Darby_Echo
New Member
- Joined
- Mar 7, 2025
- Messages
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We've heard before Zen6 is to use RDNA3.5 instead of RDNA4, but that it looks to me that this is about desktop parts with minimal iGPU and perhaps 8700G successors.
Now we have further hints, trickling down through [hothardware](https://hothardware.com/news/amd-zen6-ryzen-ccd-details-leak), [wccftech](https://wccftech.com/amd-next-gen-ryzen-zen-6-medusa-ridge-cpus-12-24-32-core-up-to-128-mb-l3-cache/) etc, suggesting that:
* They could have chiplet versions of up to 12 Zen6 or 16x Zen6c cores
* 50% more L3 cache on Zen6 chiplets and 100% more L3 on Zen6c version
* Zen6 AM5 CPUs would go up to 24 Zen6 or 32 Zen6c cores
* extra L3 die cache on top of that for X3D models, possibly on both chiplets
It double-taps two killer features - compact Zen6 cores and X3D cache. If one has whole extra die for L3 cache, then cores can be much more compact without performance impact.
It also looks I/O chiplet and IF are to be a major redesign, since they need way more bandwidth to feed many more cores.
AMD is about to transition to much faster and more compact and energy efficient silicon bridges for communication between chiplets,
so I wonder if they'll plop one between CPU chiplets, thus killing the inter-CCD latency...
This also implies CUDIMM, LPCAMM2 (or similar) and MRDIMM tech support and much beefier IMC.
But as before, APUs are to be left trailing behind CPUs - no X3D cache layers for their iGPUs ?
It seems AMD will start to open their cards in 2H2025, so chips might be out in by 2026 ?
Now we have further hints, trickling down through [hothardware](https://hothardware.com/news/amd-zen6-ryzen-ccd-details-leak), [wccftech](https://wccftech.com/amd-next-gen-ryzen-zen-6-medusa-ridge-cpus-12-24-32-core-up-to-128-mb-l3-cache/) etc, suggesting that:
* They could have chiplet versions of up to 12 Zen6 or 16x Zen6c cores
* 50% more L3 cache on Zen6 chiplets and 100% more L3 on Zen6c version
* Zen6 AM5 CPUs would go up to 24 Zen6 or 32 Zen6c cores
* extra L3 die cache on top of that for X3D models, possibly on both chiplets
It double-taps two killer features - compact Zen6 cores and X3D cache. If one has whole extra die for L3 cache, then cores can be much more compact without performance impact.
It also looks I/O chiplet and IF are to be a major redesign, since they need way more bandwidth to feed many more cores.
AMD is about to transition to much faster and more compact and energy efficient silicon bridges for communication between chiplets,
so I wonder if they'll plop one between CPU chiplets, thus killing the inter-CCD latency...
This also implies CUDIMM, LPCAMM2 (or similar) and MRDIMM tech support and much beefier IMC.
But as before, APUs are to be left trailing behind CPUs - no X3D cache layers for their iGPUs ?
It seems AMD will start to open their cards in 2H2025, so chips might be out in by 2026 ?