Last week the first details of Dell's CAMM (Compression Attached Memory Module) made an early appearance courtesy of a product leak, but now official details have appeared and the good news is that Dell is saying it won't be a proprietary solution. The Compression Connector looks unlike anything used by consumer computers today and Dell is said to be hoping that it'll be the next industry standard for memory modules, according to PCWorld. The interposer mentioned in the previous news article is also mentioned and allows for a pair of DDR5 SO-DIMMs to be used, albeit with a much taller Z-height.

Dell is apparently planning on getting its CAMM approved by the JEDEC, which is the standards organisation when it comes to memory. However, even if the CAMM format is accepted as a JEDEC standard, Dell holds patents and is likely to charge some kind of royalty fees to interested parties. That said, if it becomes a JEDEC standard, Dell has to follow RAND or Reasonable and Non-Discretionary terms, so the royalty fees would have to be reasonable for JEDEC to agree on making CAMM a standard. The main benefit of Dell's CAMM is that the memory traces end up being shorter and more direct, since the CAMM has a single-sided interface, whereas SO-DIMMs are interfaced on both sides, just like standard DIMMs. This would allow for higher speed memory interfaces, without the need of using something like signal re-drivers or re-timers.

A leak with details about upcoming Dell notebooks has revealed that Dell's upcoming notebooks with DDR5 memory will feature a custom memory module that Dell calls CAMM, or Compression Attached Memory Module. The CAMM can support up to 128 GB RAM according to the leak and initial modules will support memory speeds of 4800 MHz. It's unclear if notebooks with CAMM support will have soldered down memory as well, but what is clear is that Dell is not looking at using traditional SO-DIMM type modules.

The first notebooks from Dell to feature the new module appears to be the Precision 7-series, which will also feature an Intel 55 W Alder Lake-HX series CPU, a choice of an NVIDIA RTX A5000 GPU or Intel Arc DG2 based graphics with a 90 W TDP, as well as up to 12 TB of NVMe storage over PCIe 4.0. Apparently Dell has developed what it calls DGFF or Dell Graphics Form Factor for these laptops, which suggests that they'll feature some kind of modular graphics solution. Considering that at least some models in Precision 7-series will sport 16-inch displays, there should be plenty of space for a GPU module, although it'll be interesting to see exactly what Dell is bringing to the table that's new here.

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, unveils the brand new B660MX-E PRO motherboard. Based on the Intel B660 chipset, the new B660MX-E PRO motherboard brings life to casual gaming and content consumption. Available with a set of great base features and functionality, BIOSTAR's B660MX-E PRO motherboard is one of the best entry-level motherboards in the market.

With solid support for Intel 12th generation processors, the B660MX-E PRO motherboard brings highly desirable features like PCIe 4.0, PCIe M.2.4.0 and Wi-Fi 6E enable versatile usability all around. 4 DIMMs of DDR4 high speed ram slots enable up to 128 GB DDR4 memory with boosted clock speeds up to 4600 MHz. A 10-phase power design controlled with BIOSTAR's signature digital PWM technology ensures stable power delivery across all components that protect and enhance hardware lifetime.

Leading global memory provider TEAMGROUP has been actively expanding in the industrial control field for many years. With the arrival of the new DDR5 generation, the company today announced the DDR5 ECC DIMM and DDR5 R-DIMM Industrial Server Memory modules. In recent years, there has been a steady growth in AI and HPC data applications, driving memory specifications toward higher capacities and greater performance. To meet this rising demand, TEAMGROUP has created multiple solutions with its latest innovations of DDR5 industrial server memory.

Its next-gen server memory modules can reach speeds of 6,400 MT/s, come with a maximum capacity of up to 128 GB, and operate at 1.1 V, resulting in lower overall power consumption. The memory also features two innovations in its power supply architecture and channel architecture. The new power supply architecture shifts power management from the motherboard to the DIMM itself, enhancing signal integrity and resistance to interference. The channel architecture is updated with two independent sub-channels per memory module (DIMM) to significantly improve memory access efficiency and meet the elevated demands of smart platform applications.

Chinese company Jiahe Jinwei owns a sub-brand of gaming-oriented products named after Norse mythology - Asgard. The company has now announced that the trial production for high-speed DDR5 modules using Micron's semiconductors has completed without issue, meaning that their roadmap is going through without a hitch. Of course, as with the introduction of any new DDR memory standard, operating frequencies are still in their nascent stage; Asgard currently is only offering 4,800 MHz DDR5 sticks, which the most premium DDR4 sticks can already surpass.

It's only a matter of time before DDR5 speeds accelerate however, and Asgard is already planning to launch 5600 MHz DDR5 kits as early as 2022. These should be available in 32 GB and 128 GB capacities with a CAS latency of 46 cycles. The next step in performance increase would look towards 6,400 MHz kits, but these should only be expected towards the end of 2022 and beginning of 2023, should the development continue to move along smoothly. All of the DDR5 memory speeds should still make do with a relatively puny 1.1 V.

As the industry is preparing for a shift to the new DDR standard, companies are trying to adopt the new technology and many companies are manufacturing the latest DDR5 memory modules. One of them is Shenzhen Longsys Electronics Co. Ltd, a Chinese manufacturer of memory chips, which has today demonstrated the power of DDR5 technology. Starting with this year, client platforms are expected to make a transition to the new standard, with the data center/server platform following. Using Intel's yet unreleased Alder Lake-S client platform, Longsys has been able to test its DDR5 DIMMs running at an amazing 6400 MHz speed and the company got some very interesting results.

Longsys has demoed a DDR5 module with 32 GB capacity, CAS Latency (CL) of 40 CL, operating voltage of 1.1 V, and memory modules clocked at 6400 MHz. With this being an impressive memory module, this is not the peak of DDR5. According to JEDEC specification, DDR5 will come with up to 8400 MHz speeds and capacities that are up to 128 GB per DIMM. Longsys has run some benchmarks, using an 8-core Alder Lake CPU, in AIDA64 and Ludashi. The company then proceeded to compare these results with DDR4-3200 MHz CL22 memory, which Longsys also manufactures. And the results? In AIDA64 tests, the new DDR5 module is faster anywhere from 12-36%, with the only regression seen in latency, where DDR5 is doubling it. In synthetic Ludashi Master Lu benchmark, the new DDR5 was spotted running 112% faster. Of course, these benchmarks, which you can check out here, are provided by the manufacturer, so you must take them with a grain of salt.

In the name of Odin, Chinese manufacturer Asgard has launched their first DDR5 memory modules to market - beating some competing western companies that are still "gearing up" for it. Owned by the much less interestingly-named Shenzhen Jiahe Jinwei Electronic Technology Co., Ltd., Asgard likewise lost some of its flair in naming these DDR5 sticks - the best they could do was VMA5AUK-MMH224W3. The modules will be available in 32 GB, 64 GB and 128 GB per-stick densities.

The initial modules don't have any flair - they're built with the same green PCB that's actually the forerunner of today's colored ones. The company hs also announced that the modules win run at a relatively mild 4,800 MHz (the DDR5 specification goes up to 8,400 MHz), and that its timings coincide with JEDEC's "B" classification, which should mean 40-40-40. The voltage likewise remains at the JEDEC-set standard of 1.1 V. The company announced that mass-production rollout will only occur after there are actual CPUs and platforms that can take advantage of the DDR5 memory spec, and said that they expect Intel's Alder-Lake, Sapphire Rapids and Tiger Lake-U from the blue team, as well as Van Gogh and Rembrandt APUs from the AMD camp. No word on consumer pricing was available at time of writing.

Greenliant has secured major design wins with its EnduroSLC solid state drives (SSDs) in a wide range of demanding, extreme environment applications for customers that need best-in-class reliability and product longevity. Greenliant's proprietary EnduroSLC Technology substantially enhances data retention and extends the write endurance of 1-bit-per-cell SSDs with advanced hardware ECC capabilities and NAND flash management algorithms. EnduroSLC SSDs not only offer superior data retention capabilities under complex temperature conditions, but also support 50K, 100K and industry-leading, ultra high 250K+ program-erase (P/E) cycles, which are at least a 5x improvement over pseudo-SLC (pSLC) SSDs and a 50x improvement over MLC NAND-based products.

For systems that are in remote locations and costly to maintain-from satellite to subsea communications-customers recognize the value of EnduroSLC SSDs; they can reliably operate and retain data for long periods of time in harsh conditions. Long-life, write-intensive products, such as transportation black box recorders and industrial data loggers, have also benefitted from the enhanced features of EnduroSLC SSDs. EnduroSLC storage products are designed with Greenliant's advanced SATA, NVMe PCIe and eMMC controllers, operate at industrial temperatures (-40 to +85 degrees Celsius) and are backed by the company's Long-Term Availability program (http://bit.ly/SSD-LTA-program), providing an extra level of support.

Running the ZFS-based QuTS hero operating system, the GM-1000 focuses on data integrity and features powerful block-level inline data deduplication and compression. Near-limitless snapshots, real-time SnapSync, and many more business-oriented features are also included to achieve reliable service-level agreement performance and Big Data storage.

"The GM-1000 features a unique dual-NAS architecture that delivers cost-efficient and space-saving advantages, ideal for offloading services between the two NAS nodes or running cross backup," said David Tsao, Product Manager of QNAP, adding "Its ZFS storage and performance makes it perfect for massive file storage, virtualization, and post-production with outstanding reliability and cost-effectiveness."

Kingston Digital, the flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the addition of 128 GB capacity options to three of its encrypted USB flash drives. The drives are part of a full line of encrypted solutions to suit customer needs of all levels.

Consumers and organisations have become more aware of data privacy and protection needs due to regulations such as GDPR and CCPA. Additional data security options have become a necessity as work-from-home increases. The simple inclusion of encrypted USB flash drives into a daily workflow is a simple step to ensuring data is safe. Whether it's personal, company or client information, finding the right encrypted drive can make all the difference between peace of mind and the worry of loss of data.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32 GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256 GB (32 GB x8), Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4), Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4), and Trident Z Neo DDR4-3800 C18 64 GB (32 GB x2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.

With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.

ZOTAC Technology, a global manufacturer of innovation, today launches the thin and powerful MAGNUS E Series ZBOX Mini PC for enthusiasts and creators to accelerate performance.

At just 62.2 mm / 2.45 in thin, the MAGNUS ZBOX Mini PC is re-engineered to empower the ideas of tomorrow into more attainable, tangible possibilities. The future of creating can be achieved on a thin and powerful compact system powered with a 9th Gen Intel Core processor and a discrete NVIDIA GeForce RTX graphics card. Equipped with premium connectivity, the all-new MAGNUS E Series Mini Creator PC enables everything from demanding workloads, creative workflows, home entertainment experiences, and virtual reality, gaming, and much more.

A report from technology market analyst Trendforce places SSD's pricing in sharp decline, with price per GB being projected to hit as low as $0.1 by year's end. Citing oversupply in the NADN flash market and an impending price war to allow manufacturers to sell out accumulating inventory, this is one of those clear cases of a win for consumers - which, after the shenanigans in the DRAM market, is about time. Trendforce further states that the price reductions should render 128 GB SSDs obsolete, as they mostly are by now, with 512 GB capacities becoming the mainstream choice for system integrators and DIY.

Pricing evolution in the market also places premium NVMe solutions at an only 6% premium over SATA offerings, showcasing the increased cost savings that manufacturers have achieved with the reduction in price for NVMe controllers, and the lower amount of physical materials needed to put an NVMe SSD together compared to a SATA-based alternative. Furthermore, Trendforce says that value PCIe-based solutions have a 0% price difference compared to SATA-based ones, so the option for the older form factor should only fall upon how many NVMe/PCIe sockets users' motherboards have available to populate.

DDR5 will be the next step in DDR5 memory tech, again bringing increased transfer speeds over the previous JEDEC (the standards body responsible for the DDR specifications) specification. The new memory technology will also bring the customary reductions in operating voltage - the new version will push the 64-bit link down to 1.1V and burst lengths to 16 bits from 1.2V and 8 bits. In addition, DDR5 lets voltage regulators ride on the memory card rather than the motherboard. CPU vendors are also expected to expand the number of DDR channels on their processors from 12 to 16, which could drive main memory sizes to 128 GB from 64 GB today.

DDR5 is being developed with particular attention to the professional environment, where ever-increasingly gargantuan amounts of addressable memory are required. One of the guiding principles over DDR5's development is a density increase (to allow 16 Gbit chips) that would allow for larger volumes of memory (and thus data processing) in the environments that need that. Reduced power consumption also plays a role here, but all of this will have a cost: latency. For end-users, though, this increased latency will be offset by the usual suspects (DDR memory companies such as Crucial, Corsair, just to name some started with the letter C) in tighter timings and increased operating frequencies. JEDEC's specification for DDR5 is set at 4800 MT/s, but it's expected the memory tech will scale to 6400 MT/s, and you know overclocking and performance-focused companies will walk all over the standard.

Gigabyte today announced they were expanding their SSD storage lineup (started with the UD PRO series SATA III SSDs) with M.2 solutions. The new SSDs transfer data under the NVMe protocol and carry the M.2 form factor, in 128 GB, 256 GB and 512 GB sizes.

According to Gigabyte's own product pages, the 256 GB version has a sequential read and write speed of up to 1200 MB/s and 800 MB/s, while the 128 GB model cuts those speeds down to 1100 MB/s read and 500 MB/s write.

Intel today released their mainstream answer to users' fast, NVMe-based storage needs, the SSD 760p. We've already covered this new consumer, mainstream SSD series in our news pieces; however, information and press decks have now come directly from Intel, allowing us a clearer picture of how Intel sees its products to fit into the consumer market - and hopefully, in consumer's choices.

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of 128GB DDR4 LRDIMMs, a new offering in its server memory product portfolio. The 128GB DDR4 LRDIMM is the highest density server memory module that Crucial has offered to date, and with speeds starting at 2666 MT/s, the new DDR4 server memory modules increase the installed memory capacity per server to help maximize CPU and server hardware capabilities.

Memory-dependent server applications like virtualization, in-memory database computing, and high-performance computing (HPC) require massive amounts of available RAM. These new server modules support a number of memory-intensive computing applications, such as Microsoft SQL, Oracle, Microsoft Azure, VMware VDI, Cloudera, Hortonworks and SAP HANA. Additionally, each module is 100 percent component- and module-tested to mission-critical server standards, ensuring quality from start to finish through a 34-stage manufacturing process and more than 100 tests and verifications. For qualified customers, the 128 GB LRDIMM server modules are also backed by the Crucial Reliance Program.

Following up on its CA3 NVMe SSD series launch from earlier this month, LiteOn introduced the new CV6 line of value SSDs featuring the SATA 6 Gbps interface. The drives come in 7 mm-thick 2.5-inch, and M.2-2280 form-factors (M-key), taking advantage of SATA 6 Gbps interface. The drives combine a Marvell 88SS1074 controller with Toshiba-made 3D TLC NAND flash memory. The controller features LDPC gen 3 error correction, and SLC caching, a feature with which it treats a small portion of the TLC NAND flash as SLC, juggling hot data in and out of it for more performance.

The 2.5-inch CV6 series is available in 128 GB, 256 GB, and 512 GB capacities, while the M.2 variant comes in 128 GB and 256 GB. All variants offer sequential transfer rates of up to 520 MB/s reads, with up to 450 MB/s writes. The 256 GB and 512 GB variants offer 4K random read performance of up to 85,000 IOPS, while the 128 GB variant offers 58,000 IOPS. 4K random write performance is rated at 28,000 IOPS for the 2.5-inch 128 GB variant, 30,000 IOPS for the M.2 128 GB variant; and up to 45,000 IOPS for both the 256 GB and 512 GB variants. The company didn't reveal pricing.

Phison has been working hard towards bringing to market a new, budget SSD controller in the form of its Phison E8 solution. The controller was designed with the purpose to try and dethrone Intel's 600p solutions from the budget, entry-level NVMe options, through offering increased performance at the same affordable prices. To do this, and so as to decrease power consumption, Phison opted for a PCIe 2x support for the E8 - this means the company is trading burst performance for decreased power consumption. E8-based SSDs are expected in capacities of 128 GB, 256 GB, 512 GB, and 1 TB, with prices lower than the current 600p and Phison's own E7-based products like the MyDigitalSSD BPX.

The Phison E8 controller should still offer plenty of increased performance over a typical HDD, and has been designed to work with 3D NAND technology. even with the firmware in its non-final stages, Tom's Hardware is reporting that the Phison E8's performance is already higher than Intel's 600p and WD's Black PCIe solutions. As we all know, though, firmware optimizations are paramount to SSD controllers' performance, so we can only expect these performance numbers to go up. All in all, it seems we'll have yet another low-cost NVMe SSD solution in the market, though desktop users will likely opt for a PCIe 4x solution, since that environment doesn't care about power consumption as much as a mobile solution would.

BIOSTAR has announced an evolution of their G300 SSDs that it introduced in August 2016. The new, revised G330 series maintains the overall design from the series it supersedes, but upgrades the controller to an SMI 2258 (from an SMI 2256). They're built on Micron's 3D TLC NAND, with a DRAM cache that boosts performance, and come in three different capacities (128, 256 and 512 GB) in a 2.5-inch form factor, with a 6.8 mm height.

The drives feature read speeds up to 565MB/s and write speeds up to 515MB/s over a SATA 6Gb/s interface, and come with a MSRP of $59 for the 128GB model (G330-128GB), $99 for the 256GB model (G330-256GB), and $169 for the 512GB model (G330-512GB).

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to release new ultra-high capacity Trident Z RGB DDR4 memory kits based on 16 GB modules designed for Intel X99 and Z270 platforms.

Since the widely-acclaimed launch of Trident Z RGB memory series in December 2016, G.SKILL focused heavily on bringing high performance DDR4 16 GB RGB modules to the Intel X99 platform. Now, the Trident Z RGB is available in full sets of 8 modules for a total of 64 GB (8 GB x8) or 128 GB (16 GB x8) capacity, along with lighting control software support for the Intel X99 platform from most major motherboard vendors.

At CES 2017, Plextor announced their next SSD product line. Dubbed the M8Se, these will be restricted to NVMe SSDs with 15nm 3-bit-per-cell TLC of Toshiba manufacture, ranging from 128 GB, 256 GB, 512 GB and 1TB capacities leveraged by Marvell's Eldora controller.

The new mid-range NVMe SSD uses a new heatsink design (slight cost-reduction when compared with the one the M8Pe carries), that Plextor says will improve cooling by up to 20% - convenient, since throttling does happen with NVMe based SSDs - and particularly with Marvell's Eldora controller - as it did with Plextor's M8Pe line of SSDs. The card also features blue accent lighting. Plextor will also sell a heatsink-less M8PeGN model in the M.2 form factor.