- Joined
- Feb 18, 2005
- Messages
- 5,847 (0.81/day)
- Location
- Ikenai borderline!
System Name | Firelance. |
---|---|
Processor | Threadripper 3960X |
Motherboard | ROG Strix TRX40-E Gaming |
Cooling | IceGem 360 + 6x Arctic Cooling P12 |
Memory | 8x 16GB Patriot Viper DDR4-3200 CL16 |
Video Card(s) | MSI GeForce RTX 4060 Ti Ventus 2X OC |
Storage | 2TB WD SN850X (boot), 4TB Crucial P3 (data) |
Display(s) | 3x AOC Q32E2N (32" 2560x1440 75Hz) |
Case | Enthoo Pro II Server Edition (Closed Panel) + 6 fans |
Power Supply | Fractal Design Ion+ 2 Platinum 760W |
Mouse | Logitech G602 |
Keyboard | Razer Pro Type Ultra |
Software | Windows 10 Professional x64 |
Main question her is, why doesn't Intel use top of the line thermal compound and charge I don't know, 15€ more? Surely such tiny premium would still give them massive profit margin on each CPU (where they use cheap generic crap and charge nothing extra for it) while giving users better thermals than with crappy generic paste.
Because the majority of CPUs sold - even the unlocked K SKUs - are never overclocked. In fact, a lot of people buy the K SKUs and use them on non-Z-series boards simply because they have higher speeds than the ordinary ones (e.g. i7-8700 = 3.2GHz base/4.6GHz boost, 8700K = 3.7/4.7). From Intel's viewpoint, they can either spend a bit more on adding a feature that the vast majority of their users will never need nor want... or they could charge a slightly lower price and move more units. Being a capitalist company that exists to make money, which option do you think they're gonna choose?
"So why does Ryzen use solder then?" I can't say for certain, and there's no way to know since removing its IHS destroys the chip, but I'm pretty sure that solder is the only way that AMD could get acceptable thermals on Ryzen. A side effect is that a soldered IHS is good PR for AMD, something they desperately need after Bulldozer (a monkey that will be hanging on their back for many years to come).
I'm quite certain that if AMD could get away with using crap TIM, they would. We may even see it on the next iteration of Ryzen, assuming Samsung/GloFo can actually tweak their process to allow higher clocks than 4GHz.
I mean, people don't realize that what Intel is doing is essentially causing you to effectively use 2 layers of thermal compound. The more of this crap you stack, the worse things are. Back in the day of 25W and 60W top end CPU's it didn't even matter. But now with 6+ cores and really high clocks, every little matters. Not to mention heatspreaders came later, in the beginning all CPU's were "delided" from factory. They all had direct contact with the cooler.
The reason "heat"spreaders were introduced was far more to do with preventing CPU dies being destroyed by the ever-larger and ever-more-tightly-pressing coolers that were being released, than due to heat dissipation concerns.