Team Group Unveils CAMM2 DDR5 Memory Modules at 7200 and 6400 MHz

[Nomad76]

In actively verifying its next-generation CAMM2 (Compression Attached Memory Module 2) memory modules, global memory leader Team Group Inc. today announced two specifications: consumer-grade CAMM2 DDR5 7200 MHz and industrial-grade CAMM2 DDR5 6400 MHz. These new products provide expanded options for the memory market, delivering faster data transfer speeds, enhanced performance, and greater user flexibility.

The consumer-grade CAMM2 memory from Team Group operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking, delivering exceptional performance. Compared to the default JEDEC specification, the module offers write, copy, and read speeds of up to 108,000 MB/s, 106,000 MB/s, and 117,000 MB/s, respectively, while reducing overall latency to 55ns. The module delivers smoother performance when running large applications, gaming, or multitasking. The potential to achieve ultra-high frequencies of 8000-9000 MHz in the future further underscores its superior capabilities. In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory, optimized for DDR5 6400 MHz, which is designed for industrial control, edge computing, and AI applications, providing robust support for high-performance computing and real-time data processing. The module will play a critical role in the development of technologies such as smart manufacturing, autonomous driving, and smart cities by improving both performance and reliability.



Compared to traditional SO-DIMM, U-DIMM, and R-DIMM memory, CAMM2 introduces a breakthrough design with several distinct advantages. It supports dual-channel mode with a single memory module, simplifying system architecture and significantly reducing power consumption. With an integrated CKD (Client Clock Driver) for improved signal integrity, CAMM2 memory is smaller and ideal for thin and light notebooks. Its improved thermal design allows for greater heat dissipation efficiency, unlocking more potential in a compact space. CAMM2 memory surpasses previous standards in overclocking, read speed, and latency, delivering an exceptionally smooth user experience. Through rigorous testing, Team Group has maximized the capabilities of CAMM2 to create endless possibilities for the memory market.

Team Group will continue to invest in CAMM2 technology, advancing both consumer and industrial specifications to deliver high-performance, reliable memory solutions. The Team Group CAMM2 memory series is expected to be released in Q1 2025, bringing a new experience to consumer PCs and industrial applications. Stay tuned to Team Group's official website and social media channels for the latest news.

The following screenshots are from a burn-in using the Intel i9-14900K processor with the Z790 PROJECT ZERO (CAMM2) motherboard. This test environment used an Intel i9-14900K processor paired with the Z790 PROJECT ZERO (CAMM2) motherboard.



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[Metroid]

Looking good.

 

[Chaitanya]

What systems use these?

 

[TheLostSwede]

What systems use these?

All the motherboard makers have internal test boards...

 

[lexluthermiester]

All the motherboard makers have internal test boards...

Let's hope they toss them in the garbage where they belong.

 

[TumbleGeorge]

operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking

Catch up!

 

[Vincero]

What systems use these?

Laptops initially...
Desktops eventually...

Servers probably never... at least not any that may feature hot swapping RAM

 

[Chaitanya]

Laptops initially...
Desktops eventually...

Servers probably never... at least not any that may feature hot swapping RAM

There are no laptops currently that support CAMM2 or LPCAMM2 hell both AMD and Intel have killed support for any kind of replaceble RAM on their latest mobile platforms.

All the motherboard makers have internal test boards...

Given these are labelled for industrial use, havent seen any industrial PCs that come with CAMM2 or LPCAMM support so far.

 

[TheLostSwede]

Laptops initially...

Laptops aren't likely to use DDR5 CAMM2, but rather LPCAMM2.

LPDDR6 LPCAMM2 Pictured and Detailed Courtesy of JEDEC

Yesterday we reported on DDR6 memory hitting new heights of performance and it looks like LPDDR6 will follow suit, at least based on details in a JEDEC presentation. LPDDR6 will just like LPDDR5 be available as solder down memory, but it will also be available in a new LPCAMM2 module. The bus...

www.techpowerup.com

There are no laptops currently that support CAMM2 or LPCAMM2 hell both AMD and Intel have killed support for any kind of replaceble RAM on their latest mobile platforms.

Lenovo has a workstation laptop that does.

Lenovo Unveils Its New AI-Ready ThinkPad P1 Gen 7 Mobile Workstation

Today, Lenovo launched its latest mobile workstation offerings meticulously crafted to deliver the exceptional power and performance essential for handling complex workloads. Lenovo's ThinkPad P1 Gen 7, P16v i Gen 2, P16s i Gen 3, and P14s i Gen 5, with their cutting-edge AI technologies, are...

www.techpowerup.com

Dell also have some that supports their original CAMM modules.

Also, why does AMD or Intel have to support CAMM2/LPCAMM2? It's just a difference way of adding the DRAM to the system, it's still DDR5 or LPDD5/X, it's just the physical attachment that differs.

Given these are labelled for industrial use, havent seen any industrial PCs that come with CAMM2 or LPCAMM support so far.

Chicken, egg.

 

[Vincero]

Laptops aren't likely to use DDR5 CAMM2, but rather LPCAMM2.

LPDDR6 LPCAMM2 Pictured and Detailed Courtesy of JEDEC

Yesterday we reported on DDR6 memory hitting new heights of performance and it looks like LPDDR6 will follow suit, at least based on details in a JEDEC presentation. LPDDR6 will just like LPDDR5 be available as solder down memory, but it will also be available in a new LPCAMM2 module. The bus...

www.techpowerup.com

Most no... but going forward any DTR style or 'gaming' / workstation laptops are less likely to use SODIMM and move to CAMM2, and more likely DDR5/6 standard if they are using higher TDP / desktop shared SoC CPUs (although the shared IMC designs will likely work with either LP or normal DDR)...

Conjecture of course... but there are a few who will want a laptop with 64GB+ of RAM that isn't gonna be soldered to CPU package.

Given these are labelled for industrial use, havent seen any industrial PCs that come with CAMM2 or LPCAMM support so far.

That's not quite what the article states - "In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory" - and what they define as industrial points towards some edge cases with 'edge' computing devices, as well as the more traditional industrial PC.

 

[Tigerfox]

I still wan't to see measurements regarding the space efficiency of CAMM2. The Type C and Type A DC-modules with just 40mm width may be smaller than four DIMM-sockets, but they are 32GB (Type C) and 128GB (Type A) max atm.
For larger sizes, you either have to use Type B DC-modules (68mm width, 256GB max) or two stacked Type D SC modules (256GB max and 57mm each, stacked 512GB and likely 68mm as well).
MSI's Z790 Project Zero Plus-demonstration board used a Type A-module, but had cleared the space in front of it up to the margin of the board for larger modules. This space would normally be used for power connectors, USB-headers, onboard buttons or components.

 

[Vincero]

I still wan't to see measurements regarding the space efficiency of CAMM2. The Type C and Type A DC-modules with just 40mm width may be smaller than four DIMM-sockets, but they are 32GB (Type C) and 128GB (Type A) max atm.
For larger sizes, you either have to use Type B DC-modules (68mm width, 256GB max) or two stacked Type D SC modules (256GB max and 57mm each, stacked 512GB and likely 68mm as well).
MSI's Z790 Project Zero Plus-demonstration board used a Type A-module, but had cleared the space in front of it up to the margin of the board for larger modules. This space would normally be used for power connectors, USB-headers, onboard buttons or components.

The other key advantage is placing the RAM closer to the CPU (good electrically / signal quality) and due to the lower profile it would be much less likely to interfere with CPU coolers, regardless how big the module is in terms of width/depth - stacked arrangements might be an issue - downdraft coolers (such as the Intel/AMD stock) would also spread air over the module a bit more effectively vs a group of upright DIMMs.

 

[Chrispy_]

Chicken, egg.

Yeah. This is the egg, so we need to wait for the chicken and hope that nothing smashes the egg before it hatches.

CAMM and CAMM2 solve some of the problems with SoDIMM slots, which laptop vendors do actually like since they can offer multiple configurations from the same production run, rather than having to split production runs into different RAM size variants.

Hopefully we start to see CAMM2 laptops instead of soldered-RAM laptops in the next year.

The other key advantage is placing the RAM closer to the CPU (good electrically / signal quality)

This. CAMM wasn't particularly about space saving - IIRC the CAMM modules take up more PCB area than a SoDIMM as a trade-off for being lower-profile.

Like you say, the primary reason for CAMM was to reduce the trace length to the CPU's memory controller which is why you won't find upgradeable laptops supporting DDR5 speeds much beyond 5200.

 

[trsttte]

What systems use these?

MSI is already selling a motherboard using these and as mentioned above there's several laptops with CAMM and LPCAMM

I still wan't to see measurements regarding the space efficiency of CAMM2. The Type C and Type A DC-modules with just 40mm width may be smaller than four DIMM-sockets, but they are 32GB (Type C) and 128GB (Type A) max atm.

CAMM wasn't particularly about space saving - IIRC the CAMM modules take up more PCB area than a SoDIMM as a trade-off for being lower-profile.

This is where they fucked up designing the new standard, they went with 4 different possible sizes instead of using just one or two. LPCAMM2 got this right, there's only 1 size available, it only goes up to 64gb for now but you only get one type of module to design around and there's no market fragmentation supporting different module types.

If they don't do this for CAMM2 as well I don't see it gaining any traction. They can use dual sided modules and more of them to increase capacity instead of using 4 different size types.

 

[rv8000]

Glad to see there’s still zero improvement demonstrated in the desktop space. Meanwhile we now have cu-dimms doing 12ghz in bench runs and close to 10ghz in non exotic scenarios. Good thing companies effectively spent all that R&D money on non-existent consumer boards that have only served to change the form factor of memory and offer potentially nothing but increasing buy in for a non standard shit show of different camm variants.

 

[lexluthermiester]

Glad to see there’s still zero improvement demonstrated in the desktop space. Meanwhile we now have cu-dimms doing 12ghz in bench runs and close to 10ghz in non exotic scenarios. Good thing companies effectively spent all that R&D money on non-existent consumer boards that have only served to change the form factor of memory and offer potentially nothing but increasing buy in for a non standard shit show of different camm variants.

Right? Complete waste of time for something that is showing to be as useful as an anchor to drowning person.

 

[Tigerfox]

MSI is already selling a motherboard using these and as mentioned above there's several laptops with CAMM and LPCAMM

MSI is not selling any motterboard using CAMM2 yet, the Z790 was just for demonstration and the Z890 one hasn't been released yet. There is just one mobile workstation from Lenovo (Thinkbook P1 G7) using LPCAMM2 and four from Dell using the original CAMM (Precision 7670, 7680, 7770 and 7780).

This is where they fucked up designing the new standard, they went with 4 different possible sizes instead of using just one or two. LPCAMM2 got this right, there's only 1 size available, it only goes up to 64gb for now but you only get one type of module to design around and there's no market fragmentation supporting different module types.

If they don't do this for CAMM2 as well I don't see it gaining any traction. They can use dual sided modules and more of them to increase capacity instead of using 4 different size types.

It's three sizes, actually. Type A and C seem to be similar in design, type C is just type A only with the upper side half empty. I suspect type D stacked will be the same lenght as type B, but obviously higher.

It really is technical necessity. Type A with 40mm length like the one Teamgroup has released seems to be intended as mainstream module and has been used in all showcases, but limited space dictates that it can't offer the same maximum amount of memory as four DIMMs do (128GB against 4x48=192GB with UDIMMs ord 4x128=512GB with RDIMMs atm). For that you need at least the longer type B (256GB) and type D stacked allows even for double that amount. I would have suspected that type B and D were intended for HEDT, WS and Servers only but since all demonstration boards until now had the space in front of the type A CAMM2 cleared, we can expect type B and D modules for consumers, too. But I suspect high clock modules will mostly be type A and frankly, 128GB max (possibly 192GB in the future) is more than enough for mainstream for a long time.

LP(5)CAMM2 is something different entirely and to me is the more important one but sadly hasn't gotten enough traction until now. As I understand, going beyond DDR5-5600 with SO-DIMMs and 6400 with CSO-DIMMs will be very difficult if not impossible, and right now less and less notebooks even use SO-DIMMs because highspeed LPDDR5X with 7.500-8.500MT/s and more coming really offers more performance. LPCAMM2 seems to be the only way to make RAM still replacable in mobile devices while offering the same speed soldered LPDDR does. And for me, that's very important. I'm very frustrated that all laptops with Ryzen AI 300 shown so far stick to LPDDR5X.

Glad to see there’s still zero improvement demonstrated in the desktop space. Meanwhile we now have cu-dimms doing 12ghz in bench runs and close to 10ghz in non exotic scenarios. Good thing companies effectively spent all that R&D money on non-existent consumer boards that have only served to change the form factor of memory and offer potentially nothing but increasing buy in for a non standard shit show of different camm variants.

As I understand, CAMM2 already has the same onboard clockdriver CU-DIMM uses and still offers the benefits of shorter traces, thus lower latancies, even higher clockrates in the future, easier cooling and less intrusion into the CPU-cooler. CU-DIMM is only the last evolution of old DIMM.

 

[trsttte]

It really is technical necessity. Type A with 40mm length like the one Teamgroup has released seems to be intended as mainstream module and has been used in all showcases, but limited space dictates that it can't offer the same maximum amount of memory as four DIMMs do (128GB against 4x48=192GB with UDIMMs ord 4x128=512GB with RDIMMs atm). For that you need at least the longer type B (256GB) and type D stacked allows even for double that amount. I would have suspected that type B and D were intended for HEDT, WS and Servers only but since all demonstration boards until now had the space in front of the type A CAMM2 cleared, we can expect type B and D modules for consumers, too. But I suspect high clock modules will mostly be type A and frankly, 128GB max (possibly 192GB in the future) is more than enough for mainstream for a long time.

I wouldn't say technical necessity as much as manufacturers wanting to be able to still offer low ammounts of RAM without big empty modules. I would have preferred to just have type B modules and that's it. Want to be super cheap and waste all that space? Have at it, but it's a single module everyone can use. Stacked modules seem to offer more problems than it's worth having so I suspect no one will want to use them. Even a large workstation that wants to give that large ammount of memory could instead just use 2 type B modules that are simpler to design and implement.

LP(5)CAMM2 is something different entirely and to me is the more important one but sadly hasn't gotten enough traction until now. As I understand, going beyond DDR5-5600 with SO-DIMMs and 6400 with CSO-DIMMs will be very difficult if not impossible, and right now less and less notebooks even use SO-DIMMs because highspeed LPDDR5X with 7.500-8.500MT/s and more coming really offers more performance. LPCAMM2 seems to be the only way to make RAM still replacable in mobile devices while offering the same speed soldered LPDDR does. And for me, that's very important. I'm very frustrated that all laptops with Ryzen AI 300 shown so far stick to LPDDR5X.

Ryzen AI 300 using LPDDR5x doesn't need to be a problem if manufacturers use LPCAMM2.

There are many advantages to using LPDDR5/LPDDR5x and LPCAMM2 solves the major upgradability problem. We wouldn't even need CAMM2 laptops with 128gb LPCAMM2 modules on the roadmap, put two of them together and you get a 256gb monster workstation. I suspect that might be the plan for Strix Halo (Ryzen AI Max - damn these stupid names) that allegedly has a 256b memory bus.

 

[Tigerfox]

Ryzen AI 300 using LPDDR5x doesn't need to be a problem if manufacturers use LPCAMM2.

But it seems they won't use LPCAMM2 right now and everything will be soldered down.

 

[rv8000]

MSI is not selling any motterboard using CAMM2 yet, the Z790 was just for demonstration and the Z890 one hasn't been released yet. There is just one mobile workstation from Lenovo (Thinkbook P1 G7) using LPCAMM2 and four from Dell using the original CAMM (Precision 7670, 7680, 7770 and 7780).

It's three sizes, actually. Type A and C seem to be similar in design, type C is just type A only with the upper side half empty. I suspect type D stacked will be the same lenght as type B, but obviously higher.

It really is technical necessity. Type A with 40mm length like the one Teamgroup has released seems to be intended as mainstream module and has been used in all showcases, but limited space dictates that it can't offer the same maximum amount of memory as four DIMMs do (128GB against 4x48=192GB with UDIMMs ord 4x128=512GB with RDIMMs atm). For that you need at least the longer type B (256GB) and type D stacked allows even for double that amount. I would have suspected that type B and D were intended for HEDT, WS and Servers only but since all demonstration boards until now had the space in front of the type A CAMM2 cleared, we can expect type B and D modules for consumers, too. But I suspect high clock modules will mostly be type A and frankly, 128GB max (possibly 192GB in the future) is more than enough for mainstream for a long time.

LP(5)CAMM2 is something different entirely and to me is the more important one but sadly hasn't gotten enough traction until now. As I understand, going beyond DDR5-5600 with SO-DIMMs and 6400 with CSO-DIMMs will be very difficult if not impossible, and right now less and less notebooks even use SO-DIMMs because highspeed LPDDR5X with 7.500-8.500MT/s and more coming really offers more performance. LPCAMM2 seems to be the only way to make RAM still replacable in mobile devices while offering the same speed soldered LPDDR does. And for me, that's very important. I'm very frustrated that all laptops with Ryzen AI 300 shown so far stick to LPDDR5X.


As I understand, CAMM2 already has the same onboard clockdriver CU-DIMM uses and still offers the benefits of shorter traces, thus lower latancies, even higher clockrates in the future, easier cooling and less intrusion into the CPU-cooler. CU-DIMM is only the last evolution of old DIMM.

Except cu-dimm is here, and while it does require support it doesn’t require form factor changes and can be used in bypass mode as standard ram. Also offering higher speed and lower latency already. I’ve seen zero proof of improvements on the consumer desktop end for camm and its umptine variants; it’s a pointless endeavor on the desktop end.

What also makes zero sense from a non-technical standpoint, is if the effective channels have staggered ic’s on the camm pcb, isn’t access to different ic’s on the pcb itself going to nullify any benefit from “shorter trace length” bs (the camm implementation on unavailable consumer boards don’t even have the actual camm socket remotely closer to the socket itself)?

I see little value in pursuing it tbh. If it were truly that much better we wouldve seen actual implementation in the desktop space before cu-dimms hit the market.

This one belongs in the trashcan for desktops imo.

 

[net2007]

No mention of capicity.

 

[Divide Overflow]

Memory compression? Pffft! Just download more RAM!