Intel need to use solder the cpus specially these coat more than $200. Deliding is not a feature, it is a burden.
One thing all people forgetting is "Thermal Conductivity".
In heat transfer the thermal conductivity of a subtance is an intensive poperty that indicates its ability to conduct heat. It is measured in watts per meter-kelvin(W*m-1*k-1). A subtance with higher thermal contuctivity will transfer more heat that a subtance with lower thermal conductivity.
That is why at same size, a Copper radiator performes better than a Aluminium radiator (cause Copper’s thermal conductivity is 401 W*m-1*K-1 and Aluminium’s thermal conductivity is 237 W*m-1*K-1).
Also intel may have good engineers that doesn't mean other company don't have good engineers.
A moment before you jump off the deep end.
1) Thermal energy is conducted 3 ways; convection, conduction, and radiation.
2) Thermal conductivity, as expressed, is conduction. It depends upon an area of surface contact. Thermal pastes, and solder, are designed to maximize functional area of contact. They don't need to be great conductors, only increase surface area at a rate greater than they internally resist thermal energy transfer. This is why materials like toothpaste actually match or beat higher quality TIM in tests. The proof is in the interface not drying out, to maintain that heat transfer.
3) The best thermal pastes are still largely insulation. You bang on about how important the value is, without really understanding the application. Please, don't spread that kind of misunderstanding. Take this as a personal request, as half understanding often leads to wholly incorrect statements.
4) Here's a moment to consider what you're saying. If price is no object I can beat copper. It's simple to suggest platinum and a manufacturing process of fricatively welding rods to platinum plate. That would give us better performance, but the increase in performance doesn't match the huge increase in cost. Likewise, soldering is a huge cost for a few degrees, which "nobody" in their consumer base (namely business, not enthusiasts) will see. Why fix what is cheaper and demonstrably not broken?
To the other end of things.
Solder is a surface coating of liquified metals. These metals form a mechanical bond by flowing into the surface imperfections, and creating a connection. As the surface is being heated, and silicon isn't a great conductor, the components don't fry if soldered. This is different when heat is applied for a long time, and the internal components have enough energy transfer to fry.
This is the problem, and why soldering is costly. If you solder too long the chip fries, if you don't solder long enough the connection isn't made and thermal performance is poor.
Intel started using thermal paste because it's cheaper by an order of magnitude. Assuming that you can get the IHS to slightly deform under the pressure applied by the heatsink, you wind up with an interface that very closely matches that of the die. Why we're running into issues is that the dies and IHS are separated by too much distance. This is likely due to regular variability in production of the dies, and IHS plates. I'm just conjecturing here, but the push for lower prices generally leads to larger variation in quality. Intel is likely pushing for those sweet profit margins, given the fact that AMD has actually made demonstrable market progress (whether you appreciate Ryzen or not). Intel is always going to seek profit, and if they can cut a large cost while not negatively impacting their largest consumer base (namely business, not enthusiasts) it's a no-brainer.
If it isn't clear, I voted other. Intel needs to better control their IHS production, or their IHS to die bonding process. The TIM being replaced is interesting, but most people are forgetting that the very small amount of spacing from the adhesive (IHS to die) is being removed. That doesn't sound like a lot, but radiation<convection<conduction. I think that if Intel managed a closer bond, with their current paste, we'd see better performance. Not solder performance, but good enough that delidding wouldn't be a thing (the risk to reward would be too low).
I'm pulling a bit over 300W here, without any problems.
