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According to an attendee of a recent Intel AI presentation, company representatives revealed a release timeline for next-gen Core Ultra "Panther Lake" mobile processor family. Team Blue's China office appears to be courting users of DeepSeek R1, as evidenced by meng59739449's sharing of a processor product roadmap (machine translated by VideoCardz). A volume launch of Core Ultra 300 "Panther Lake-H" series seems to be on the cards for Q1 2026. Earlier this month, an Intel executive insisted that Panther Lake was on track for a second half of 2025 roll out. Lately, industry moles have alleged that a "problematic 18A node" process has caused delays across new generation product lines.
Team Blue watchdogs reckon that high volume manufacturing (HVM) of Panther Lake chips will kick off in September. By October, an Early Enablement Program (EEP) is expected to start—with samples sent off to OEMs for full approval. Industry experts believe that Intel will following a familiar pattern of "announcing the processor in the second half of the prior year, but ramping up mass production in the following year." Previous generation mobile CPU platforms—Meteor Lake and Lunar Lake—received similar treatment in the recent past. Last week, a Panther Lake-H (PTL-H) sample was on general display at Embedded World 2025—the German office is similarly engaged in hyping up the AI-crunching capabilities of roadmapped products.
View at TechPowerUp Main Site | Source
Team Blue watchdogs reckon that high volume manufacturing (HVM) of Panther Lake chips will kick off in September. By October, an Early Enablement Program (EEP) is expected to start—with samples sent off to OEMs for full approval. Industry experts believe that Intel will following a familiar pattern of "announcing the processor in the second half of the prior year, but ramping up mass production in the following year." Previous generation mobile CPU platforms—Meteor Lake and Lunar Lake—received similar treatment in the recent past. Last week, a Panther Lake-H (PTL-H) sample was on general display at Embedded World 2025—the German office is similarly engaged in hyping up the AI-crunching capabilities of roadmapped products.




View at TechPowerUp Main Site | Source