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AMD X570S Motherboard Spotted Alongside Ryzen 7 5700G APU

AleksandarK

AleksandarK

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AMD seems to be preparing a chipset refresh, and this time, it is coming straight from the top-end market. When the company launched its high-end X570 chipset, it brought the PCIe 4.0 support, which many praised due to its capability to handle much faster NVMe drives. However, it seems like the company is not satisfied with that and it needs to release an updated chipset version called X570S. According to a popular hardware leaker, TUM_APISAK, we have discovered that GIGABYTE is preparing X570S Aorus Pro AX motherboard that will use the refreshed chipset. GIGABYTE already listed several Eurasian Economic Commission (EEC) listings, so the new chipset is sure to hit the market, just at an unknown time.

The S denotes the word silent, meaning that these updated chipsets are capable of working with passive cooling and possibly having a lower TDP compared to 11 and 15 Watts of the X570 chipsets for consumer and enterprise motherboards, respectively. The test was conducted using AMD's newly announced Ryzen 7 5700G processor. The 5000-series of APUs are so far limited to OEMs, so one would guess that GIGABYTE itself made the leak by using a public entry of CPU-Z validation.


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Neat more motherboards to look at while no one can buy a GPU until 2023 according to TSMC. lol
 
In won't bother with this new chipset. Considering that AM4 is probably in its final year of lifespan, there is little reason to buy a motherboard with a "new" flagship chipset. Moreover, this may make the older chipset slightly cheaper. Despite the need for active cooling, I don't think its a deal breaker.
 
lynx29 said:
Neat more motherboards to look at while no one can buy a GPU until 2023 according to TSMC. lol
Click to expand...
What does gpu shortage means for motherboards?
 
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It's a refresh of tsmc's node. The increased power draw of the normal 570 is only caused when you attach 2 or more NVME SSD's; it's due to the power being routed through the chipset compared the 470 chipset.

If you use one ssd your not even going to need the fan at all. All this fuss on the internet about fans.
 
Uhm, this isn't a new chipset though, it's Gigabyte's fanless SKUs...
 
Is it really a new chipset (like a die shrink with lower power consumption) or just gigabyte slapping big heatsinks on them and calling them silent?
 
I need to see it in a real review before I'm convinced that it's not just a B550 re-brand, or just a binned/undervolted/downclocked X570 chipset.

I want to believe that it's a genuinely new product made to be more efficient but the X570 chipset is just the IO die from Zen2/Zen3 repurposed as a motherboard chipset. There's no new variant of the IO die for Zen3 MCM products, so it seems odd that there's a new variant for motherboard chipsets, no?

We all remember the B550A crap, right? OEM stuff like this is often just marketing lies and that's why it stays OEM, not designed to be launched as an official retail product open to independent reviews on launch day.
 
One thing that wasn't mentioned is that the APU used has integrated graphics and the chipset would need to also support that.
 
Jism said:
It's a refresh of tsmc's node. The increased power draw of the normal 570 is only caused when you attach 2 or more NVME SSD's; it's due to the power being routed through the chipset compared the 470 chipset.

If you use one ssd your not even going to need the fan at all. All this fuss on the internet about fans.
Click to expand...
Well.. for starters x570 was not TSMC so I kinda doubt they would move to TSMC given TSMC can't keep up with demand as it stands, let alone produce extra chips for AMD's motherboards..
 
A change from GloFo 14 to TSMC 12 or 7 seems unlikely, given TSMC is booked up as far as 2022 right now.
GloFo, meanwhile, are offering rock-bottom pricing and have capacity to spare.

I'm not saying it's impossible, just unlikely - and that I'm sure it would be bigger news, not something I'm hearing about via a forum member without at least a link to a leak or press release.
Far more importantly, AMD and GloFo are still tied together under a wafer supply agreement, and that continues throughout 2021, last I read. AMD would be shooting themselves in the foot as they already underuse GloFo and pay them a fee for that transgression. Moving even more product away from TSMC would just increase this fee as part of the WSA.
 
I wonder if the refresh will come with Wifi 6/BT 5.2 or dual 2.5GB LAN ports.
 
If this bring a new selection of quality mATX x570 motherboards, then bring it on!
 
Jism said:
It's a refresh of tsmc's node. The increased power draw of the normal 570 is only caused when you attach 2 or more NVME SSD's; it's due to the power being routed through the chipset compared the 470 chipset.

If you use one ssd your not even going to need the fan at all. All this fuss on the internet about fans.
Click to expand...
Fans that are mostly useless because 99% of the time a silent heatsink is going to run cooler, quieter, and without the failing bearings that accompany small fans. The fans on the X570 were pointless, expensive, and a failure point that need not exist.

But you know, its just a fuss. Just accept the failure prone tiny fans and design flaws, consoomer.
 
TheinsanegamerN said:
Fans that are mostly useless because 99% of the time a silent heatsink is going to run cooler, quieter, and without the failing bearings that accompany small fans. The fans on the X570 were pointless, expensive, and a failure point that need not exist.

But you know, its just a fuss. Just accept the failure prone tiny fans and design flaws, consoomer.
Click to expand...
As much as I hate them the X570 chipset uses up to 17W I think. That's a non-trivial amount to cool passively when there's so little height to play with around the chipset area on most boards.

The puny little 50x50x8mm heatsinks that vendors like to cheap out on won't cut it, so they just added a cheap fan instead. When (not if) my X570 fan fails, I'll be going fanless by just epoxying on a 60x100x10mm heatsink with three times the surface area and getting creative with a dremel if there are PCB components in the way.

I'm only using a single PCIe 4.0 device and two PCIe 3.0 devices, and if the passive heatsink doesn't cut it I really don't think my GPU will care if I drop it down to PCIe 3.0.
 
Bork Bork said:
I wonder if the refresh will come with Wifi 6/BT 5.2 or dual 2.5GB LAN ports.
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Chipset has nothing to do with implementation of newest wifi or bluetooth. You can always upgrade to wifi 6 / bluetooth 5.2 by buying a newest wifi/bluetooth card
 
night.fox said:
Chipset has nothing to do with implementation of newest wifi or bluetooth. You can always upgrade to wifi 6 / bluetooth 5.2 by buying a newest wifi/bluetooth card
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I would love to use my 300 iq move and defacto remove the one that is built into the X570-E. But that's not exactly a 30 second job now is it? Instead I should buy a separate addon-card and not hope that the vendor provides it for me just like it did before because that's not obviously the logical choice now is it?
 
robert3892 said:
One thing that wasn't mentioned is that the APU used has integrated graphics and the chipset would need to also support that.
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It doesn't work like that. The chipset is just for connecting all the additional IO, it doesn't interact with the GPU in the APU.
 
Oh no, my new PC is only a week old and already outdated. Anyway it was expected there'd be a chipset refresh for Zen3+. My second PC will need an upgrade next year, but I'm waiting for X670, Zen4(+) and RDNA3/RTX4000.
 
Bork Bork said:
I would love to use my 300 iq move and defacto remove the one that is built into the X570-E. But that's not exactly a 30 second job now is it? Instead I should buy a separate addon-card and not hope that the vendor provides it for me just like it did before because that's not obviously the logical choice now is it?
Click to expand...
Eh.... What?
 
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