Thermalright Also Shows off Massive HR-02 CPU Cooler

[HillBeast]

1.1Kgs isn't that bad, the TRUE Copper weighed in at 1.9Kgs and it didn't have problems with broken boards. The backplate spreads the load out over more surface area of the board, and makes heavy heatsinks like this not an issue.

I still don't like the idea though. I'd rather use a large heatsink like this in a bench system.

 

[newtekie1]

I still don't like the idea though. I'd rather use a large heatsink like this in a bench system.

That certainly is a valid preference. To each his own.

 

[pr0n Inspector]

1.1Kgs isn't that bad, the TRUE Copper weighed in at 1.9Kgs and it didn't have problems with broken boards. The backplate spreads the load out over more surface area of the board, and makes heavy heatsinks like this not an issue.

Backplates are for eliminating warping by redirecting pressure to directly under the socket. if the cooler is too heavy it could still warp the board by pulling the PCB within the four screw holes.

 

[newtekie1]

Backplates are for eliminating warping by redirecting pressure to directly under the socket. if the cooler is too heavy it could still warp the board by pulling the PCB within the four screw holes.

The backplate spreads the weight out over the back of the board, the PCB will not warp with a proper backplate.

 

[pr0n Inspector]

The backplate spreads the weight out over the back of the board, the PCB will not warp with a proper backplate.

A proper backplate should not "spread the weight out over the back of the board", it's suppose the "concentrate" the mounting pressure directly under the socket to avoid warping.

 

[Mussels]

"heatpipes are the same as watercooling, it just moves the heat away from the CPU so it can be dissipated elsewhere"

Well not entirely, water cooling does not involve phase change, where as heat pipes usually do, hence their good heat transfer properties.

Heat pipes usually have some liquid and a wick, and the liquid will evaporate when heated, and then when it cools it condenses on the wick and returns to the heat source to start the cycle all over. It's the phase change that produces the best heat transfer.

its the exact same principle. a fluid is used to absorb the heat and transfer it it to a radiator/heatsink so that the heat dissipation occurs further away from the CPU.

 

[stevednmc]

It seems to me that the only way to have a more efficient AIR heatsink and not be HUGE would be through metalurgy. If they come up with new materials with better thermal conductivity and lighter weight. Otherwise, they just get bigger and bigger, surface area is the name of the game here. Maybe come up with something dense like a car radiator? With all the twists and folds the surface area increases and therefore can dispirse more heat. Thats the only thing i can think of. Or...water cool!

 

[WarEagleAU]

Kind of favors my Scythe Mugen two just a little bit, and I mean a little bit. I like it though.

 

[newtekie1]

A proper backplate should not "spread the weight out over the back of the board", it's suppose the "concentrate" the mounting pressure directly under the socket to avoid warping.

Have you ever looked at a backplate? They touch the entire back of the board, not just under the socket. They are not to concentrate the mounting pressure directly under the stocket, they are to spread the weight and pressure out over a greater area of the board. If they wanted to concentrate the pressure behind the socket, the only place the backplate would touch would be behind the socket(think xbox x-clamp), but that isn't the case.

 

[HillBeast]

Have you ever looked at a backplate? They touch the entire back of the board, not just under the socket. They are not to concentrate the mounting pressure directly under the stocket, they are to spread the weight and pressure out over a greater area of the board. If they wanted to concentrate the pressure behind the socket, the only place the backplate would touch would be behind the socket(think xbox x-clamp), but that isn't the case.

The thing is, when have you even seen a backplate larger than the size of the area of the mounting holes. IT's worse on AMD boards because they usually have thinner backplates. The thing people keep refering to as to how tough CPUs are is Intels guidelines which is around 600N, which people assume is 60kgs, but when you put it in a tower you are applying torques to the CPU, and the socket equal to [the height of the cooler] * [the mass of the cooler] and also there is the pressure applied by the mounting system. It doesn't add up to 600N but it will be getting up there.

The backplate is supposed to put the pressure of the cooler onto the CPU so that it doesn't mount unevenly and makes sure it touches the CPU properly. It may spread it, but not much. The backplate still only has about 9-10cm of coverage.

 

[newtekie1]

The thing is, when have you even seen a backplate larger than the size of the area of the mounting holes. IT's worse on AMD boards because they usually have thinner backplates. The thing people keep refering to as to how tough CPUs are is Intels guidelines which is around 600N, which people assume is 60kgs, but when you put it in a tower you are applying torques to the CPU, and the socket equal to [the height of the cooler] * [the mass of the cooler] and also there is the pressure applied by the mounting system. It doesn't add up to 600N but it will be getting up there.

The backplate is supposed to put the pressure of the cooler onto the CPU so that it doesn't mount unevenly and makes sure it touches the CPU properly. It may spread it, but not much. The backplate still only has about 9-10cm of coverage.

Well on an Intel setup, the entire weight of the cooler is on the 4 holes, and only the 4 holes. That is almost no surface area of the board, I'll give you maybe 1cm^2 of surface. The backplate covering 9-10cm gives 9-10 times the surface area on the board that the weight is applied to. So, yes, the weight is spread out a lot accross the board.

With an AMD setup, there is already a backplate, however the coolers normally connect to the weak plastic frame. This is why I said a bold-thru kit is needed, as it eliminates the weak plastic, and puts the weight directly on the backplate.

If the backplates were designed only to put preassure on the CPU, then the only place they would touch on the motherboard would be the back of the CPU. This obviously isn't the case. In face, for the 775 and AM2 backplates, they actually are cut out so they don't touch behind the CPU socket, because there are components back there that would break if they did. Backplates are used to increase mounting pressure, I'm not denying that, but they are also used to spread the weight of the cooler out over more area of the board.

 

[Mussels]

newtekie has it right.


intel use the stupid push pins which put the pressure on the mobo, AMD use a backplate but due to the lever/hook design the pressure is on that, not the backplate.

 

[HillBeast]

newtekie has it right.


intel use the stupid push pins which put the pressure on the mobo, AMD use a backplate but due to the lever/hook design the pressure is on that, not the backplate.

They use push pins on the stock coolers. Hardly any tower coolers (none of the high end ones) use push pins. The only tower I've seen (but I haven't researched this) with push pins is the Freezer 7 PRo, but that's a feather It doesn't need a mounting system. This is 1.1KGs. IT needs a bracket, but that wasn't my point. My point is even with the bracket in place it is still too much pressure on the motherboard and CPU for my liking. I'd personally only use a tower this big on a bench system. Other people can go ahead and use something massive on their computers, but I won't.

Until we go back to like the early P4s where the heatsink was screwed onto mounting holes on the case rather than a bracket attached to the motherboard which will make sure there is no movement at all (unless your cases flexes because you're in a volcano), I have no intention of putting a big cooler like this in my computer.