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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | ASUS ROG Strix B450-E Gaming |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 8GB G.Skill Sniper X |
| Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
| Storage | Western Digital Black NVMe 512GB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
ARCTIC Thermal Pad bridges problem-free even large spaces. After multiple awards with its thermal pastes, ARCTIC is now offering thermal pads as well. As perfect gap filler the Thermal Pad provides an optimal heat transfer and bridges even large height differences and uneven surfaces.
Often it is troublesome to cool diverse components like memory chips, CPUs, MCUs, DSPs and other ICs densely packed. Different heights prevent a proper contact to the heatsink and thus make it useless. The thermal pad is perfect to close even large spaces completely. Due to its low hardness this silicon pad adapts ideally to uneven surfaces, also at low pressure and thus ensures the best possible heat dissipation. In the comparison test the Thermal Pad with its special filler and a high thermal conductivity can demonstrate its performance and leaves the competitors behind.
That's maximum performance at a minimum effort, since the installation of the Thermal Pad is child's play - perfect for beginners. It does not contain any metallic particles, is electrically isolating and not capacitive. The handling is safe as contact with any electrical trace would not result in damage of any sort.
QUICK FACTS Thermal Pad High Performance Gap Filler
View at TechPowerUp Main Site
Often it is troublesome to cool diverse components like memory chips, CPUs, MCUs, DSPs and other ICs densely packed. Different heights prevent a proper contact to the heatsink and thus make it useless. The thermal pad is perfect to close even large spaces completely. Due to its low hardness this silicon pad adapts ideally to uneven surfaces, also at low pressure and thus ensures the best possible heat dissipation. In the comparison test the Thermal Pad with its special filler and a high thermal conductivity can demonstrate its performance and leaves the competitors behind.
That's maximum performance at a minimum effort, since the installation of the Thermal Pad is child's play - perfect for beginners. It does not contain any metallic particles, is electrically isolating and not capacitive. The handling is safe as contact with any electrical trace would not result in damage of any sort.
QUICK FACTS Thermal Pad High Performance Gap Filler
- Electrically non-conductive
- Thermal conductivity 6.0 W/mK
- Safe and easy handling
- Measures:
o 50 x 50 x 0,5 mm | x 1 mm | x 1.5 mm
o 145 x 145 x 0,5 mm | x 1 mm | x 1.5 mm
View at TechPowerUp Main Site
