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GIGABYTE Has No Plans to Release a Custom Radeon RX Vega 64

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In what might be shocking news to AMD fans, GIGABYTE has stated that there are no current plans to make a custom Radeon RX Vega 64. This might change in the future. But for now, early Vega 64 adopters have no choice but to settle for the reference design or or custom design cards coming out from other vendors. There is still a light hope for the Vega 56 though, since GIGABYTE didn't discard the possibility of releasing a RX Vega 56 Gaming G1. However, the actual number of units is still unclear considering that GIGABYTE is unable to start production immediately due to various technical difficulties surrounding Vega.

Due to the inconsistency in quality of chips that AMD are providing, AIB partners are having a difficult time establishing a standard GPU frequency for their factory-overclocked cards. Furthermore, temperature reporting is broken. The actual GPU temperature is different from the temperature reported by the GPU which can become a big problem for stability in the long run. And to top it all off, there are three different Vega 10 GPU packages floating around. The molded package consists of the GPU and HBM dies sharing the same height, while there's a 40 μm height difference between them in the unmolded package. Although it seems insignificant, this small difference prevents manufacturers from standardizing a single heatsink design to accommodate all three GPU packages.



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Ouch, this gotta hurt AMD. With the higher power consumption and it not being a whole lot better than the 1080 in leaning towards that for a newer build than vega tbh.
 
Next one AMD please
 
Who didn't wonder if that was coming?
 
Luckily i don't care for Gigabyte GPUs

XFX and Sapphire all day when it comes to AMD
 
Luckily i don't care for Gigabyte GPUs

XFX and Sapphire all day when it comes to AMD


Out of curiosity, what are they doing different between the AMD and NVidia cards? I think their AORUS GTX line is pretty nice.
 
There are several allegations that really justify some follow up. Temperature reporting broken? Binning issues? Manufacturing discrepancies? Are these still significant problems or just griping from an under supplied vendor?
 
They know they won't get enough chips to sell, so they prefer to just sell the pre-constucted reference ones. Let's see except for ASUS which other vendor will make a custom RX64. I guess Sapphire and XFX will make one. RX56 though will have custom ones from all vendors as the lower priced one that will sell more units and having more headroom for oc, being already faster than 1070s.
 
Out of curiosity, what are they doing different between the AMD and NVidia cards? I think their AORUS GTX line is pretty nice.
i've had better luck with them and mine seemed to always OC better under water
 
Ouch, this gotta hurt AMD. With the higher power consumption and it not being a whole lot better than the 1080 in leaning towards that for a newer build than vega tbh.
It'd fry the chicken on the logo
 
I keep getting the feeling that my initial post-launch estimate of Vega was pretty close: that it's essentially an eterprise/HPC/compute focused architecture, and that the RX release is more of an obligatory hold-over than an actual whole-hearted gaming GPU. With AMD's resource limitations in comparison with Nvidia in mind, this would both make sense and be sound financially - they'd gain more in the long run on focusing on delivering value for a lucrative market now and using some of that money to come back stronger later on, rather than diluting their efforts and not really shining at any one thing.
 
Gigabyte a 2nd Tier is just wanking they can get production anytime soon, more just sour grapes.

AMD is fulfills the Apple contract to supply Vega for the end of year release of iMac. Just like why the Tonga XT never showed, or then a 380X was not brought in until late. AMD is working to supply the corporate custom clients first, it provides for a known ROI to the bottom line and their year end.

Not to say there may well be HBM2 memory supply issues, I'm just not sure anyone can make a clear call as GloFo production or yield/issues. Probable both and then logistical problems with scheduling from interposer subcontractor getting the silicone and memory IC supplies to line-up together. Then still off to the AIB that builds Vega on to a board for Apple. All the other AIB just have to get in line.
 
There are several allegations that really justify some follow up. Temperature reporting broken? Binning issues? Manufacturing discrepancies? Are these still significant problems or just griping from an under supplied vendor?

amd provides randomly binned chips to them, they dont have top binned chips, no use making a card if it cant beat the stock one
 
amd provides randomly binned chips to them, they dont have top binned chips, no use making a card if it cant beat the stock one
Well, it's very much arguable that a custom card is worth the cost if it runs cooler and quieter, even at stock speeds ...
 
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It's real. They've acknowledged it and played it off like it's no big deal. Which is BS. It's a HUGE deal. A deal breaker in my book. I would never buy one without knowing for sure it wasn't one with the GPU die/HBM height design flaw.

https://videocardz.com/72173/there-are-at-least-three-variants-of-vega-10-gpu-packages
http://www.tomshardware.com/news/amd-vega-package-problem,35281.html

- Epoxy resin made in Taiwan RX Vega 64 Samsung HBM2 = Apple iMac
- Resinless made in South Korea RX Vega 56 SK Hynix HBM2 = Actual first/new Interposer supplier and I believe they dropped this company.
- Resinless made in Taiwan for engineering boards (probably SK Hynix HBM2) = Reference production cards

As the to HBM2 height not sure if it both Samsung/Hynix, but yes there are picture on the web like guru3d.com and that Asus RX Vega 64. Not sure what and which models had the issue and if what that really did to heat control of the HBM2.
 
Gigabyte a 2nd Tier is just wanking they can get production anytime soon, more just sour grapes.

AMD is fulfills the Apple contract to supply Vega for the end of year release of iMac. Just like why the Tonga XT never showed, or then a 380X was not brought in until late. AMD is working to supply the corporate custom clients first, it provides for a known ROI to the bottom line and their year end.

Not to say there may well be HBM2 memory supply issues, I'm just not sure anyone can make a clear call as GloFo production or yield/issues. Probable both and then logistical problems with scheduling from interposer subcontractor getting the silicone and memory IC supplies to line-up together. Then still off to the AIB that builds Vega on to a board for Apple. All the other AIB just have to get in line.


Dude, I'm going to guess English isn't your first language. I honestly can't understand what it is you're trying to say.
 
It's real. They've acknowledged it and played it off like it's no big deal. Which is BS. It's a HUGE deal. A deal breaker in my book. I would never buy one without knowing for sure it wasn't one with the GPU die/HBM height design flaw.

https://videocardz.com/72173/there-are-at-least-three-variants-of-vega-10-gpu-packages
http://www.tomshardware.com/news/amd-vega-package-problem,35281.html

When exactly it was determined there is a definitive "flaw" with them ?

On the topic : If there was one company from which I heard most complaints about this generation , it is Gigabyte.
 
Dude, I'm going to guess English isn't your first language. I honestly can't understand what it is you're trying to say.

I think hes try'n to say that with demand being high Gigabyte is not a top priority to provide chips to.

Apples iMac Pro is at the top of the pecking order

Apple said:
Graphics
Vega GPU
  • Radeon Pro Vega 56 graphics processor with 8GB of HBM2 memory
  • Configurable to Radeon Pro Vega 64 graphics processor with 16GB of HBM2 memory

That's what i got from his post
 
When exactly it was determined there is a definitive "flaw" with them ?
Whenever. Right now is fine with me. I noticed it weeks ago when it was first reported. And I made my decision about it then. It's BS. The proper cooling of the HBM is the highest priority of any component on the card. As in the HBM is going to overheat before anything else does. They majorly dropped the ball by not making sure that it can be cooled as effectively as possible. Leaving space to be filled by more TIM is NOT a good idea. It can't have anything but a negative impact on cooling the HBM.

AIB partners have taken note of this and have come to the same conclusion I have. It's a fucking nightmare and I don't blame them for not wanting to touch it with a 10' pole. It disgusting. Just thinking about it makes my head hurt and my stomach churn. I was actually considering buying one until I found this out.

Though, like I said, I probably would still buy one if I could know 100% for sure ahead of time it wasn't one with the GPU die/HBM height mismatch. I'm most certainly not having that. And I don't know why anyone would. Given the fact they all aren't like that. And the ones that are don't need to be. AMD could have made sure of that. But they're obviously a bunch of careless, penny-pinching, asshole idiots...frankly. "Let's make them all different so we can't provide the customers with a consistent product, and piss off our AIB partners by making their jobs way more difficult than necessary". Really? FU AMD!
 
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Sounds 100% like a supposition to me , there's no real evidence that there is some sort of problem with cooling caused by the different package assembly.

As if AMD with Vega were the first ones to use multiple suppliers for components such as memory or by having multiple package versions. To me this sounds like a ridiculous level of nitpicking. Nvidia quietly changed the supplier for memory modules on their 1070s after every reviewer got the ones with Samsung chips that overclocked far better and it pretty much went under the radar , a few angry customers here and there but overall it's chill . The good ol' double standard.

But sure call them penny-pinching assholes , whatever floats your boat or makes you more comfortable with your next purchases , we all do it I suppose.
 
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Sounds 100% like a supposition to me , there's no real evidence that there is some sort of problem with cooling caused by the different package assembly.

Its expensive to come up with a cooler that can handle both GPU heights. A taller chip will create higher mounting pressure which could crack the interposer and the smaller one could leave a gap between die and coldplate and thus bad thermals..
 
When I think of GPUs it used to be ATi and Sapphire, now it is Sapphire, HIS, XFX, Visiontek, MSI, TUL. GA used to make some over the top motherboards but they seem to have lost their way. Their GPUs seemed to have been cheaply made.
 
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