ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive Lineup for AI and HPC Success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that are powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

Today, IBM introduced the new IBM Storage Scale System 6000, a cloud-scale global data platform designed to meet today's data intensive and AI workload demands, and the latest offering in the IBM Storage for Data and AI portfolio.

For the seventh consecutive year and counting, IBM is a 2022 Gartner Magic Quadrant for Distributed File Systems and Object Storage Leader, recognized for its vision and execution. The new IBM Storage Scale System 6000 seeks to build on IBM's leadership position with an enhanced high performance parallel file system designed for data intensive use-cases. It provides up to 7M IOPs and up to 256 GB/s throughput for read only workloads per system in a 4U (four rack units) footprint.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products:

Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, today announced that its VectorPath accelerator card featuring a Speedster 7t FPGA has been certified by PCI-SIG for PCIe Gen 5 and is the first and only FPGA accelerated CEM add-in card certified for PCIe Gen 5 x16 at 32 gigatransfers per second (GT/s) on the PCI-SIG Integrator's list. VectorPath S7t-VG6 accelerator cards are designed to reduce time to market when developing high-performance compute and acceleration functions for AI, ML, networking and data center applications and are shipping today.

"Achronix continues to drive acceleration in the high-performance FPGA add-in card market," said Craig Petrie, Vice President at BittWare. "Achieving PCI-SIG Gen 5 certification is an important milestone. Our customers can be assured of the highest PCIe bandwidths and have confidence that VectorPath cards will interoperate with Gen 5 servers."

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).

MaxLinear Inc. today announced the availability of Panther III, the latest in the company's Panther series of storage accelerators. The company is showcasing this product at the Flash Memory Summit in Santa Clara, CA, August 2 - 4. Booth 111. Businesses need immediate access to larger and larger amounts of data and, at the same time, are faced with security and CAPEX costs challenges. With its 16 nanometer (nm) DPU architecture, Panther III provides breakthrough data reduction, encryption, deduplication, and data protection and sets a new standard in storage acceleration with a high throughput of 200 Gbps and ultra-low single-pass transformation latency.

Panther III opens new opportunities within the storage market, including all-flash-array and non-volatile memory express (NVMe) systems. As with previous generations of Panther products, Panther III offers powerful data reduction technology that intelligently offloads the CPU to open all tiers of storage to their full bandwidth potential with no CPU or software limitations. These capabilities enable intelligent and faster dataset delivery, high-performance analytics, and improved workload accuracy in fast-growing Edge to disaggregated computing of the public cloud.

In response to rising demand for increased bandwidth of network traffic, NEXCOM, a leading supplier of network appliances, has released a compact single-port 200GbE network interface card (NIC). NL 110FM-OS leverages the award-winning NVIDIA ConnectX -6 Dx SmartNIC silicon and a PCIe Gen4 interface that doubles the speed of data transfer, compared with the previous generation PCIe standard. The network connection is enabled through one QSFP56 port to utilize double-bit PAM4 data transmission, and the NIC card is compatible with NEXCOM's latest rackmount network appliances.

The sheer volume of data traveling over the IT network leaves service providers no other choice but to adjust to the new reality. One of the ways to solve the problem is to increase the number of servers and another is to migrate to more compact solutions based on the latest technologies. The first method will require purchasing additional servers, leading to maintenance personnel expansion and energy consumption growth, whereas the second method is simply to increase the bandwidth of existing network nodes. This latter option provides a greener solution and should be preferable for all CSPs whether or not they have environmental concerns in reducing their carbon footprint.

D-Link today launched the DIS-100G Series Industrial Unmanaged Ethernet Switches and DIS-200G Series Layer 2 Gigabit Industrial Smart Managed Ethernet Switches. The DIS-100G and DIS-200G are ideal product portfolios that provide an affordable, reliable, and powerful Ethernet solution. With a wide range of operating temperatures, a fanless design, and an IP30-rated metal enclosure, the switches were designed to be robust and withstand harsh environments. Dual power input ensures consistent power and operation, and alarm relay support allows for constant power supply monitoring and diagnostics. Their reliability and compliance with various industrial standards make the switches ideal for applications in city surveillance, ITS, and factory automation.

The compact DIS-100G Series Unmanaged Ethernet Switches include the DIS-100G-5W, DIS-100G-5SW, and PoE-ready DIS-100G-5PSW. The DIS-100G interfaces are equipped with 10/100/1000BASE-T ports, SFP port, and PoE to provide a wide selection of port densities and bandwidths. Installation is flexible, as the switches can be mounted on a DIN rail or on a wall using a wall plate. Plug-and-Play without setup and easy installation lower operation expenses.

The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today commended the IEEE 802.3 Ethernet Working Group on the approval of IEEE 802.3bs, Standard for Ethernet Amendment: Media Access Control Parameters, Physical Layers, and Management Parameters for 200 gigabit per second (Gb/s) and 400 Gb/s Operation. The specification of 200 gigabit Ethernet (200GbE) and 400 gigabit Ethernet (400GbE) operation across various interconnects will help satisfy mounting bandwidth demands from cloud-scale data centers, internet exchanges, co-location services, service provider networks, and other bandwidth intensive application spaces, while delivering better economies of scale and lower cost-per-port performance.

"IEEE 802.3bs represents a transformational moment in the move to next generation of networks. The delivery of 200G and 400G is arriving just in time to meet growing needs for reliable, high-speed connectivity from a diverse array of applications and markets," said John D'Ambrosia, chairman, Ethernet Alliance; and senior principal engineer, Huawei. "The exceptional effort resulting in the completion of this standard is only the start of the industry's investment in the networks of tomorrow. We've laid a firm foundation for 200G and 400G with our early interoperability demonstrations and plugfests, but it's time to kick things into high gear. The real work of testing and verifying multivendor interoperability begins now, and the Ethernet Alliance is ready. We look forward to building on past successes, and helping accelerate 200G and 400G Ethernet's rollout and adoption."