- Joined
- May 30, 2018
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- 1,890 (0.79/day)
- Location
- Cusp Of Mania, FL
Processor | Ryzen 9 3900X |
---|---|
Motherboard | Asus ROG Strix X370-F |
Cooling | Dark Rock 4, 3x Corsair ML140 front intake, 1x rear exhaust |
Memory | 2x8GB TridentZ RGB [3600Mhz CL16] |
Video Card(s) | EVGA 3060ti FTW3 Ultra Gaming |
Storage | 970 EVO 500GB nvme, 860 EVO 250GB SATA, Seagate Barracuda 1TB + 4TB HDDs |
Display(s) | 27" MSI G27C4 FHD 165hz |
Case | NZXT H710 |
Audio Device(s) | Modi Multibit, Vali 2, Shortest Way 51+ - LSR 305's, Focal Clear, HD6xx, HE5xx, LCD-2 Classic |
Power Supply | Corsair RM650x v2 |
Mouse | iunno whatever cheap crap logitech *clutches Xbox 360 controller security blanket* |
Keyboard | HyperX Alloy Pro |
Software | Windows 10 Pro |
Benchmark Scores | ask your mother |
Forget the logical stuff. I'm stuck on solid copper rear side panels now.
I want a coolant-dispersing manifold integrated into the inner face of the rear side panel. Pill-shape contour for the tubing would be better for spread, though far worse for flow. Squish round tubing semi-flat to get the picture. That's snaking as tightly as physically possible up and down the whole inner face of the panel. It can be modular, with scattered ports for super short in/out runs to different components across the mobo. Tubing pops right out of the back at the closest possible point to each block right from the passive radiator reservoir manifold that is the whole back panel. Full copper blocks for your vrms and ram. You know the tubing is copper and the connectors are copper-plated. Better just go for the matte black silicon and let all of the copper sing the rest.
Basically what you then have is a full mobo block flipped inside out, passively cooling your liquid via the case itself with nothing extra covering up the components inside. And probably the best coolant temperatures ever.
The idea is that the coolant contacts as much surface on the panel as possible. That's also your res. Imagine how much coolant a side-panel's worth of tubing holds, right? How bout that? Might need some extra push to get the coolant to go through it. Lets stack impellers where a full size res *would* be in a normal loop to be safe. Case height hand-engraved copper monolith for the housing on the pump stack with an internal gap to make room for some sound insulation. And then maybe it goes to a wall of rads on the front side panel to handle whatever heat is left by the panel.
How's that for logical? It's like if a laptop cooler made a pact with The God Hand, became the next Apostle, and took the corporeal form of a whole-ass liquid-cooled hybrid passive/active radiator case made out of fine polished copper.
Lets go further and try to eliminate the rads completely, have an unobstructed view of that clean layout. Can we make the partition that the mobo mounts onto a 'coarse' copper mesh? And can we then mount two oversized fans stretching the entire span of that partition, blowing from front compartment to rear? And can we get them *just* far back enough from the rear side panel to send the air across the whole manifold and then directly out through a generous mesh strip running along the top, bottom, front and back of the rear compartment this forms? Can we maybe get fins on the tubing of the integrated manifold to assist transfer?
Somewhere in the case, there will need to be a sizeable passive air intake for the fans to draw from. It's kinda okay if it's bottlenecking the fans just a little bit - potentially more stable flow when the max resistance is at entry. Only problem would be potential resonance through the intake. Could always mesh the top out as well if we need more intake. It's intrinsically negative pressure, but we'll go the extra mile to seal it and filter that intake. All of the removable panels clamp into place to seat some nice fat seals into matching grooves. Maybe the whole bottom of the visible compartment is your intake mesh. Maybe have some blockage across the bottom couple inches of the meshed mobo partition to linearize the flow path a bit more. Or do solid trim around the edges of the mobo partition to separate all of the outlet-side compartment's exhaust. The mobo will have to stand further off to let the air through the mesh, and you'd want taller feet too. But nobody said this thing has to be practical. Honestly, if we're making it out of expensive copper sheeting, we can afford to make it as big as it needs to be. Lian Li style partitioning with the spacious back panel hiding integrated manifold, fans, and tubing with plenty of space for airflow. Like, maybe even wide enough in the back to stand an ATX psu on its side.
I mean... at this point, make the OUTSIDE of that back panel a full passive radiator with a full-span fin array. Because why not?
Can I maybe convince a youtuber to try this for educational purposes? Hrmmm...
I want a coolant-dispersing manifold integrated into the inner face of the rear side panel. Pill-shape contour for the tubing would be better for spread, though far worse for flow. Squish round tubing semi-flat to get the picture. That's snaking as tightly as physically possible up and down the whole inner face of the panel. It can be modular, with scattered ports for super short in/out runs to different components across the mobo. Tubing pops right out of the back at the closest possible point to each block right from the passive radiator reservoir manifold that is the whole back panel. Full copper blocks for your vrms and ram. You know the tubing is copper and the connectors are copper-plated. Better just go for the matte black silicon and let all of the copper sing the rest.
Basically what you then have is a full mobo block flipped inside out, passively cooling your liquid via the case itself with nothing extra covering up the components inside. And probably the best coolant temperatures ever.
The idea is that the coolant contacts as much surface on the panel as possible. That's also your res. Imagine how much coolant a side-panel's worth of tubing holds, right? How bout that? Might need some extra push to get the coolant to go through it. Lets stack impellers where a full size res *would* be in a normal loop to be safe. Case height hand-engraved copper monolith for the housing on the pump stack with an internal gap to make room for some sound insulation. And then maybe it goes to a wall of rads on the front side panel to handle whatever heat is left by the panel.
How's that for logical? It's like if a laptop cooler made a pact with The God Hand, became the next Apostle, and took the corporeal form of a whole-ass liquid-cooled hybrid passive/active radiator case made out of fine polished copper.
Lets go further and try to eliminate the rads completely, have an unobstructed view of that clean layout. Can we make the partition that the mobo mounts onto a 'coarse' copper mesh? And can we then mount two oversized fans stretching the entire span of that partition, blowing from front compartment to rear? And can we get them *just* far back enough from the rear side panel to send the air across the whole manifold and then directly out through a generous mesh strip running along the top, bottom, front and back of the rear compartment this forms? Can we maybe get fins on the tubing of the integrated manifold to assist transfer?
Somewhere in the case, there will need to be a sizeable passive air intake for the fans to draw from. It's kinda okay if it's bottlenecking the fans just a little bit - potentially more stable flow when the max resistance is at entry. Only problem would be potential resonance through the intake. Could always mesh the top out as well if we need more intake. It's intrinsically negative pressure, but we'll go the extra mile to seal it and filter that intake. All of the removable panels clamp into place to seat some nice fat seals into matching grooves. Maybe the whole bottom of the visible compartment is your intake mesh. Maybe have some blockage across the bottom couple inches of the meshed mobo partition to linearize the flow path a bit more. Or do solid trim around the edges of the mobo partition to separate all of the outlet-side compartment's exhaust. The mobo will have to stand further off to let the air through the mesh, and you'd want taller feet too. But nobody said this thing has to be practical. Honestly, if we're making it out of expensive copper sheeting, we can afford to make it as big as it needs to be. Lian Li style partitioning with the spacious back panel hiding integrated manifold, fans, and tubing with plenty of space for airflow. Like, maybe even wide enough in the back to stand an ATX psu on its side.
I mean... at this point, make the OUTSIDE of that back panel a full passive radiator with a full-span fin array. Because why not?
Can I maybe convince a youtuber to try this for educational purposes? Hrmmm...
This is why I like my idea better. Using those panels as reservoirs is a good plan. But in my plan 200mm fans aren't half big enough! Therefor, it is better.It’s too small for 200mm fans friends. The side panels act as reservoirs.
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