleast the ones I came across so far.
Sounds almost like these ICs are the bottom bin of M-die or A-die, just cut in half.

Its new. Not listed on SK Hynix website either. But I wouldn't say they are bottom bin considering how well they do at XMP/EXPO and if you were to tweak the timings more all the way down to CAS28 without changing the voltage. I also don't think just cutting 2GB in half is that simple either

 

[Sarajiel]

also don't think just cutting 2GB in half is that simple either

I was more thinking along the line of disabling the defective half of the chip, which could probably be done by deactivating bank groups.
Some of the more prominent extreme OCers suggested awhile ago that such a thing was done with 24Gb ICs, but I have no idea if he was blowing smoke or if he actually has the industry contacts that would know that sort of thing.

Btw, have you tested how low tRFC goes on these sticks at XMP/EXPO voltages? 195ns could theoretically be both M-die or A-die.

As usual for Klevv, these are slick, neat and smooth looking, and reasonably priced, WITHOUT any rainbow circus puke to gamr-boi it up...

I think the Klevv Cras series comes with RGB.

 

[ir_cow]

I was more thinking along the line of disabling the defective half of the chip, which could probably be done by deactivating bank groups.
Some of the more prominent extreme OCers suggested awhile ago that such a thing was done with 24Gb ICs, but I have no idea if he was blowing smoke or if he actually has the industry contacts that would know that sort of thing.

I have no idea either. Could ask around, but probably won't get the answer I'm looking for. I found a Micron data sheet for 1GBx8, so we can expect that in the market somewhere as well.

Btw, have you tested how low tRFC goes on these sticks at XMP/EXPO voltages? 195ns could theoretically be both M-die or A-die.

This could also be the new Hynix B-Die. But as for tRFC, I usually don't mess with it much so I don't know, but the tRFC2 value seems to be lower. Still I haven't tried to find the limits of any of these Hynix dies yet.

 

[rlifeh]

P E R F E C T

 

[sector-z]

@ir_cow I know you tested 6000MHz cl 28 but next time if you can it will be interesting to have some OC like Buildzoid of is 6200MHz CL26 he have make it on couple kit board like Here again. Because we never see number about what it give in gaming .

 

[ir_cow]

@sector-z hmm not a bad idea. 6200 / 2066 is doable for sure. I do have a few kits that can do CAS26 stable. Though, kinda a big undertaking to do a full article. Can't please everyone so the question becomes what are we looking for in the testing? There is a lot of choices and directions it can go.

 

[sector-z]

@sector-z hmm not a bad idea. 6200 / 2066 is doable for sure. I do have a few kits that can do CAS26 stable. Though, kinda a big undertaking to do a full article. Can't please everyone so the question becomes what are we looking for in the testing? There is a lot of choices and directions it can go.

Maybe a AMD Ryzen 9950X with new Windows 24H2 ect memory speed / timing round Up ?

Many on Overclock.net are in the 8000MHz CL38 to 32 ! So maybe a test with a good kit you have to compare will be great !! Like 20 game review of 5 or 6 different timing ? It will give yours in the same time to re review the 9950X with all patch ect. What you think about it ? For reference speed take a basic 6000MHz CL30

Edit: or just add frequency / timing we talked in data of your next review if G.skill send you their 6000MHz CL28 memory kit

 

[ir_cow]

Review Update: Fixed spelling in a few graphs. Added photo of second side of memory DIMM for Dual-Rank photo proof. These are 8 x 1GB or 8 x 8GBits per side depending how you want to write it out.

Many on Overclock.net are in the 8000MHz CL38 to 32 !

I haven't seen anyone with 8000 CL32 bootable or stable yet. That would be crazy to see.

So maybe a test with a good kit you have to compare will be great !! Like 20 game review of 5 or 6 different timing ? It will give yours in the same time to re review the 9950X with all patch ect. What you think about it ? For reference speed take a basic 6000MHz CL30

Unfortunately this would take a month or more to complete after all said and done Lot of data to enter. 12 games, 6 timings x 3 benchmark runs per game resolution. On top of that each memory overclock needs to be validated and that takes a whole day of its own for each one. AMD memory overclocking is a real pain in the butt. Generally safe-boot doesn't work so you are forced to clear the CMOS everytime it fails to post. Also are we doing this testing with a stock OS or optimized (game bar disabled, all bloatware removed?). The results will be different. How about the CPU? leaving it a stock to self boost leads to inconsistent results, meaning you could end up redoing all the benchmarks if something looks off after compiling the data. Graphical settings is another factor too.

To have useful comparisons, it takes a bit of give, otherwise the article isn't helpful to anyone.

 

[Taraquin]

Not sure why you think these are dual-rank modules? From your pictures they look like any other x8 single-rank DDR5 module that is commonly organized in 2x 32b sub-channels.
Dual-rank x16 DDR5 modules don't exist to my knowledge, since they are redundant, which would require 2x 32b sub-channels per rank, aka a memory stick that would have 2x 2 ICs on each side of the module, instead of 2x 4 ICs on one side of the module.


It's the consumer brand of SK Hynix. Probably to avoid confusion with the OEM memory business that sells their modules under the proper SK Hynix brand. It's similar to what Micron does with their Crucial brand.

Yes, they excist! I have 2x16gb DR A-die. G.Skill Trident 30-38-38 1.35v. They have dies on both sides and if I dont tune tertiery timings right they wont boot. Wrrd 1 is impossible, that always works on SR-kits. They run RFC 100% stable at 360 at 6000 (120ns). They can overclock to 7400, but no further so they are worse thsn 16gb SR A-dies.

Credits to you for testing tuned settings! Did you try running it above 6000? I tried my kit (G.Skill-kit that is the same die as the one you tested) up to 7400 which booted easily, 7600 and above is a no go no matter what I change.

 

[Raven Rampkin]

I have no idea either. Could ask around, but probably won't get the answer I'm looking for. I found a Micron data sheet for 1GBx8, so we can expect that in the market somewhere as well.


This could also be the new Hynix B-Die. But as for tRFC, I usually don't mess with it much so I don't know, but the tRFC2 value seems to be lower. Still I haven't tried to find the limits of any of these Hynix dies yet.

Not B-die. 3JR is Essencore's old way of marking density cuts (I'm guessing that's why G.skill Hynix DDR4 codes sometimes end in a 1 or 2). Use partial marks to make sure. Hynix DRAM ICs - Pastebin.com We've had this pinned on the former r/overclocking Discord for a while.
4Gbit 1JR DDR4 = 8Gbit CJR cut
8Gbit 1JR DDR4 = 16Gbit AJR cut
8Gbit 2JR DDR4 = likely 16Gbit CJR cut
8Gbit 3JR DDR5 = 16Gbit A-die cut
How (and why) exactly this partial neutering is achieved I've no clue. Tried flashing SPD to 8Gbit on a 4Gbit 1JR stick once and it still POSTed, but wouldn't boot.

 

[ir_cow]

@Raven Rampkin the bank count is the same if we are to believe the AIDA64 / Thiphoon info. Which would mean either the rows or columns are cut in half to make it 8 Gbit if it really is 16 Gbit is disguised. Someone will have to decap and find out. Otherwise we are just guessing.

If Teamgroup has the same thing, is Essencore supplying them as well?

 

[Raven Rampkin]

@Raven Rampkin the bank count is the same if we are to believe the AIDA64 / Thiphoon info. Which would mean either the rows or columns are cut in half to make it 8 Gbit if it really is 16 Gbit is disguised. Someone will have to decap and find out. Otherwise we are just guessing.

If Teamgroup has the same thing, is Essencore supplying them as well?

I've seen Essencore ICs on Goodram sticks. As in Essencore branded in full. Either it's Essencore utilized as a channel of Hynix that sends in all the funny (blank/eTT/uTT, cut down density etc.) Hynix ICs to vendors, or it's Hynix while Essencore is just another customer to engrave their own writings on Hynix's eTTs. G.skill's label coding makes me think it's the former.
Fun fact there are two kinds of partial marks on Hynix(/Essencore) ICs. The one I've done so research much wow on (see last post), present on reviewed sticks (not a rule, there exists Essencore marked stuff with the latter kind), and the other where the fourth character from the left is 4 for DDR4 or 5 for DDR5 (e.g. BTS4, MDW4, MDW5 etc. *except* DTC5/DWC5 which is a regular mark for JJR DDR4). A member of the Hwbot Discord had the latter type on his DDR4, decided to scrape off the top of the ICs and there turned out to be full Hynix engraving with another partial mark underneath (the first kind, those seem to come directly engraved no matter what else is written on the IC, Hynix stuff or Essencore stuff or G.skill stuff or Corsair et cetera), so that was just extra coating.