Seems a lot of people without a clue in this thread which is completely to be expected given the quality of news articles the last year or so involving Intel. A lot of stuff seems to have been seeded by upset investors looking for it to be sold for parts. Fixing Intel was always going to take a long time, but if there's one thing wall street hates it's spending a lot of money without short term returns. That seems to be the actual breaking point here, and given who's on the board should be unsurprising (for anyone who doesn't know here's some insight:
https://www.fabricatedknowledge.com/p/the-death-of-intel-when-boards-fail). Intel is sadly likely doomed now and won't exist as it has.
As for this article specifically: yield rates depend on die size and design so some outlet in Korea making these claims doesn't actually hold any weight. We'll all find out next year when PTL/CWF are supposed to launch and what nodes they're using. Barring anything official coming out before then it'll be hard to say with any certainty where things are.
I dunno, I can actually see them selling or spinning off their foundries.
None of Intel's DUV nodes are viable for third party usage and they won't have one which is until the UMC partnership bears fruit which is supposed to be 2027. This makes selling/spinning off a losing proposition and you only have to look at GloFo to see how that plays out.
Intel 7 is a straight up name change of 10 nm
No it was a node refinement so think of it more along the lines of TSMC N6 and N4 being refinements of N7 and N5 respectively.
Intel 4 only used for a few laptop CPUs
A limited number of SKUs perhaps, but that was still 10s of millions of CPU tiles. This node was always going to be a one and done node due to limited PDK.
Intel 3 only used for a few data center CPUs
All Xeon 6 CPUs are on Intel 3 and this should be a long term node, but also uses the same equipment as Intel 4 which has undoubtedly hampered capacity until Intel could stop making MTL cores. This is the idiotic decision to not buy EUV machines having far reaching consequences which are beyond the 10nm failure.
Did I miss anything or get something wrong because the above means that nothing really came after 10 nm from Intel?
You missed a lot, but the GPU/CPU TSMC use is spot on. I'd expect GPUs to remain on TSMC for the time being, but with the board causing the messes they have this might not change at all.
I guess they didn't learn much from 10nm... They are trying to get PowerVia done, which was supposed to come with 20A. With that being canned, there still isn't an implementation on an otherwise mature node.
Having a shrink and PowerVia onto a single process may be too much to swallow at once.
BSPDN was developed on a custom Intel 4 process so if it didn't pan out it wouldn't impact 20A/18A development as those were implementing GAAFET. It should have no bearing on the progress of 18A as they could have just dropped it if they couldn't get it working.
I don't know much about Intel's planned nodes, but they're already behind schedule, and failing on yields - 18A should have been out in the second half of this year.
No 18A was never a 2024 node, even the branding of "5N4Y" says that: Gelsinger wasn't hired until 2021 so it was always a 2025 node. Intel 4 had a pretty big delay and Intel 3 took as long as it was originally supposed to after Intel 4, but the Intel 4 delay factors in here. In theory if Intel wasn't lying about the 20A/18A situation 20A would have been mostly on time and 18A will be, but we won't know any of this until next year or if Intel states otherwise on the record.