- Joined
- Feb 20, 2019
- Messages
- 8,339 (3.91/day)
System Name | Bragging Rights |
---|---|
Processor | Atom Z3735F 1.33GHz |
Motherboard | It has no markings but it's green |
Cooling | No, it's a 2.2W processor |
Memory | 2GB DDR3L-1333 |
Video Card(s) | Gen7 Intel HD (4EU @ 311MHz) |
Storage | 32GB eMMC and 128GB Sandisk Extreme U3 |
Display(s) | 10" IPS 1280x800 60Hz |
Case | Veddha T2 |
Audio Device(s) | Apparently, yes |
Power Supply | Samsung 18W 5V fast-charger |
Mouse | MX Anywhere 2 |
Keyboard | Logitech MX Keys (not Cherry MX at all) |
VR HMD | Samsung Oddyssey, not that I'd plug it into this though.... |
Software | W10 21H1, barely |
Benchmark Scores | I once clocked a Celeron-300A to 564MHz on an Abit BE6 and it scored over 9000. |
Yeah, that's how I interpret it too.I'm pretty certain this news item is about packaging alone - making interposers in particular. ie: The rectangular wafers are not for making dies.
The actual die wafers are still going to be round, because they're sliced pure silicon crystals. You don't get to choose the shape of the crystals, that's predetermined by the polarity and bond arrangement of silicon atoms.