Intel Core i9-7960X 16-core/32-thread Processor Detailed, Benchmarked

[Frick]

Where do you think all of that "drawn power" goes? There must be a reason why computers have fans and why more power draw means more heat!

Spoiler

Every watt that your computer pulls off the wall is being converted to thermal or kinetic energy.

Herp derp blerghhhh. What I mean is this: Has the term Thermal Design Power officially replaced CPU power dissipation as the term to describe power draw? I doubt it, and as said elsewhere a 140W TDP from either Intel or AMD is a poor indicator or actual power draw.

Consider:

So how many people think it will actually use 140 Watts TDP?

I know what he means, but it's wrong. It obviously doesn't matter, but still.

 

[Aquinus]

Herp derp blerghhhh. What I mean is this: Has the term Thermal Design Power officially replaced CPU power dissipation as the term to describe power draw? I doubt it, and as said elsewhere a 140W TDP from either Intel or AMD is a poor indicator or actual power draw.

Then do research.

Intel defines TDP as follows: The upper point of the thermal profile consists of the Thermal Design Power (TDP) and the associated Tcase value. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.1 . The thermal profile must be adhered to to ensure Intel’s reliability requirements are met.

...and...

AMD Opteron* processors also have a TDP specification. According to AMD documentation2 their TDP specification is as follows:

"TDP. Thermal Design Power. The thermal design power is the maximum power a processor can draw for a thermally significant period while running commercially useful software. The constraining conditions for TDP are specified in the notes in the thermal and power tables.”
Notes:
- TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD, VDDNB, VDDIO, VLDT, VTT and VDDA.
- The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tcase,max. TDP is not the maximum power of the processor.

https://www.intel.com/content/dam/doc/white-paper/resources-xeon-measuring-processor-power-paper.pdf

My point is that regardless of the measures,they're both measuring to some degree, the amount of heat released from a CPU under load with particular characteristics. Neither describe max usage but, both describe how much thermal energy is released over time given their TDP criterion.