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Processor | 13th Gen Intel Core i9-13900KS |
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Cooling | Pichau Lunara ARGB 360 + Honeywell PTM7950 |
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Keyboard | IBM Model M type 1391405 |
Software | Windows 10 Pro 22H2 |
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GM200 was the last 28nm flagship @ 600mm2. Only had room for 24 SM. 250W TDP via Titan X. Don't think it would be too smart to backtrack that far on die config.
The base AD107 (4060) @ 159mm2 from last gen had 24 SM and it's like 2x stronger just from architectural improvement. 6.691 TFLOPS vs 15 TFLOPS.
Might be more logical to go with a different fab (Intel/Samsung) and work out a pricing deal for lower end stuff. They actually did this for the 1050 TI IIRC (Samsung).
As for VRAM, 5060/TI and 5070 will inevitably get 3GB dies to replace the current 2GB ones. Base 9070 really cuts into the 5070 in every aspect, at least per "MSRP". More CU (56 vs 48 SM), 4GB more VRAM.. etc..
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AMD and NVIDIA are actually real close in regards to SM/CU count ATM. It's pretty damn linear for the FP32 TFLOP metric. I would say NVIDIA has a leverage still given they can cram 84 SM into a similar sized die (GB203 vs Navi48).
9070XT (64CU) is better than 5070 TI in raw FP32, but the 5070 TI (70/84 SM. 83% of GB203) still edges out in games. Could be an AMD fine wine situation where drivers inevitably improve things. Who knows.
Agreed, except on the "fine wine". AMD's traditionally broken, utterly incompetent drivers are what led to "fine wine". It's basically cope for buy now, enjoy it to its fullest 2-3 years down the road. For once, it seems this was a key point for the launch of RDNA 4, and most major problems were addressed out of the gate. Expect a similar level of improvement over time compared to what you expect from NV this time around.