- Joined
- Sep 25, 2012
- Messages
- 2,074 (0.46/day)
- Location
- Jacksonhole Florida
System Name | DEVIL'S ABYSS |
---|---|
Processor | i7-4790K@4.6 GHz |
Motherboard | Asus Z97-Deluxe |
Cooling | Corsair H110 (2 x 140mm)(3 x 140mm case fans) |
Memory | 16GB Adata XPG V2 2400MHz |
Video Card(s) | EVGA 780 Ti Classified |
Storage | Intel 750 Series 400GB (AIC), Plextor M6e 256GB (M.2), 13 TB storage |
Display(s) | Crossover 27QW (27"@ 2560x1440) |
Case | Corsair Obsidian 750D Airflow |
Audio Device(s) | Realtek ALC1150 |
Power Supply | Cooler Master V1000 |
Mouse | Ttsports Talon Blu |
Keyboard | Logitech G510 |
Software | Windows 10 Pro x64 version 1803 |
Benchmark Scores | Passmark CPU score = 13080 |
Obviously. My point is, all the crowing about how great and necessary solder is, and it's beaten by goop from a tube (liquid metal is just another Thermal Interface Material, after all, with different ingredients). Also obvious to me, install IHS so it's closer to the die, and it transfers heat better.This is not about TIM vs. solder. This is about solder vs. liquid metal with a reduced gap between the IHS and die.