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TSMC Begins Experimenting with Rectangular Panel-Like Chip Packaging

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Feb 20, 2019
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System Name Bragging Rights
Processor Atom Z3735F 1.33GHz
Motherboard It has no markings but it's green
Cooling No, it's a 2.2W processor
Memory 2GB DDR3L-1333
Video Card(s) Gen7 Intel HD (4EU @ 311MHz)
Storage 32GB eMMC and 128GB Sandisk Extreme U3
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Case Veddha T2
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Power Supply Samsung 18W 5V fast-charger
Mouse MX Anywhere 2
Keyboard Logitech MX Keys (not Cherry MX at all)
VR HMD Samsung Oddyssey, not that I'd plug it into this though....
Software W10 21H1, barely
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I'm pretty certain this news item is about packaging alone - making interposers in particular. ie: The rectangular wafers are not for making dies.
Yeah, that's how I interpret it too.

The actual die wafers are still going to be round, because they're sliced pure silicon crystals. You don't get to choose the shape of the crystals, that's predetermined by the polarity and bond arrangement of silicon atoms.
 
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