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For those of you claiming there's a 12th memory die below the gpu die area: that darker section is an artifact of the blur used to mask the board. Look closely and it's clear that that area does not comprise of a die like the others, but three dark blurred blocks. I would guess they stem from blurring an area shaded by the CPU placed there. Besides, putting a die there would make its traces either much shorter (directly to the die) or longer (around a corner of the die) than the rest of the memory, which would essentially break it. Memory timings are far too tight to allow for unequal trace lengths. This board fits 11 memory chips on each side.
For those of you saying that the CPU for some reason covering the area behind the die somehow confirms the RT coprocessor hypothesis: no. Not only would a chip there make providing stable power to a GPU die on this level near impossible due to forcing crucial power conditioning components further from the die, but the mounting of such a chip would make the PCB ridiculously expensive (dense and high bandwidth vias through the PCB, while not blocking or otherwise interfering with everything else going there?), and if such a coprocessor had any power draw at all it would be impossible to cool in a standard PCIe form factor - you'd need a full slot of heatsink at the back as well. 4-slot card that fouls your CPU cooler, anyone? Yeah, not happening. And besides, the added latency from moving RT processing off-die - even using exotic interconnects - would make it impossible to implement at anything resembling high frame rates and good frame times.
Im guessing the CPU is either there to hide identifying information as to the source (company), or to mess with people who believe in this rumor.
That sure qualifies as "it's been a while", no?My GTX 680 4GB had them on the back as well.
No. See above. And it definitely won't be 22GB on a 384-bit bus...384bit. One module between GPU die & PCIEx16 connector...
For those of you saying that the CPU for some reason covering the area behind the die somehow confirms the RT coprocessor hypothesis: no. Not only would a chip there make providing stable power to a GPU die on this level near impossible due to forcing crucial power conditioning components further from the die, but the mounting of such a chip would make the PCB ridiculously expensive (dense and high bandwidth vias through the PCB, while not blocking or otherwise interfering with everything else going there?), and if such a coprocessor had any power draw at all it would be impossible to cool in a standard PCIe form factor - you'd need a full slot of heatsink at the back as well. 4-slot card that fouls your CPU cooler, anyone? Yeah, not happening. And besides, the added latency from moving RT processing off-die - even using exotic interconnects - would make it impossible to implement at anything resembling high frame rates and good frame times.
Im guessing the CPU is either there to hide identifying information as to the source (company), or to mess with people who believe in this rumor.