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Team Group Unveils CAMM2 DDR5 Memory Modules at 7200 and 6400 MHz

Nomad76

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In actively verifying its next-generation CAMM2 (Compression Attached Memory Module 2) memory modules, global memory leader Team Group Inc. today announced two specifications: consumer-grade CAMM2 DDR5 7200 MHz and industrial-grade CAMM2 DDR5 6400 MHz. These new products provide expanded options for the memory market, delivering faster data transfer speeds, enhanced performance, and greater user flexibility.

The consumer-grade CAMM2 memory from Team Group operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking, delivering exceptional performance. Compared to the default JEDEC specification, the module offers write, copy, and read speeds of up to 108,000 MB/s, 106,000 MB/s, and 117,000 MB/s, respectively, while reducing overall latency to 55ns. The module delivers smoother performance when running large applications, gaming, or multitasking. The potential to achieve ultra-high frequencies of 8000-9000 MHz in the future further underscores its superior capabilities. In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory, optimized for DDR5 6400 MHz, which is designed for industrial control, edge computing, and AI applications, providing robust support for high-performance computing and real-time data processing. The module will play a critical role in the development of technologies such as smart manufacturing, autonomous driving, and smart cities by improving both performance and reliability.



Compared to traditional SO-DIMM, U-DIMM, and R-DIMM memory, CAMM2 introduces a breakthrough design with several distinct advantages. It supports dual-channel mode with a single memory module, simplifying system architecture and significantly reducing power consumption. With an integrated CKD (Client Clock Driver) for improved signal integrity, CAMM2 memory is smaller and ideal for thin and light notebooks. Its improved thermal design allows for greater heat dissipation efficiency, unlocking more potential in a compact space. CAMM2 memory surpasses previous standards in overclocking, read speed, and latency, delivering an exceptionally smooth user experience. Through rigorous testing, Team Group has maximized the capabilities of CAMM2 to create endless possibilities for the memory market.

Team Group will continue to invest in CAMM2 technology, advancing both consumer and industrial specifications to deliver high-performance, reliable memory solutions. The Team Group CAMM2 memory series is expected to be released in Q1 2025, bringing a new experience to consumer PCs and industrial applications. Stay tuned to Team Group's official website and social media channels for the latest news.

The following screenshots are from a burn-in using the Intel i9-14900K processor with the Z790 PROJECT ZERO (CAMM2) motherboard. This test environment used an Intel i9-14900K processor paired with the Z790 PROJECT ZERO (CAMM2) motherboard.



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TheLostSwede

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Laptops initially...
Desktops eventually...

Servers probably never... at least not any that may feature hot swapping RAM
There are no laptops currently that support CAMM2 or LPCAMM2 hell both AMD and Intel have killed support for any kind of replaceble RAM on their latest mobile platforms.

All the motherboard makers have internal test boards...
Given these are labelled for industrial use, havent seen any industrial PCs that come with CAMM2 or LPCAMM support so far.
 

TheLostSwede

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Laptops initially...
Laptops aren't likely to use DDR5 CAMM2, but rather LPCAMM2.

There are no laptops currently that support CAMM2 or LPCAMM2 hell both AMD and Intel have killed support for any kind of replaceble RAM on their latest mobile platforms.
Lenovo has a workstation laptop that does.
Dell also have some that supports their original CAMM modules.

Also, why does AMD or Intel have to support CAMM2/LPCAMM2? It's just a difference way of adding the DRAM to the system, it's still DDR5 or LPDD5/X, it's just the physical attachment that differs.
Given these are labelled for industrial use, havent seen any industrial PCs that come with CAMM2 or LPCAMM support so far.
Chicken, egg.
 
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Laptops aren't likely to use DDR5 CAMM2, but rather LPCAMM2.
Most no... but going forward any DTR style or 'gaming' / workstation laptops are less likely to use SODIMM and move to CAMM2, and more likely DDR5/6 standard if they are using higher TDP / desktop shared SoC CPUs (although the shared IMC designs will likely work with either LP or normal DDR)...

Conjecture of course... but there are a few who will want a laptop with 64GB+ of RAM that isn't gonna be soldered to CPU package.

Given these are labelled for industrial use, havent seen any industrial PCs that come with CAMM2 or LPCAMM support so far.
That's not quite what the article states - "In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory" - and what they define as industrial points towards some edge cases with 'edge' computing devices, as well as the more traditional industrial PC.
 
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I still wan't to see measurements regarding the space efficiency of CAMM2. The Type C and Type A DC-modules with just 40mm width may be smaller than four DIMM-sockets, but they are 32GB (Type C) and 128GB (Type A) max atm.
For larger sizes, you either have to use Type B DC-modules (68mm width, 256GB max) or two stacked Type D SC modules (256GB max and 57mm each, stacked 512GB and likely 68mm as well).
MSI's Z790 Project Zero Plus-demonstration board used a Type A-module, but had cleared the space in front of it up to the margin of the board for larger modules. This space would normally be used for power connectors, USB-headers, onboard buttons or components.
 
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I still wan't to see measurements regarding the space efficiency of CAMM2. The Type C and Type A DC-modules with just 40mm width may be smaller than four DIMM-sockets, but they are 32GB (Type C) and 128GB (Type A) max atm.
For larger sizes, you either have to use Type B DC-modules (68mm width, 256GB max) or two stacked Type D SC modules (256GB max and 57mm each, stacked 512GB and likely 68mm as well).
MSI's Z790 Project Zero Plus-demonstration board used a Type A-module, but had cleared the space in front of it up to the margin of the board for larger modules. This space would normally be used for power connectors, USB-headers, onboard buttons or components.
The other key advantage is placing the RAM closer to the CPU (good electrically / signal quality) and due to the lower profile it would be much less likely to interfere with CPU coolers, regardless how big the module is in terms of width/depth - stacked arrangements might be an issue - downdraft coolers (such as the Intel/AMD stock) would also spread air over the module a bit more effectively vs a group of upright DIMMs.
 
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Chicken, egg.
Yeah. This is the egg, so we need to wait for the chicken and hope that nothing smashes the egg before it hatches.

CAMM and CAMM2 solve some of the problems with SoDIMM slots, which laptop vendors do actually like since they can offer multiple configurations from the same production run, rather than having to split production runs into different RAM size variants.

Hopefully we start to see CAMM2 laptops instead of soldered-RAM laptops in the next year.

The other key advantage is placing the RAM closer to the CPU (good electrically / signal quality)
This. CAMM wasn't particularly about space saving - IIRC the CAMM modules take up more PCB area than a SoDIMM as a trade-off for being lower-profile.

Like you say, the primary reason for CAMM was to reduce the trace length to the CPU's memory controller which is why you won't find upgradeable laptops supporting DDR5 speeds much beyond 5200.
 
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What systems use these?

MSI is already selling a motherboard using these and as mentioned above there's several laptops with CAMM and LPCAMM

I still wan't to see measurements regarding the space efficiency of CAMM2. The Type C and Type A DC-modules with just 40mm width may be smaller than four DIMM-sockets, but they are 32GB (Type C) and 128GB (Type A) max atm.
CAMM wasn't particularly about space saving - IIRC the CAMM modules take up more PCB area than a SoDIMM as a trade-off for being lower-profile.

This is where they fucked up designing the new standard, they went with 4 different possible sizes instead of using just one or two. LPCAMM2 got this right, there's only 1 size available, it only goes up to 64gb for now but you only get one type of module to design around and there's no market fragmentation supporting different module types.

If they don't do this for CAMM2 as well I don't see it gaining any traction. They can use dual sided modules and more of them to increase capacity instead of using 4 different size types.
 
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