Intel Core i7 8700K Reportedly Reaches 4.8 GHz Easily, 5 GHz+ Requires Delid

Raevenlord · Sep 22, 2017

A report out of Expreview says that users should expect Intel's 8700K 6-core processor to easily clock up to 4.8 GHz with conventional cooling methods. Apparently, the chip doesn't even need that much voltage to achieve this feat either; however, thermal constraints are quickly hit when pushing Intel's latest (upcoming) leader for the mainstream desktop parts. Expreview says that due to the much increased temperatures, users who want to eke out the most performance from their CPU purchase will likely have to try and resort to delidding of their 8700K. While that likely wouldn't have been necessary with Intel's 7700K processors, remember that here we have two extra CPU cores drawing power and producing waste heat, so it makes sense that thermals will be a bigger problem.

This is understandable: Intel is still using their much chagrined (and divisive) TIM as a heat conductor between the CPU die and the CPU's IHS (Integrated Heat Spreader), which has been proven to be a less than adequate way of conducting said heat. However, we all knew this would be the case; remember that Intel's HEDT HCC processors also feature this TIM, and in that case, we're talking of up to 18-core processors that can cost up to $1,999 - if Intel couldn't be bothered to spend the extra cents for actual solder as an interface material there, they certainly wouldn't do so here. As with almost all peeks at as of yet unreleased products, take this report (particularly when it comes to frequencies, as each CPU overclocks differently) with a grain of salt, please.

View at TechPowerUp Main Site

danbert2000 · Sep 22, 2017

It's not really valid to suggest that Intel is using TIM on processors just to save money. Soldering chips to heat spreaders is a great way to get rid of heat, but the solder itself will degrade faster than TIM and Intel is in the business of supplying chips for a lot of long-duration, intensive tasks, such as enterprise servers. If Intel can hit thermal targets with TIM and have the chips last longer, I'm sure they don't care that enthusiasts have to delid their chips for a scant 200 MHz of extra speed.

Static~Charge · Sep 22, 2017

"Intel is still using their much chagrined TIM as a heat conductor between the CPU die and the CPU's IHS"

chagrin, n. -- A keen feeling of mental unease, as of annoyance or embarrassment, caused by failure, disappointment, or a disconcerting event.

Instead of "chagrined", a more appropriate word might be: despised, detested, loathsome, deplorable, reviled, disliked.

Raevenlord · Sep 22, 2017

Static~Charge said:
"Intel is still using their much chagrined TIM as a heat conductor between the CPU die and the CPU's IHS"

chagrin, n. -- A keen feeling of mental unease, as of annoyance or embarrassment, caused by failure, disappointment, or a disconcerting event.

Instead of "chagrined", a more appropriate word might be: despised, detested, loathsome, deplorable, reviled, disliked.

I think chagrined fits well, since to my eyes, it's both disconcerting and a disappointment. causing me to roll my eyes in annoyance =)

But thanks for that. Though I think divisive would be best.

erocker · Sep 22, 2017

Not much different going back a few generations now.

danbert2000 said:
It's not really valid to suggest that Intel is using TIM on processors just to save money. Soldering chips to heat spreaders is a great way to get rid of heat, but the solder itself will degrade faster than TIM and Intel is in the business of supplying chips for a lot of long-duration, intensive tasks, such as enterprise servers. If Intel can hit thermal targets with TIM and have the chips last longer, I'm sure they don't care that enthusiasts have to delid their chips for a scant 200 MHz of extra speed.

TIM outlasts soldier? You serious?

kaellar · Sep 22, 2017

danbert2000 said:
Soldering chips to heat spreaders is a great way to get rid of heat, but the solder itself will degrade faster than TIM and Intel is in the business of supplying chips for a lot of long-duration, intensive tasks, such as enterprise servers.

LMFAO you can't be serious, can you?

ZoneDymo · Sep 22, 2017

who cares yo, its all about dat Ryzen

TheoneandonlyMrK · Sep 22, 2017

danbert2000 said:
It's not really valid to suggest that Intel is using TIM on processors just to save money. Soldering chips to heat spreaders is a great way to get rid of heat, but the solder itself will degrade faster than TIM and Intel is in the business of supplying chips for a lot of long-duration, intensive tasks, such as enterprise servers. If Intel can hit thermal targets with TIM and have the chips last longer, I'm sure they don't care that enthusiasts have to delid their chips for a scant 200 MHz of extra speed.

What ,, how is solder going to wear quicker then regular Tim ,if im mssing something someone please enlighten me.

Seams like intels bulldozer to me , and that's a light jab as way back I fully understood the physics of the task and got an 8350 and plenty of cooling regardless, then clocked it to 5ghz , its at 4.8 now due to degradation and being on its whole life (5+years of Folding@home and a bit of wcg

), some year's now , I would love to hear how stock untouched i7 7700ks or this new beastie hold clocks at 4.8 after similar abuse ,as I've experience myself of this tim stuff and it isn't capable of miracles.

R-T-B · Sep 22, 2017

Yeah, there is no way TIM outlasts solder. Even if it did, all the first gen i7s running around prove the longevity issues nonexistant.

TheoneandonlyMrK · Sep 22, 2017

R-T-B said:
Yeah, there is no way TIM outlasts solder. Even if it did, all the first gen i7s running around prove the longevity issues nonexistant.

I agree they can last don't get me wrong but um talking about overclocking to this 4.(high) on all cores then putting adequate cooling on it and setting it to task for five years, I'd like to see some proof of such a thing without a delid.
Id expect much reduced thermal transfer over time and glitchy stability myself.

R-T-B · Sep 22, 2017

theoneandonlymrk said:
I agree they can last don't get me wrong but um talking about overclocking to this 4.(high) on all cores then putting adequate cooling on it and setting it to task for five years, I'd like to see some proof of such a thing without a delid.
Id expect much reduced thermal transfer over time and glitchy stability myself.

I'm running a first gen i7 in my brothers rig at 4Ghz no delid. Then again, first gen i7s are soldered. I think the silicon will go before the solder does at this rate.

danbert2000 · Sep 22, 2017

"Micro cracks in solder preforms can damage the CPU permanently after a certain amount of thermal cycles and time. Conventional thermal paste doesn’t perform as good as the solder preform but it should have a longer durability – especially for small size DIE CPUs."

http://overclocking.guide/the-truth-about-cpu-soldering/

Paste doesn't crack when it's sealed in a heatspreader. Solder is well known to crack under successive heat loads. For example, this is what caused the 30% failure rate of Xbox 360's.. Sorry guys, your feels don't affect materials science.

phanbuey · Sep 22, 2017

danbert2000 said:
"Micro cracks in solder preforms can damage the CPU permanently after a certain amount of thermal cycles and time. Conventional thermal paste doesn’t perform as good as the solder preform but it should have a longer durability – especially for small size DIE CPUs."

http://overclocking.guide/the-truth-about-cpu-soldering/

Paste doesn't crack when it's sealed in a heatspreader. Solder is well known to crack under successive heat loads. For example, this is what caused the 30% failure rate of Xbox 360's.. Sorry guys, your feels don't affect materials science.

I thought it was because the bga solder that held the cpu to the motherboard actually melted from the heat... that's why people could bake their xbox 360's back into working condition...

AFAIK the xbox CPU didnt even have a heatspreader.

EDIT: Yeah just checked... it was the solder that held the chip to the board, not thermal solder that holds the heatspreader to a cpu.

https://www.ifixit.com/Guide/Reflowing+Xbox+360+Motherboard/5845

OSdevr · Sep 22, 2017

danbert2000 said:
"Paste doesn't crack when it's sealed in a heatspreader. Solder is well known to crack under successive heat loads. For example, this is what caused the 30% failure rate of Xbox 360's.. Sorry guys, your feels don't affect materials science.

First off, the solder on the Xbox 360 wasn't attaching the CPU to the heatsink but the CPU to the board. The thermal stresses are WAY different. Second, it probably wouldn't have been a problem anyway if Microsoft had used the correct solder for the BGA balls. BTW the CPU chip itself was poorly designed and had a low yield. Lesson learned; don't let a software company design hardware in house!

Vya Domus · Sep 22, 2017

danbert2000 said:
"Micro cracks in solder preforms can damage the CPU permanently after a certain amount of thermal cycles and time. Conventional thermal paste doesn’t perform as good as the solder preform but it should have a longer durability – especially for small size DIE CPUs."

http://overclocking.guide/the-truth-about-cpu-soldering/

Paste doesn't crack when it's sealed in a heatspreader. Solder is well known to crack under successive heat loads. For example, this is what caused the 30% failure rate of Xbox 360's.. Sorry guys, your feels don't affect materials science.

The issue with the Xbox 360 was the solder used in attaching the chip itself to the motherboard , not the solder used for the heatsink. They didn't even use solder for that.

Do some research and cut back the Intel damage control.

danbert2000 · Sep 22, 2017

Yes I know the Xbox did not fail due to soldered heatsink failure. It did fail due to cracking solder. Which everyone else is saying isn't a problem. Clearly it is. Solder can crack anywhere due to heat/cool cycles, including between a $2000 server CPU and its head spreader.

Intel did the math and figured they would save warranty money and have a more reliable product if it didn't have the risk of cracking solder at the major thermal interface.

You guys really suck at reading comprehension by the way, I never said the Xbox failed due to solder in the heatspreader failing. I pointed to it as one of the most famous examples of solder failure messing up a product's reliability. Now put on your synthesis hats and apply that experience, of solder failing, to a different application of solder. I know you can.

Vya Domus · Sep 22, 2017

Okay, poorly informed troll.

And by the way , don't double post.

danbert2000 · Sep 22, 2017

Vya Domus said:
Okay poorly informed troll.

So you either read the article and disagree with it but don't have the intelligence to give a reason, or you didn't read the article and just wanted to be pedantic for what turned out to be your mistake in reading comprehension. Gotcha. I guess I'm the best kind of troll, the one that discusses the actual post and gives evidence as to why Intel may not use solder even if it has better thermal performance.

Vya Domus · Sep 22, 2017

I don't care about the article at all , my comment had nothing to do with it. I reckon you should take a better look at what I said and tone back the insults.

You claimed the Xbox 360's high failure rate was due to those "micro-cracks". Which is simply false , the low temperature solder Microsoft used would easily reach the melting point due to poor cooling causing the solder points to deform and ultimately brake connection. I have no idea how the hell you made the connection between that and the micro-cracks caused by thermal cycles that article was talking about. Actually I do , you don't know what you're talking about. Talking about comprehension , oh boy...

And don't flatter yourself , you're a pretty basic run-of-the-mill troll.

Anyway , now that I made myself clear I'm done with this discussion , I suggest you stop here as well.

danbert2000 · Sep 22, 2017

Vya Domus said:
You claimed the Xbox 360's high failure rate was due to those "micro-cracks". Which is simply false , the low temperature solder Microsoft used would easily reach the melting point due to poor cooling causing the solder points to deform and ultimately brake connection.

"German computer magazine c't blamed the problem primarily on the use of the wrong type of lead-free solder, a type that when exposed to elevated temperatures for extended periods of time becomes brittle and can develop hair-line cracks that are almost irreparable"

https://en.wikipedia.org/wiki/Xbox_360_technical_problems#Causes

Oh man, in fighting against trolls you've become one. I have all the evidence on my side and all you have is a bad attitude.

phanbuey · Sep 22, 2017

danbert2000 said:
Yes I know the Xbox did not fail due to soldered heatsink failure. It did fail due to cracking solder. Which everyone else is saying isn't a problem. Clearly it is. Solder can crack anywhere due to heat/cool cycles, including between a $2000 server CPU and its head spreader.

Intel did the math and figured they would save warranty money and have a more reliable product if it didn't have the risk of cracking solder at the major thermal interface.

You guys really suck at reading comprehension by the way, I never said the Xbox failed due to solder in the heatspreader failing. I pointed to it as one of the most famous examples of solder failure messing up a product's reliability. Now put on your synthesis hats and apply that experience, of solder failing, to a different application of solder. I know you can.

I am no expert but I am pretty sure that they are different alloys of indium, complete with different pre-prep, thermal performance, and soldering processes. Can you use indium wire for soldering your heatsink? sure... is that what intel / amd uses? probably not. Do they have soldered CPUs that have been running for decades? yes...

To say that "solder can crack and damage your core" takes a bit of assuming. I think intel definitely did the math, and realized their operating profit would be much higher with minimal impact to failure rates if they opted for cheaper tim.

sTIM cracking <> CPU failing <> xBox BGA cheapo manufacturing process - those are the leaps you're trying to make but they're not connected.

http://ieeexplore.ieee.org/document/6066933/

Thermal paste dries out / separates/ cracks over time as well, may not damage the chip or it may bake it...

Vya Domus · Sep 22, 2017

danbert2000 said:
"German computer magazine c't blamed the problem primarily on the use of the wrong type of lead-free solder, a type that when exposed to elevated temperatures for extended periods of time becomes brittle and can develop hair-line cracks that are almost irreparable"

https://en.wikipedia.org/wiki/Xbox_360_technical_problems#Causes

Oh man, in fighting against trolls you've become one. I have all the evidence on my side and all you have is a bad attitude.

Nah , all you have is a place on my ignore list. It took some effort on your part , I got to say.

danbert2000 · Sep 22, 2017

phanbuey, did you read the article I posted? I'm not the one making the case for solder as the TIM being more prone to failure, the nice people at overclocking.guide are. I was just relaying what I read as it's a counterpoint to the author's position that Intel is only doing this for the money. Also, I did not use the XBOX 360 RROD fiasco as proof of why solder TIM is a bad idea, I gave it as an example of solder failing under thermal load. Before that post, the mood of this thread was derision at the mere thought that solder instead of paste could cause problems. You need to respect the difference between an example of general solder failure rather than a link in my argument. I know why everyone jumped on the 360 stuff though, that's a lot easier to argue against than the analysis in the article I posted, which is pretty solid.

To your point about thermal paste drying out, it won't dry out in a sealed environment like a heatspreader, or at least not for decades. Where is the moisture going to go?

Thanks for being civil while arguing against me, it's a lot easier to have a discussion when people aren't throwing "troll" and "ignore list" around.

TheoneandonlyMrK · Sep 22, 2017

R-T-B said:
I'm running a first gen i7 in my brothers rig at 4Ghz no delid. Then again, first gen i7s are soldered. I think the silicon will go before the solder does at this rate.

I agree

danbert2000 said:
"German computer magazine c't blamed the problem primarily on the use of the wrong type of lead-free solder, a type that when exposed to elevated temperatures for extended periods of time becomes brittle and can develop hair-line cracks that are almost irreparable"

https://en.wikipedia.org/wiki/Xbox_360_technical_problems#Causes

Oh man, in fighting against trolls you've become one. I have all the evidence on my side and all you have is a bad attitude.

That's solder used in a different use case ,and solder dries out, all of it does , eventually, but if soldered poorly electrical connections can deteriorate fast , but thats fixable sometimes via reflow , I've had jobs doing just that.
Soldered heatsink is purely for thermal not electric conductivity and you ares so wrong it hurts.

danbert2000 · Sep 22, 2017

theoneandonlymrk said:
That's solder used in a different use case ,and solder dries out, all of it does , eventually, but if soldered poorly electrical connections can deteriorate fast , but thats fixable sometimes via reflow , I've had jobs doing just that. Soldered heatsink is purely for thermal not electric conductivity and you ares so wrong it hurts.

Here, I think you missed this article I posted and we're all discussing. Maybe you want to actually read it this time. Why are you even bringing up electrical conductivity... The whole point is that cracking solder between the heatspreader and the processor will lead to hotspots on the processor and could kill it. I'd like to see you reflow the solder on a processor after the solder has begun to degrade.

http://overclocking.guide/the-truth-about-cpu-soldering/

System Name	The Ryzening
Processor	AMD Ryzen 9 5900X
Motherboard	MSI X570 MAG TOMAHAWK
Cooling	Lian Li Galahad 360mm AIO
Memory	32 GB G.Skill Trident Z F4-3733 (4x 8 GB)
Video Card(s)	Gigabyte RTX 3070 Ti
Storage	Boot: Transcend MTE220S 2TB, Kintson A2000 1TB, Seagate Firewolf Pro 14 TB
Display(s)	Acer Nitro VG270UP (1440p 144 Hz IPS)
Case	Lian Li O11DX Dynamic White
Audio Device(s)	iFi Audio Zen DAC
Power Supply	Seasonic Focus+ 750 W
Mouse	Cooler Master Masterkeys Lite L
Keyboard	Cooler Master Masterkeys Lite L
Software	Windows 10 x64

System Name	Baxter
Processor	Intel i7-5775C @ 4.2 GHz 1.35 V
Motherboard	ASRock Z97-E ITX/AC
Cooling	Scythe Big Shuriken 3 with Noctua NF-A12 fan
Memory	16 GB 2400 MHz CL11 HyperX Savage DDR3
Video Card(s)	EVGA RTX 2070 Super Black @ 1950 MHz
Storage	1 TB Sabrent Rocket 2242 NVMe SSD (boot), 500 GB Samsung 850 EVO, and 4TB Toshiba X300 7200 RPM HDD
Display(s)	Vizio P65-F1 4KTV (4k60 with HDR or 1080p120)
Case	Raijintek Ophion
Audio Device(s)	HDMI PCM 5.1, Vizio 5.1 surround sound
Power Supply	Corsair SF600 Platinum 600 W SFX PSU
Mouse	Logitech MX Master 2S
Keyboard	Logitech G613 and Microsoft Media Keyboard

Processor	Intel Core i3-8100
Motherboard	ASRock H370 Pro4
Cooling	Cryorig M9i
Memory	16GB G.Skill Aegis DDR4-2400
Video Card(s)	Gigabyte GeForce GTX 1060 WindForce OC 3GB
Storage	Crucial MX500 512GB SSD
Display(s)	Dell S2316M LCD
Case	Fractal Design Define R4 Black Pearl
Audio Device(s)	Realtek ALC892
Power Supply	Corsair CX600M
Mouse	Logitech M500
Keyboard	Lenovo KB1021 USB
Software	Windows 10 Professional x64

System Name	The Ryzening
Processor	AMD Ryzen 9 5900X
Motherboard	MSI X570 MAG TOMAHAWK
Cooling	Lian Li Galahad 360mm AIO
Memory	32 GB G.Skill Trident Z F4-3733 (4x 8 GB)
Video Card(s)	Gigabyte RTX 3070 Ti
Storage	Boot: Transcend MTE220S 2TB, Kintson A2000 1TB, Seagate Firewolf Pro 14 TB
Display(s)	Acer Nitro VG270UP (1440p 144 Hz IPS)
Case	Lian Li O11DX Dynamic White
Audio Device(s)	iFi Audio Zen DAC
Power Supply	Seasonic Focus+ 750 W
Mouse	Cooler Master Masterkeys Lite L
Keyboard	Cooler Master Masterkeys Lite L
Software	Windows 10 x64

Processor	AMD Ryzen 7 7800X3D
Motherboard	ASUS TUF x670e-Plus Wifi
Cooling	EK AIO 360. Phantek T30 fans.
Memory	32GB G.Skill 6000Mhz
Video Card(s)	Asus RTX 4090
Storage	WD/Samsung m.2's
Display(s)	LG C2 Evo OLED 42"
Case	Lian Li PC 011 Dynamic Evo
Audio Device(s)	Topping E70 DAC, SMSL SP200 Amp, Adam Audio T5V's, Hifiman Sundara's.
Power Supply	FSP Hydro Ti PRO 1000W
Mouse	Razer Basilisk V3 Pro
Keyboard	Epomaker 84 key
Software	Windows 11 Pro

Intel Core i7 8700K Reportedly Reaches 4.8 GHz Easily, 5 GHz+ Requires Delid

Raevenlord

News Editor

danbert2000

Static~Charge

Raevenlord

News Editor

erocker

*

kaellar

ZoneDymo

TheoneandonlyMrK

R-T-B

TheoneandonlyMrK

R-T-B

danbert2000

phanbuey

OSdevr

Vya Domus

danbert2000

Vya Domus

danbert2000

Vya Domus

danbert2000

phanbuey

Vya Domus

danbert2000

TheoneandonlyMrK

danbert2000

System Name	Cyberline
Processor	Intel Core i7 2600k -> 12600k
Motherboard	Asus P8P67 LE Rev 3.0 -> Gigabyte Z690 Auros Elite DDR4
Cooling	Tuniq Tower 120 -> Custom Watercoolingloop
Memory	Corsair (4x2) 8gb 1600mhz -> Crucial (8x2) 16gb 3600mhz
Video Card(s)	AMD RX480 -> RX7800XT
Storage	Samsung 750 Evo 250gb SSD + WD 1tb x 2 + WD 2tb -> 2tb MVMe SSD
Display(s)	Philips 32inch LPF5605H (television) -> Dell S3220DGF
Case	antec 600 -> Thermaltake Tenor HTCP case
Audio Device(s)	Focusrite 2i4 (USB)
Power Supply	Seasonic 620watt 80+ Platinum
Mouse	Elecom EX-G
Keyboard	Rapoo V700
Software	Windows 10 Pro 64bit

System Name	RyzenGtEvo/ Asus strix scar II
Processor	Amd R5 5900X/ Intel 8750H
Motherboard	Crosshair hero8 impact/Asus
Cooling	360EK extreme rad+ 360$EK slim all push, cpu ek suprim Gpu full cover all EK
Memory	Corsair Vengeance Rgb pro 3600cas14 16Gb in four sticks./16Gb/16GB
Video Card(s)	Powercolour RX7900XT Reference/Rtx 2060
Storage	Silicon power 2TB nvme/8Tb external/1Tb samsung Evo nvme 2Tb sata ssd/1Tb nvme
Display(s)	Samsung UAE28"850R 4k freesync.dell shiter
Case	Lianli 011 dynamic/strix scar2
Audio Device(s)	Xfi creative 7.1 on board ,Yamaha dts av setup, corsair void pro headset
Power Supply	corsair 1200Hxi/Asus stock
Mouse	Roccat Kova/ Logitech G wireless
Keyboard	Roccat Aimo 120
VR HMD	Oculus rift
Software	Win 10 Pro
Benchmark Scores	8726 vega 3dmark timespy/ laptop Timespy 6506

System Name	Pioneer
Processor	Ryzen R9 9950X
Motherboard	GIGABYTE Aorus Elite X670 AX
Cooling	Noctua NH-D15 + A whole lotta Sunon and Corsair Maglev blower fans...
Memory	64GB (4x 16GB) G.Skill Flare X5 @ DDR5-6000 CL30
Video Card(s)	XFX RX 7900 XTX Speedster Merc 310
Storage	Intel 5800X Optane 800GB boot, +2x Crucial P5 Plus 2TB PCIe 4.0 NVMe SSDs
Display(s)	55" LG 55" B9 OLED 4K Display
Case	Thermaltake Core X31
Audio Device(s)	TOSLINK->Schiit Modi MB->Asgard 2 DAC Amp->AKG Pro K712 Headphones or HDMI->B9 OLED
Power Supply	FSP Hydro Ti Pro 850W
Mouse	Logitech G305 Lightspeed Wireless
Keyboard	WASD Code v3 with Cherry Green keyswitches + PBT DS keycaps
Software	Gentoo Linux x64 / Windows 11 Enterprise IoT 2024

System Name	stress-less
Processor	9800X3D @ 5.42GHZ
Motherboard	MSI PRO B650M-A Wifi
Cooling	Thermalright Phantom Spirit EVO
Memory	64GB DDR5 6400 1:1 CL30-36-36-76 FCLK 2200
Video Card(s)	RTX 4090 FE
Storage	2TB WD SN850, 4TB WD SN850X
Display(s)	Alienware 32" 4k 240hz OLED
Case	Jonsbo Z20
Audio Device(s)	Yes
Power Supply	Corsair SF750
Mouse	DeathadderV2 X Hyperspeed
Keyboard	65% HE Keyboard
Software	Windows 11
Benchmark Scores	They're pretty good, nothing crazy.

Processor	Threadripper 1950X
Motherboard	ASRock X399 Professional Gaming
Cooling	IceGiant ProSiphon Elite
Memory	48GB DDR4 2934MHz
Video Card(s)	MSI GTX 1080
Storage	4TB Crucial P3 Plus NVMe, 1TB Samsung 980 NVMe, 1TB Inland NVMe, 2TB Western Digital HDD
Display(s)	2x 4K60
Power Supply	Cooler Master Silent Pro M (1000W)
Mouse	Corsair Ironclaw Wireless
Keyboard	Corsair K70 MK.2
VR HMD	HTC Vive Pro
Software	Windows 10, QubesOS

System Name	Good enough
Processor	AMD Ryzen R9 7900 - Alphacool Eisblock XPX Aurora Edge
Motherboard	ASRock B650 Pro RS
Cooling	2x 360mm NexXxoS ST30 X-Flow, 1x 360mm NexXxoS ST30, 1x 240mm NexXxoS ST30
Memory	32GB - FURY Beast RGB 5600 Mhz
Video Card(s)	Sapphire RX 7900 XT - Alphacool Eisblock Aurora
Storage	1x Kingston KC3000 1TB 1x Kingston A2000 1TB, 1x Samsung 850 EVO 250GB , 1x Samsung 860 EVO 500GB
Display(s)	LG UltraGear 32GN650-B + 4K Samsung TV
Case	Phanteks NV7
Power Supply	GPS-750C