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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | Gigabyte B550 AORUS Elite V2 |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 16GB DDR4-3200 |
Video Card(s) | Galax RTX 4070 Ti EX |
Storage | Samsung 990 1TB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
EVGA showed of its almost-ready dual LGA-1366 high-end workstation motherboard at the ongoing CES event. The motherboard pictured sports a component cooling covering all its vital areas except for one of the CPUs' VRM areas, it gives a fair idea about what the final product could look like. The board itself was detailed earlier.
The chipset cooler design borrows heavily from single-slot graphics cards. A monolithic baseplate covers the northbridge Intel 5500(?), ICH10-class southbridge, and the two NVIDIA BR-03 bridge chips. The heatsink becomes taller over one of the CPU sockets' VRM area. Air is drawn in from the round intake, and pushed out near the expansion slots. the gaps between the expansion slots will do their part in directing the hot air away.
View at TechPowerUp Main Site
The chipset cooler design borrows heavily from single-slot graphics cards. A monolithic baseplate covers the northbridge Intel 5500(?), ICH10-class southbridge, and the two NVIDIA BR-03 bridge chips. The heatsink becomes taller over one of the CPU sockets' VRM area. Air is drawn in from the round intake, and pushed out near the expansion slots. the gaps between the expansion slots will do their part in directing the hot air away.




View at TechPowerUp Main Site
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