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Sony Takes a Step Backwards with PlayStation 5, Cuts on Cooling Capacity in the new Revision

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Any other updates internally to suggest a smaller cooler is warranted?
The original cooler was most likely over engineered and had a lot of cooling headroom. When counting their beans they probably realized they could save quite a bit and redesigned the new one without the headroom and at the limit. e.g. A computer OEM makes a desktop with a 1200w psu but the system's peak draw is only 600w so they revise it and new units are shipped with a cheaper 650w psu.
 
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The original cooler was most likely over engineered and had a lot of cooling headroom. When counting their beans they probably realized they could save quite a bit and redesigned the new one without the headroom and at the limit. e.g. A computer OEM makes a desktop with a 1200w psu but the system's peak draw is only 600w so they revise it and new units are shipped with a cheaper 650w psu.

All we can do is pretty much speculate, I just saw on twitter that at least Digital Foundry is looking into it (both sourcing one to test and asking sony for anwsers). Someone here also mentioned Gamers Nexus so we'll have more awnsers eventually.
 
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That's not how cooling works. A higher exhaust airflow temperature can mean several things: less airflow (meaning the air has more time to heat up while passing through the heatsink); a warmer heatsink due to less thermal mass and/or surface area; a warmer chip putting out more power. What it can't mean is the heatsink is transferring more heat to the air at the same airflow without the heatsink temperature increasing - thermodynamics ensures that. It is not indicative of a more efficient cooling system if one adheres to common understandings of (consumer-facing) cooling efficiency (i.e. being able to extract as much heat as possible with as little power consumption, noise and design issues/complexity as possible) - cooler exhaust air is indicative of the heatsink efficiently dissipating its thermal energy input. Given that there's no chance of a power draw increase for the SoC (unless yields have suddenly gotten worse, which ... nah.), that means either less airflow or a hotter heatsink. Given the smaller design of the heatsink and retaining at least one of the original fans (likely all three for a steady supply), a hotter heatsink is by far the most likely answer due to there being less surface area and less thermal mass. A hotter heatsink also generally means a hotter SoC (as thermal transfer is more effective the larger the thermal delta, the heatsink getting warmer will cause the SoC to heat up as well) - though by exactly how much is impossible to extrapolate from external data. It's likely a relatively minor difference overall - and as I said before, Sony most likely has all the data they could ever want in order to make sure this design is sufficient to keep things running.

Well, you're entirely welcome to your own personal definition. For the world and console makers, these exist and have been on sale for quite a while, so they are by the very definition of the word current. Whether they are next for you (and a lot of other people) is rather irrelevant. And sure, it's nitpicking, but it's also worth thinking about how we actually speak of things. Sticking to an outdated term just because we're used to it is a bad habit.
I disagree, given that both are air cooling so reaching steady state is fast say 2min, and the consoles produce a similar amount of heat say 200w, yet one console is exhausting more heat than the other, so either the new model is doing a better job, or the old model is dissipating heat through another way than the exhaust via the body of the console. Either way the new model seems more efficient.
Here's a more serious article than the misleading nonsense of the YouTuber.
 
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Happy I was able to get an original PS5 disc Edition model. However it's almost been a year and the NVMe expansion slot is still not enabled for every users.
VRR is not yet enabled for PS5.
 
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so it looks like every company is now silently downgrading their products... what a time to be in.
 
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VRR is not yet enabled for PS5.

VRR won't happen until Sony actually delivers it in their TV's since they want to sell bundles. Which is a pain since all current TV's from Sony used gimped MediaTek SoC's that come with some major issues when it comes to 4K120 signal.

People were suckered into "HDMI 2.1" displays in 2020 but Sony is yet to deliver VRR promised in "future" firmware updates. I'm surprised no one has sued them yet for false advertising. 2021 sets are the same.
 
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I disagree, given that both are air cooling so reaching steady state is fast say 2min, and the consoles produce a similar amount of heat say 200w, yet one console is exhausting more heat than the other, so either the new model is doing a better job, or the old model is dissipating heat through another way than the exhaust via the body of the console. Either way the new model seems more efficient.
Here's a more serious article than the misleading nonsense of the YouTuber.
That Ars article also doubts Austin's claims that it's extracting more heat from the system, so ... yeah. And no, it isn't exhausting more heat, its exhaust air is hotter. "More heat" must mean more total thermal energy, which is a factor of both temperature and volume of heated air - you can concentrate that heat in a small amount of hotter air, or spread it across a larger volume of lukewarm air. Measuring the exhaust temperature at a single point tells us nothing about this. Given a fixed thermal input smaller heatsink with a smaller surface area will heat the air less with the same airflow or heat a smaller amount of air the same (or even more) with less airflow - which depends on both the fan, the flow path, the specific design of the heatsink, and more. That doesn't mean the smaller heatsink is "exhausting more heat", it means the heat source - the SoC, and by extension the heatsink - is getting hotter, as hotter exhaust air means a hotter heatsink, which necessitates a hotter SoC as well. The specifics of this relation are complex and can't be reliably estimated (without some serious simulation at least), so measurements are needed.

To put it in your wording: reaching steady state is fast, say 2min, and the consoles produce a similar amount of heat, say 200w, yet one console's exhaust is hotter than the other, so either the old model is heating a higher volume of air less with the same thermal energy, or the new console has drastically lowered airflow, allowing its exhaust air to heat up more. Either way, hotter exhaust = hotter heatsink = hotter SoC. Thermal transfer relies on the temperature delta between the heatsink and the air, and a higher delta means more efficient thermal transfer. Warmer exhaust air is not a sign of things working better, it can be a sign of either something different but roughly equal or something worse.
 
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so it looks like every company is now silently downgrading their products... what a time to be in.
It's called "cost optimizing". OG Xbox One had over-engineered thermal design because MS was afraid of return of the RROD. It later allowed them to boost frequencies higher.
 
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We'll need proper testing to be sure
Not going to disagree with that. Testing is needed.
but they definitely cheaped out.
You stated that with negative implication. Once again, there nothing nefarious going on with this change. It's a refinement, seemingly a well engineered one. The complaining and nay-saying by many before actual comparative tests have been conducted is unwarranted.
 
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That Ars article also doubts Austin's claims that it's extracting more heat from the system, so ... yeah. And no, it isn't exhausting more heat, its exhaust air is hotter. "More heat" must mean more total thermal energy, which is a factor of both temperature and volume of heated air - you can concentrate that heat in a small amount of hotter air, or spread it across a larger volume of lukewarm air. Measuring the exhaust temperature at a single point tells us nothing about this. Given a fixed thermal input smaller heatsink with a smaller surface area will heat the air less with the same airflow or heat a smaller amount of air the same (or even more) with less airflow - which depends on both the fan, the flow path, the specific design of the heatsink, and more. That doesn't mean the smaller heatsink is "exhausting more heat", it means the heat source - the SoC, and by extension the heatsink - is getting hotter, as hotter exhaust air means a hotter heatsink, which necessitates a hotter SoC as well. The specifics of this relation are complex and can't be reliably estimated (without some serious simulation at least), so measurements are needed.

To put it in your wording: reaching steady state is fast, say 2min, and the consoles produce a similar amount of heat, say 200w, yet one console's exhaust is hotter than the other, so either the old model is heating a higher volume of air less with the same thermal energy, or the new console has drastically lowered airflow, allowing its exhaust air to heat up more. Either way, hotter exhaust = hotter heatsink = hotter SoC. Thermal transfer relies on the temperature delta between the heatsink and the air, and a higher delta means more efficient thermal transfer. Warmer exhaust air is not a sign of things working better, it can be a sign of either something different but roughly equal or something worse.
I see your point better now, indeed we can not make conclusions regarding the efficiency of the cooler until we have proper measurements.
But I disagree with the conclusion as it is a efficient design by being smaller and achieving the same performance with the same kind of hardware.
 
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My guess is that Sony was selling PS5 without profit (even like Nintendo with the WiiU at a loss) and now they are looking for at least some. Fans are fine. Some dude made test with Nidec (which was reported it's the noisiest one) outside of the console and was dead silent. Most issues are vibrations on the chassis.
it's called a loss leader and it is practically expected for the 1st gen of a new console to be sold as such. they are loosing money on console sales alone, but the profit margins for all the subscription services, peripherals, games, etc, are good enough to make up the difference. they lead you in (hence the loss leader term) to buy the console at a cheaper price than what it costs them to actually design, produce and ship it to market, and hope you spend spend spend on all those other things that go along with the console. typically the console will make money later after there is a more comprehensive revision....i doubt this was that revision
 

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Oh so the article concluded they improved cooling in this new version, that's interesting...
If the system is getting more hot air out of the console, it means it's more efficient.

"That is just measuring the air coming out" - you know that the air exit temperature being hotter indicates the cooling solution is working better, not worse, right? Getting rid of the heat is what the cooling solution does. An indication the CPU is running hotter would be if the air exit temperature was cooler, because the cooling solution wouldn't be removing the heat as efficiently.
This! The article actually shows the new cooling setup is way better! 3-5 degrees is a great improvement in cooling efficiency.
 
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VRR won't happen until Sony actually delivers it in their TV's since they want to sell bundles. Which is a pain since all current TV's from Sony used gimped MediaTek SoC's that come with some major issues when it comes to 4K120 signal.

People were suckered into "HDMI 2.1" displays in 2020 but Sony is yet to deliver VRR promised in "future" firmware updates. I'm surprised no one has sued them yet for false advertising. 2021 sets are the same.
There are major factors for HDMI 2.1 and these are
1. HDMI encoder IC e.g. Panasonic (a.k.a. Crapsonic), Audiologic
2. SoC e.g. MediaTek, LG α9.

HDMI 2.1 standard is a mess. HDMI 2.1 = lack of standard, lack of transparency.

PS; I'm a Yamaha RX-6A (BS 24 Gbps, thanks Crapsonic) victim. The weakness link with my HDMI 2.1 setup is Yamaha RX-6A garbage HDMI 2.1.

PS5 has Panasonic HDMI encoder IC.
Yamaha RX-6A has Panasonic HDMI encoder IC.
 
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I see your point better now, indeed we can not make conclusions regarding the efficiency of the cooler until we have proper measurements.
But I disagree with the conclusion as it is a efficient design by being smaller and achieving the same performance with the same kind of hardware.
"More efficient" is quite misleading though. More efficient means that it's doing the same work with less resources, or more work with the same resources. In this case we don't know much for sure, but we do know that exhaust temperatures are higher and the heatsink is smaller. Exhaust temperatures increasing imply higher heatsink (and thus SoC) temperatures, so it's most likely doing less work (transferring less energy in the same amount of time, leading to a higher steady-state temperature), but also with a smaller heatsink. Less work with less resources? That might be equally efficient, or more, or less. That depends as much on how you calculate efficiency (which would by necessity include some complicated and possibly rather arbitrary formula balancing out heatsink mass, materials/thermal conductivity/heat emissivity, surface area, and so on) as on the measurable changes in performance, and that gets us pretty deep into the woods.

What can we say, then? We can say that this is likely still sufficient for cooling the PS5 (as Sony undoubtedly has the data to back that up, having collected metrics from millions of users over nearly a year), but has less headroom, while costing less and consuming less materials. In that regard it's more cost-effective, but that doesn't matter to end users, and frankly IDGAF about any metric that only or mainly benefits the bottom line of a giant corporation. It's likely less over-engineered, possibly better suited to its intended purpose (an overbuilt cooler is wasteful, after all), and likely still entirely sufficient while being smaller. Is that more efficient? No. Is it better? Depends who you ask. Is it worse? Likely not.
 

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"More efficient" is quite misleading though. More efficient means that it's doing the same work with less resources, or more work with the same resources. In this case we don't know much for sure, but we do know that exhaust temperatures are higher and the heatsink is smaller. Exhaust temperatures increasing imply higher heatsink (and thus SoC) temperatures, so it's most likely doing less work (transferring less energy in the same amount of time, leading to a higher steady-state temperature), but also with a smaller heatsink. Less work with less resources? That might be equally efficient, or more, or less. That depends as much on how you calculate efficiency (which would by necessity include some complicated and possibly rather arbitrary formula balancing out heatsink mass, materials/thermal conductivity/heat emissivity, surface area, and so on) as on the measurable changes in performance, and that gets us pretty deep into the woods.

What can we say, then? We can say that this is likely still sufficient for cooling the PS5 (as Sony undoubtedly has the data to back that up, having collected metrics from millions of users over nearly a year), but has less headroom, while costing less and consuming less materials. In that regard it's more cost-effective, but that doesn't matter to end users, and frankly IDGAF about any metric that only or mainly benefits the bottom line of a giant corporation. It's likely less over-engineered, possibly better suited to its intended purpose (an overbuilt cooler is wasteful, after all), and likely still entirely sufficient while being smaller. Is that more efficient? No. Is it better? Depends who you ask. Is it worse? Likely not.
If the air coming out of the console is hotter than before, it doesn't mean the SoC and heatsink have higher temperatures, it means SoC and heatsink have lower temperatures since more of the heat is being pushed out of the console. Since the shape of the console and the fan have not changed, there is also no "smaller stream of air" coming out of it, which would be hotter than a "larger stream of air" with the same efficiency - as another person commented.
The only explanation with the data we have for now is that they tweaked the shape and placement of the heatsink to improve efficiency.
When I say efficiency, I mean better heat displacement (from inside of console to outside of console) for less cost. It costs less to produce, it has less of an environmental impact, it's uses less fuel and money to transport. Win/win
 
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It's exactly that, the exclusive games (the controller is also pretty great). The xbox is slightly more powerfull (20-30% is an exageration imo but whatever) but I can play xbox games on the desktop anyway. Can't really do that for playstation exclusives.



It technically could be either one, you'd need more concrete data to be sure, but more than likely it's what you describe, hotter internals.

Well Xbox SeX has a 10% faster CPU. So a slightly faster Xbox CPU means the GPU will have 10% less GPU bottleneck compared to the PS5. In GPU the PS5 has 36 CUs vs the Xbox SeX 52 CUs. 2.23GHz Variable clock speed for PS5 and 1.825GHz for Xbox SeX. So a total of 10.28TFlops for PS5 and 12.15TFlops for Xbox SeX. Now that variable clock speed the PS5 has will not always be 2.24GHz as it will throttle every now and then when the console gets too hot, which is most likely to happen with the smaller Cooler Sony used with the new model.

In regards to SSD and overall bandwidth Sony seems to have the upper hand in there by a higher margin by almost 50%. I have tried both controls and they honestly feel the same, unless there is some new feature i am not aware of the PS5 Dual Sense? but i am a little more used to the Xbox Control shape since i been using Xbox 360/Xbox One controller when playing on PC.

So yeah. The Xbox SeX is faster overall, even if it was only a 20% is still a considerable amount. The smaller size of the Xbox SeX means it can be placed almost anywhere. I just can't get over how horrible and massive the PS5 is. Last gen i was totally against Xbone since Sony did everything right and M$ was completely out of touch. But this new gen people should be flocking to Xbox which it isn't the case... and i am trying to wrap my head around that fact.

Sony has literally won every single generation since their first console the PS1. I think people have just become too close to the PS brand and push anything else aside without giving other consoles a chance. It does happen, people tend to get crazy and fight over brands. I will say it again, this new gen if i had to choose a consoleI would pick the Xbox SeX every single time no contest. Specially now that Zenimax is now an exclusive to Xbox. I'm hardcore TES fan and i even got several mods on the top 100 NexusMods site.

Lastly, i think Sony are shooting themselves in the foot with the solution to the upgrade path for SSD capacity. The Xbox solution might be more expensive, but you save yourself a lot of issues trying to figure out which models are supported. But then again, i'm on PC and chances for me even picking a console are very slim. Last console i owned was a N64 back in 1996. I haven't looked back once i moved to a PC with Windows 95 if i recall.
 
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If the air coming out of the console is hotter than before, it doesn't mean the SoC and heatsink have higher temperatures, it means SoC and heatsink have lower temperatures since more of the heat is being pushed out of the console. Since the shape of the console and the fan have not changed, there is also no "smaller stream of air" coming out of it, which would be hotter than a "larger stream of air" with the same efficiency - as another person commented.
The only explanation with the data we have for now is that they tweaked the shape and placement of the heatsink to improve efficiency.
When I say efficiency, I mean better heat displacement (from inside of console to outside of console) for less cost. It costs less to produce, it has less of an environmental impact, it's uses less fuel and money to transport. Win/win
Sorry, but that's a misunderstanding of how thermal transfer works. Thermal transfer efficiency is reduced as the thermal delta between two media (such as an aluminium heatsink and air, or SoC and heatsink) diminishes. The closer in temperature the air and your heatsink, the less heat your heatsink will be able to give off (if they are the same temperature, no thermal transfer will occur). Conversely, this also means that in a scenario where you have a constant airflow and the same size heatsink, in order for the air coming off it to be hotter, you also need a hotter heatsink - if the heatsink and ambient air were both the same temperature, then the air coming off would stay the same.

For example, if your SoC is at 90°C at a given thermal output, your heatsink at 60°C and your ambient air at 20°C, you'll likely have very efficient thermal transfer across the whole chain, and your exhaust air is likely to be significantly warmer than the ambient temperature. If your heatsink instead ran at 80°C under the same conditions, that would lead to the exhaust air being hotter - but also the SoC temperature being more than 90°C under the same thermal load, as the thermal transfer efficiency between it and the heatsink would be significantly lower - it would be more difficult for the SoC to dump its heat into the heatsink, causing it to run hotter.

And what causes a hotter heatsink? A higher ratio of heat input to thermal mass and surface area. Of course, this isn't a scenario with the same heatsink, but a smaller heatsink exhausting hotter air. What that means is that you're concentrating the same thermal load as before into a smaller thermal mass (heatsink), increasing its temperature compared to the larger heatsink (assuming airflow is unchanged). This is great for transferring heat to air, as you increase the delta to ambient, improving thermal transfer due to the heatsink being hotter. But there's a downside: the same dynamic applies between your SoC and heatsink - the smaller the delta, the slower the thermal transfer. And given that the SoC is the heat source and will thus always be the hottest of the two, increasing heatsink temperatures lowers the delta between the SoC and heatsink, meaning the SoC at the same thermal load will run hotter, as it won't be able to dissipate its heat into the heatsink as efficiently as with the larger heatsink.

While thermodynamics get complicated very quickly, this is pretty simple, really. Assuming constant airflow and thermal load (SoC wattage):
Warmer exhaust air <- warmer heatsink <- warmer SoC

Increasing airflow, for example, would lower the exhaust air temperatures as it provides more thermal mass (air) to dissipate the heat from the heatsink into, spreading the same thermal energy into a larger volume of air, which will in turn lower the heatsink temperature. So, another way for the airflow temperatures to be higher is to have lower airflow - but airflow is unchanged. I assume that's what you're trying to say with the "larger/smaller stream of air" thing? I've been clear throughout every post written here that I'm assuming unchanged airflow. Which is why it's quite safe to assume that the PS5 SoC with this new cooler runs slightly hotter than previously.

So: a hotter exhaust temperature is indicative of a higher thermal delta between the heatsink and ambient air, which increases thermal transfer efficiency in that specific part of the thermal transfer. But that isn't the only part! A hotter heatsink - necessary for that efficiency increase - also indicates worse thermal transfer efficiency between the SoC and heatsink, causing SoC temperatures to rise (. Overall, then, this will cause worse cooling, as the point of the cooler is to cool the SoC, not to have a large delta between heatsink and air.
 
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An indication the CPU is running hotter would be if the air exit temperature was cooler, because the cooling solution wouldn't be removing the heat as efficiently.
Well, this would actually be false without the same fan output which is not preserved in this circumstance.

Sorry, but that's a misunderstanding of how thermal transfer works. Thermal transfer efficiency is reduced as the thermal delta between two media (such as an aluminium heatsink and air, or SoC and heatsink) diminishes. The closer in temperature the air and your heatsink, the less heat your heatsink will be able to give off (if they are the same temperature, no thermal transfer will occur). Conversely, this also means that in a scenario where you have a constant airflow and the same size heatsink, in order for the air coming off it to be hotter, you also need a hotter heatsink - if the heatsink and ambient air were both the same temperature, then the air coming off would stay the same.

For example, if your SoC is at 90°C at a given thermal output, your heatsink at 60°C and your ambient air at 20°C, you'll likely have very efficient thermal transfer across the whole chain, and your exhaust air is likely to be significantly warmer than the ambient temperature. If your heatsink instead ran at 80°C under the same conditions, that would lead to the exhaust air being hotter - but also the SoC temperature being more than 90°C under the same thermal load, as the thermal transfer efficiency between it and the heatsink would be significantly lower - it would be more difficult for the SoC to dump its heat into the heatsink, causing it to run hotter.

And what causes a hotter heatsink? A higher ratio of heat input to thermal mass and surface area. Of course, this isn't a scenario with the same heatsink, but a smaller heatsink exhausting hotter air. What that means is that you're concentrating the same thermal load as before into a smaller thermal mass (heatsink), increasing its temperature compared to the larger heatsink (assuming airflow is unchanged). This is great for transferring heat to air, as you increase the delta to ambient, improving thermal transfer due to the heatsink being hotter. But there's a downside: the same dynamic applies between your SoC and heatsink - the smaller the delta, the slower the thermal transfer. And given that the SoC is the heat source and will thus always be the hottest of the two, increasing heatsink temperatures lowers the delta between the SoC and heatsink, meaning the SoC at the same thermal load will run hotter, as it won't be able to dissipate its heat into the heatsink as efficiently as with the larger heatsink.

While thermodynamics get complicated very quickly, this is pretty simple, really. Assuming constant airflow and thermal load (SoC wattage):
Warmer exhaust air <- warmer heatsink <- warmer SoC

Increasing airflow, for example, would lower the exhaust air temperatures as it provides more thermal mass (air) to dissipate the heat from the heatsink into, spreading the same thermal energy into a larger volume of air, which will in turn lower the heatsink temperature. So, another way for the airflow temperatures to be higher is to have lower airflow - but airflow is unchanged. I assume that's what you're trying to say with the "larger/smaller stream of air" thing? I've been clear throughout every post written here that I'm assuming unchanged airflow. Which is why it's quite safe to assume that the PS5 SoC with this new cooler runs slightly hotter than previously.

So: a hotter exhaust temperature is indicative of a higher thermal delta between the heatsink and ambient air, which increases thermal transfer efficiency in that specific part of the thermal transfer. But that isn't the only part! A hotter heatsink - necessary for that efficiency increase - also indicates worse thermal transfer efficiency between the SoC and heatsink, causing SoC temperatures to rise (. Overall, then, this will cause worse cooling, as the point of the cooler is to cool the SoC, not to have a large delta between heatsink and air.
Yes, a lot has been iterated on this point. I want to chime in. Since exhaust air cannot be hotter than heatsink temperature, it is very dangerous to run a chip's heatsink temperature very close to thr chip thermal limit. The chip is not the overwhelming problem. Suppose it runs on digital vrm - those components are very susceptible to temperature thresholds and any time the gradient temperature between the chip and the heatsink diminishes, heat becomes increasingly spread with surface conduction, dumping the heat onto the vrms. Poole Frenkel Effect starts taking place and what was a manageable heat load on the power circuitry becomes an issue, because some idiot thought running the heatsink at its maximum steady state was a good idea. Don't run the chip at an equal temperature with the heatsink, or convection will be overwhelmed by conduction/radiation inside the case.
 
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How you can call the new console quieter since it's using the Nidec fan which was already pointed in many reviews/videos as the worst of three? Like i said it's all about chassis vibration and coil whine. Even if I touch sometimes my side panels the noise it's less. The whole situation is really absurd at this point.

Also he is saying the new fan has more blades? Nidec has 17 and Delta/NMB has 23... I guess his old is with Nidec and his new came with some other brand.. like I said pure lottery.
 
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How you can call the new console quieter since it's using the Nidec fan which was already pointed in many reviews/videos as the worst of three? Like i said it's all about chassis vibation and coil whine.
Good point because Nidec designed the Gentle Typhoon with vibration suspension. They did it before and can do it again. People come to think Noctua as quieter - if Nidec had FDB and not ball bearings, they wouldn't have any difference in that compartment...

PS: again, I detest any notion such advances could be put to downscaling of the cooler. The deltas have to be consistent between chip-heatsink and heatsink-exhaust air temperature.

It is dangerous to let heat dissipation take the form of conduction instead of convection in any other way.

Not sure I made it specific enough: heat and reduced cooling capacity is what makes Poole Frenkel Effect deadly. Cooling margin diminishes exponentially while cooling capacity increases linearly, as the temperature elevates. I wonder what is the cooling break even temperature, but I don't suspect it is higher than before...
 
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You should know why Sony would cut the cooling down, their engineers probably figured out the cooling was just a bit too good and most likely would offer a long life and in todays world, a company just cant have people owning things for a long time without having to keep buying new ones. After all, how else will all the over priced execs pay for all their bullshit.

That ain't happening chief not in that universe , their cooling was already subpar as shown by GN testing . Seeing how big of a downgrade they have made , those unfortunate customers who received this new version can for sure expect some thermal throttling at which point if i was one of them i would ask my money back since they are paying same money ( if not more ) for less performance !

 
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That ain't happening chief not in that universe , their cooling was already subpar as shown by GN testing . Seeing how big of a downgrade they have made , those unfortunate customers who received this new version can for sure expect some thermal throttling at which point if i was one of them i would ask my money back since they are paying same money ( if not more ) for less performance !

GN just showed that the cooler didn't really touch the memory at all, using a steel plate to contact some of the memory chips. That hasn't changed, memory cooling is likely to be identically bad to previously, they just reduced the heatsink area for what it actually does cool meaningfully - the SoC.
 
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You stated that with negative implication. Once again, there nothing nefarious going on with this change. It's a refinement, seemingly a well engineered one. The complaining and nay-saying by many before actual comparative tests have been conducted is unwarranted.

I mean, less and smaller heatpipes, less and smaller fins and a lot less copper volume on the baseplate (as it turns out it was never a vapor chamber as I thought, just looks like one, might still help with thermal mass particularly for the memory on the other side but meh), I think it's hard to argue that the original wasn't better (might still not be but to me looks very much like it) and they definitely found a way to make it cheaper.

It might have been too good and had margins to be reduced but you're getting a worse product even if it's still fine (or the new might perform better, I doubt it but will wait on testing that is not just measuring an exaust temp.)


On topic but surprisingly left out of the discussion, the wifi module also changed but since the only info we have is it now uses 2 antenas instead of 4, it's better to leave it out anyway :D
 
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