- Joined
- Jul 30, 2019
- Messages
- 3,276 (1.69/day)
System Name | Still not a thread ripper but pretty good. |
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Processor | Ryzen 9 7950x, Thermal Grizzly AM5 Offset Mounting Kit, Thermal Grizzly Extreme Paste |
Motherboard | ASRock B650 LiveMixer (BIOS/UEFI version P3.08, AGESA 1.2.0.2) |
Cooling | EK-Quantum Velocity, EK-Quantum Reflection PC-O11, D5 PWM, EK-CoolStream PE 360, XSPC TX360 |
Memory | Micron DDR5-5600 ECC Unbuffered Memory (2 sticks, 64GB, MTC20C2085S1EC56BD1) + JONSBO NF-1 |
Video Card(s) | XFX Radeon RX 5700 & EK-Quantum Vector Radeon RX 5700 +XT & Backplate |
Storage | Samsung 4TB 980 PRO, 2 x Optane 905p 1.5TB (striped), AMD Radeon RAMDisk |
Display(s) | 2 x 4K LG 27UL600-W (and HUANUO Dual Monitor Mount) |
Case | Lian Li PC-O11 Dynamic Black (original model) |
Audio Device(s) | Corsair Commander Pro for Fans, RGB, & Temp Sensors (x4) |
Power Supply | Corsair RM750x |
Mouse | Logitech M575 |
Keyboard | Corsair Strafe RGB MK.2 |
Software | Windows 10 Professional (64bit) |
Benchmark Scores | RIP Ryzen 9 5950x, ASRock X570 Taichi (v1.06), 128GB Micron DDR4-3200 ECC UDIMM (18ASF4G72AZ-3G2F1) |
Note because of the higher profile of the NH-L12Sx77 it will NOT fit in a Silverstone ML-09B. Having experienced the NH-L12S with 5950x it's a great cooler and included the AM4 offset mounts. I would expect NH-L12Sx77 to be just as satisfying. In fact I think NH-L12S did better than my NH-C14S probably because of the included fan and the AM4 offset mounting kit combined. With updraft configuration getting the heat out of the case is paramount so ducting any gap between the heatsink and vent is very helpful to exhaust without recirculating hot air back into the case.
Quote: "By combining a measurement at a typical heat-load with a second measurement that tests the heatsinks maximum dissipation capacity, the NSPR offers a more balanced picture of heatsink performance than standard TDP ratings because it reflects both performance in standard use cases and under extreme conditions. Conducted at a stable ambient temperature of 22°C and with clearly specified, realistic parameters (typical heat-loads in the first test, target temperature of 60°C in the second test), it also avoids the pitfall of going into testing scenarios that are remote from real world applications. At the same time, like with any single-number rating, there is no way around the fact that NSPR is a simplification of the complex nature of heatsink performance. In particular, it cannot reflect the fact that cooling performance can differ between platforms, CPU series’ and even from CPU model to CPU model within a series. This is where our CPU-specific classification scheme of heatsink performance steps in."
Have you seen this? https://noctua.at/en/noctua-standardised-performance-ratingDAMN, this is not an art piece, this is an engineered product designed to move heat from the CPU. Absence of any thermal performance specification is almost an insult.
Quote: "By combining a measurement at a typical heat-load with a second measurement that tests the heatsinks maximum dissipation capacity, the NSPR offers a more balanced picture of heatsink performance than standard TDP ratings because it reflects both performance in standard use cases and under extreme conditions. Conducted at a stable ambient temperature of 22°C and with clearly specified, realistic parameters (typical heat-loads in the first test, target temperature of 60°C in the second test), it also avoids the pitfall of going into testing scenarios that are remote from real world applications. At the same time, like with any single-number rating, there is no way around the fact that NSPR is a simplification of the complex nature of heatsink performance. In particular, it cannot reflect the fact that cooling performance can differ between platforms, CPU series’ and even from CPU model to CPU model within a series. This is where our CPU-specific classification scheme of heatsink performance steps in."
I agree. Unless your heatsink is right up against the edge of your exhaust vent some ducting is your huckleberry. The A12x15 manages to do it fairly well for Silverstone ML09b but other cases that have gaps won't fair as well exhausting without ducting.Also, anyone who believes Noctua's press release saying that the 77mm height will make for optimal thermals without "exhausting into the case" in those sandwich cases is deluding themselves. A12x15 is a solid fan but like most every other fan, it's laughably incompetent on its own at handling exhaust duty thru the heatsink and out a vented panel. Other case fans *will* have to be doing the heavy lifting - it's still a downdraft cooler.
Have you tried ducting the flow? I don't see a top vent on that case like the ML-09B so ducting would take a bit more work.I have NHL-12S on my HTPC inside silverstone Grandia 09b. Gets by for most tasks since the PC usually just sits idle or plays netflix, but I do see temps hit 100*C if I run cinebench or the kids play certain games. Need to mod a 240mm AIO into that unit soon. I dont think this new improved version will help much.
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