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Sure, but I guess AMD also has to figure out how to cool such a chip. Why shouldn't all the after market cooler manufacturers be able to do the same? Also since when could you reuse an already existing GPU water cooler for a new generation of graphics cards (except maybe GTX 670 -> 970)? If so, than this is more a coincidence than intention.
If the rumors about this thing's TDP (about the same as the 290X) pan out to be true, cooling it will not be a problem. Manufacturer-specific custom coolers, such as Sapphire's TriX or VaporX coolers will be quite sufficient, even for overclocking, and will most likely stay pretty quiet too. Now factor in the water-cooled version, which is pretty much the same one that's on the 295X2 (except it has a single waterblock+pump assembly), it should be far more than adequate for anything you may want to do with this thing (record breakers will always use the fancier stuff, anyways).
Well, I suppose it all depends on the waterblock. Full-cover versions are indeed model specific, but waterblocks that only cover the GPU can be fitted on multiple cards, provided the retention system can either cope with the task or be modified or replaced easily.
What exactly are you referring to? I mean a precisely manufactured cooler surface incorporating the different heights of the chips areas isn't exactly easy to produce and even more complicated to assemble, let alone the costs of all this precision machining. Without an IHS to equally distribute the pressure from the retention system, you'd have to be very precise (read: single-digit µm range) to avoid destroying the GPU die or a HBM stack.
Anyways, this leads me to believe that either there will be an IHS with a flat surface towards the cooler or all the components on the GPU package (HBM an GPU die itself) will have the same height.
No, no, no, you got it all wrong. You don't need to fit the base on the HBM stacks as tightly as you would on the GPU itself. It's far more likely that they'd just "make a hole" where the HBM stacks are positioned and use ye olde thermal pads to cool them (you know, the same stuff they're currently using on memory chips). It should be enough to keep the HBM stacks cool and wouldn't require anywhere near the precision you're talking about. You also wouldn't need to worry about pressure distribution. It would be handled by the GPU and package frame, like before, since a lot less of it would actually rest on the HBM stacks (those pads are pretty soft, the pressure exerted on the HBM stacks would be either minimal, or a whole helluva lot less than the GPU has to cope with. They're probably going to use some sort of backplate because of the sheer size of the package itself, but that's about it.
No need for any sort of IHS whatsoever, or for all of the components on the GPU package (as you put it) to be of the same height. They'll (AMD) just need to make sure they leave enough room open for the heatpipes to pass through (between the HBM stacks), and that's all that would be necessary to fit current cooling systems with only minor modifications (basically, just the holes for the HBM stacks and a large enough retention system). Nothing more, nothing less.