Intel's upcoming Arc Alchemist lineup of discrete graphics cards generates a lot of attention from consumers. Leaks of these cards' performance and detailed specifications appear more and more as we enter the countdown to the launch day, which is sometime in Q1 of this year. Today, we managed to see a slide from @9950pro on Twitter that shows the laptop memory configuration of Intel's DG2 GPU. As the picture suggests, we can see that the top-end SKU1 with 512 EUs supports a 16 GB capacity of GDDR6 memory that runs at 16 Gbps speeds. The memory runs on a 256-bit bus and generates 512 GB/s bandwidth while having eight VRAM modules present.

When it comes to SKU2, which is a variant with 384 EUs, this configuration supports six VRAM modules on a 192-bit bus, running at 16 Gbps speeds. They generate a total capacity of 12 GBs and a bandwidth of 384 GB/s. We have SKU3 DG2 GPU going down the stack, featuring 256 EUs, four VRAM modules on a 128-bit bus, 8 GB capacity, and a 256 GB/s bandwidth. And last but not least, the smallest DG2 variants come in the form of SKU4 and SKU5, feating 128 EUs and 96 EUs, respectively. Intel envisions these lower-end SKUs with two VRAM modules on a 64-bit bus, and this time slower GDDR6 memory running at 14 Gbps. They are paired with 4 GB of total capacity, and the total bandwidth comes down to 112 GB/s.

China's technology reliance on 3rd party companies seems to be getting smaller. One of the leading technology companies in China, Huawei, has designed a laptop powered by a custom 5 nm Kirin SoC with DDR5 memory. Called the Dyna Cloud L420, Huawei has prepared this model for the Chinese market to provide a fully functional laptop that will get the job done, with no risk of the potential security backdoors implemented in the processor. Powered by a brand new Kirin 9006C SoC manufactured on TSMC's 5 nm process, it features eight unknown cores running at 3.1 GHz frequency. We assume that those are custom cores designed by Huawei. This SoC is accompanied by 8 GB of LPDDR5 memory, with 256 GB and 512 GB UFS 3.1 configurations storage options.

When it comes to the rest of the laptop, it rocks a 14-inch 2160x1440 display. I/O options are solid as well, as this machine has an HDMI video output, two USB-A, one USB-C, and Gigabit Ethernet using a mini-RJ45 port. Connectivity is provided by Wi-Fi 6 and Bluetooth 4.2. There is a 56 W/h battery that provides the juice to keep it running when it comes to the battery. And to complete all of that, this laptop officially only supports Huawei's proprietary Kirin OS (KOS) and Unity OS (UOS), with expected support for HarmonyOS in the future. Pricing and availability information is a mistery at the present date.

Contract prices of NAND Flash products are expected to undergo a marginal drop of 0-5% QoQ in 4Q21 as demand slows, according to TrendForce's latest investigations. Hence, the current cyclical upturn in NAND Flash prices will have lasted for only two consecutive quarters. Looking ahead, NAND Flash suppliers' capacity expansion plans will be affected by the outlook on future trends and the supply of other non-memory components. At the same time, attention will have to be paid to the demand projection. At the moment, NAND Flash suppliers appear likely to downsize their capacity expansion activities for 2022, resulting in a 31.8% YoY increase in NAND Flash bit supply next year. Annual bit demand, on the other hand, is projected to increase by 30.8% YoY. With demand being outpaced by supply and competition intensifying among suppliers for higher-layer products, the NAND Flash market will likely experience a cyclical downturn in prices in 2022.

The Apple M1 processor features integrated memory directly on the chip to reduce latency, power, and size. While this design may be good for the overall user experience it does not bode well for upgradability requiring users to pay up for a more expensive model. Some Chinese engineers have recently shown how it is possible to upgrade the soldered memory and storage components given you have the time, skills, and money. The DRAM and NAND chips are soldered to the M1 chip and motherboard but can be removed and replaced with higher capacity chips using a specialty soldering station. The engineers upgraded the base model M1 Mac Mini with 8 GB RAM and 256 GB storage to 16 GB RAM and 1 TB storage. The upgrade didn't require firmware modifications according to the source which is very impressive if true.

Samsung today has officially taken the lid off their latest consumer-oriented SATA SSDs, the 870 EVO. The 870 EVO series from Samsung don't push the maximum storage density ceiling on traditional SATA consumer drives, topping out at a maximum 4 TB, but they do achieve that ceiling whilst making use of Samsung's 128-layer TLC (Triple-Layer-Cell) NAND, which offers increased endurance (and higher theoretical performance than) more widespread QLC-based SSDs (of which Samsung launched the 870 QVO back in July 2020).

Samsung quotes SATA sequential read and write speeds of 560 MB/s and 530 MB/s respectively, with a "variable SLC" cache (which means it decreases in maximum size as the available free drive space decreases). The drives are also quoted at 98K IOPS Random Read, and 88K IOPS Write, and feature the company's Intelligent TurboWrite to maintain the interface's SATA 6 Gbps saturation as long as possible before sustained performance degradation appears. Samsung claims the 870 EVO also delivers a nearly 38% improvement in random read speeds over the previous 860 model, and quotes a (TBW) rating of 2,400 TB (or a 5-year limited warranty, whichever comes first) for its 4 TB model. The 870 EVO is available in either 256 GB, 512 GB, 1 TB, 2 TB, or 4 TB capacities, with the drives' RAM buffer scaling almost accordingly (512 MB DDR3 for the 256/512 Gb models, 1 GB for the 1 TB, 2 GB for the 2 TB drive, and 4 GB for the 4 TB one. Pricing starts at $49,99 for the 256 GB model; 500 GB for $79.99, 1 TB for $139.99; 2 TB for $269.99; and 4 TB for $529.99.

Greenliant has secured major design wins with its EnduroSLC solid state drives (SSDs) in a wide range of demanding, extreme environment applications for customers that need best-in-class reliability and product longevity. Greenliant's proprietary EnduroSLC Technology substantially enhances data retention and extends the write endurance of 1-bit-per-cell SSDs with advanced hardware ECC capabilities and NAND flash management algorithms. EnduroSLC SSDs not only offer superior data retention capabilities under complex temperature conditions, but also support 50K, 100K and industry-leading, ultra high 250K+ program-erase (P/E) cycles, which are at least a 5x improvement over pseudo-SLC (pSLC) SSDs and a 50x improvement over MLC NAND-based products.

For systems that are in remote locations and costly to maintain-from satellite to subsea communications-customers recognize the value of EnduroSLC SSDs; they can reliably operate and retain data for long periods of time in harsh conditions. Long-life, write-intensive products, such as transportation black box recorders and industrial data loggers, have also benefitted from the enhanced features of EnduroSLC SSDs. EnduroSLC storage products are designed with Greenliant's advanced SATA, NVMe PCIe and eMMC controllers, operate at industrial temperatures (-40 to +85 degrees Celsius) and are backed by the company's Long-Term Availability program (http://bit.ly/SSD-LTA-program), providing an extra level of support.

Minisforum, the leading innovator of mini PC products, has just released their another new product: the EliteMini UM700 which comes with the AMD Ryzen 7 3750H CPU up to 4.0 GHz, 4 cores 8 threads, total cache 4 MB, equipped with Radeon RX Vega 10 10 cores Graphics with frequency up to 1400 MHz. A few months ago, MINISFORUM had launched DeskMini DMAF5 with an AMD Ryzen 5 3550H processor on INDIEGOGO, now DMAF has completed the shipment. UM700 is an upgraded version of DMAF5, with higher performance and more powerful.

With a one-click design you can easily make upgrades, EliteMini UM700 supports different types of storage expansions—2.5 inch SATA HDD Slot (SATA 3.0 6.0 Gb/s) and M.2 2280 NVMe SSD Slot (support up to 2 TB), you can mix and match between HDD and SSD to better meet your needs. With windows 10 pro pre-installed, intel Wi-Fi6, BT5.1 and triple output. which allows you to freely enjoy quick response speed.

ASRock Rack, a branch of ASRock focused on making server products, has today launched a new motherboard that can accommodate up to 64 core AMD EPYC CPU. Built on the new, proprietary form factor called "Deep Mini-ITX", the ROMED4ID-2T motherboard is just a bit bigger than the standard ITX board. The standard ITX boards are 170 x 170 mm, while this Deep Mini-ITX form extends the board by a bit. It measures 170 x 208.28 mm, or 6.7" x 8.2" for all of the American readers. ASRock specifies that the board supports AMD's second-generation EPYC "Rome" 7002 series processors. Of course, the socket for these CPUs is socket SP3 (LGA4094) with 4094 pins.

The motherboard comes with 4 DDR4 DIMM slots, of any type. Supported DIMM types are R-DIMM, LR-DIMM, and NV-DIMM. If you want the best capacity, LR-DIMM use enables you to use up to 256 GB of memory. When it comes to expansion, you can hook-up any PCIe 4.0 device to the PCIe 4.0 x16 slot. There is also an M.2 2280 key present, so you can fit in one of those high-speed PCIe 4.0 x4 M.2 SSDs. For connection to the outside world, the board uses an Intel X550-AT2 controller that controls two RJ45 10 GbE connectors. There are also two Slimline (PCIe 4.0 x8 or 8 SATA 6 Gb/s), and four Slimline (PCIe 4.0 x8) storage U.2 ports.

HyperX, the gaming division of Kingston Technology, Inc., today announced the release of new and updated speeds and capacities for HyperX Predator DDR4 RGB and HyperX FURY DDR4 RGB memory modules and kits. Featuring memory kits up 256 GB and speeds up to 4600MHz1, the Predator DDR4 RGB and FURY DDR4 RGB memory modules are designed to pass rigorous certification test procedures and are Intel XMP certified and AMD certified Ready for Ryzen.

HyperX Predator DDR4 delivers fast frequencies and low latencies with speeds up to 4800MHz1 and latencies from CL12 to CL19. Predator DDR4 utilizes a black aluminium heat spreader and matching black PCB to complement the look of the latest PC builds. Predator memory is available in 8 GB, 16 GB and 32 GB single modules and in kits of two, four, and eight.

Micron Technology, Inc., today announced new client solid-state drives (SSDs) that bring NVMe performance to client computing applications, freeing laptops, workstations and other portables from legacy architectures that can rob devices of battery power, performance and productivity. The Micron 2300 SSD combines the power and density needed to drive compute-heavy applications in a compact form factor with the reduced power consumption modern mobile users demand. For the first time, Micron brings together NVMe performance and low-cost quad-level-cell (QLC) NAND in the Micron 2210 QLC SSD. It combines fast NVMe throughput and Micron's leadership in QLC technology to offer flash capabilities at hard disk drive-like price points while reducing power consumption by 15 times when compared to hard drives.

HP is reportedly looking to releases a next-generation storage device in the form of the EX900 pro SSD. Next-generation because this SSD will ship with the NVMe 1.3 protocol over a PCIe 3.0 interface (4x). HP is quoting maximum sequential read and write speeds set at 2095 MB/s and 1965 MB/s for the 1 TB version, which will obviously be the best-performing among offered capacities (256 GB and 512 GB). Random read and write IOPS are quoted at 283 K and 286 K, respectively. Apparently, the EX900 Pro features an independent cache design, though the original report is extremely scarce on details; for this to be relevant, it should be something different from the usual DRAM and SLC-caching that is usually employed by the best-performing SSD drives.

The EX900 Pro will ship with 3D NAND of unspecified layer topology, though the 5 year warranty given across the board is a welcome sight; TBW ratings are set at 650 TBW for the 1 TB version, 320 TBW for the 512 GB, and 160 TBW for the 256 GB one. The NVMe-based SSD will also offer support for NANDXtend error correction code (ECC) technology, SRAM ECC and end-to-end data path protection technology. No word on pricing or availability was available at time of writing.

Organizations around the world trust their sensitive data to Kanguru Defender Hardware Encrypted Flash Drives for their flexibility, mobility, and security. Kanguru expands on the Defender family with new 256 GB high-capacity drives to help security-conscious organizations get the most out of their investment.

With new 256 GB capacities on Kanguru Defender hardware encrypted USB flash drives, users can freely load enormous amounts of information on a single drive, without the worry of sensitive data getting into the wrong hands. Defender encrypted flash drives maintain the highest military-grade standards for secure data storage, with AES-XTS 256-Bit hardware encryption, FIPS 140-2 Certification, remote management capability, digitally-signed secure firmware and tamper-proof protection.

AMD today updated its Product Change Advisory with notes that its StoreMI software won't be available for download anymore. "AMD has decided to end-of-life the current version of the StoreMI technology, and effective March 31, 2020, AMD will no longer make this technology available for download on AMD.com. End users who download the current version of the StoreMI technology prior to March 31, 2020 may continue to use it thereafter (i.e. it will not be deactivated) but AMD will no longer provide any technical or end user support. Instead, AMD will focus its internal development resources on a replacement solution with a rearchitected feature set and a planned release window of 2Q20." - says the AMD Product Change Advisory website.

AMD's StoreMI technology offered users an option to combine up to 256 GB of SSD memory with a slower HDD, to provide "SSD like speeds with HDD like capacity", and it was supported from the second generation Ryzen processors until the current third generation, Ryzen 3000 series CPUs. Given that AMD is working on a replacement solution that is coming out in Q2, we expect that the new solution will be a better and more usable one, so we will report on it as soon as there is more information.

Cadence, a fabless semiconductor company focusing on the development of IP solutions and IC design and verification tools, today posted an update regarding their development efforts for the 5th generation of DDR memory which is giving us some insights into the development of a new standard. The new DDR5 standard is supposed to bring better speeds and lower voltages while being more power-efficient. In the Cadence's blog called Breakfast Bytes, one of Cadence's memory experts talked about developments of the new standards and how they are developing the IP for the upcoming SoC solutions. Even though JEDEC, a company developing memory standards, hasn't officially published DDR5 standard specifications, Cadence is working closely with them to ensure that they stay on track and be the first on the market to deliver IP for the new standard.

Marc Greenberg, a Cadence expert for memory solutions was sharing his thoughts in the blog about the DDR5 and how it is progressing. Firstly, he notes that DDR5 is going to feature 4800 MT/s speeds at first. The initial speeds will improve throughout the 12 months when the data transfer rate will increase in the same fashion we have seen with previous generation DDR standards. Mr. Greenberg also shared that the goals of DDR5 are to have larger memory dies while managing latency challenges, same speed DRAM core as DDR4 with a higher speed I/O. He also noted that the goal of the new standard is not the bandwidth, but rather capacity - there should be 24Gb of memory per die initially, while later it should go up to 32Gb. That will allow for 256 GB DIMMs, where each byte can be accessed under 100 ns, making for a very responsive system. Mr. Greenberg also added that this is the year of DDR5, as Cadence is receiving a lot of orders for their 7 nm IP which should go in production systems this year.

It's been a while since we've had a post on a Goodram product at TechPowerUp, with the company's releases mainly falling off the radar. However, the company's new PX500 series of NVMe SSDs are being positioned as value options in the segment, whilst being quoted with some respectable transfer speeds - provided you don't acquire the lowest capacity version. Available in 256 GB, 512 GB and 1 TB capacities, the Goodram PX500 are DRAM-less SSDs driven by Silicon Motion's SMI 2263XT controller.

Quoted numbers for the 256 GB version stand at 1,850 MB/s sequential read, 950 MB/s sequential write, 102,000 IOPS 4K random read and 230,000 IOPS 4K random write. The 512 GB version posts 2,000 MB/s, 1,600 MB/s, 173,000 IOPS and 140,000 IOPS in the same performance metrics, while the 1 TB version maxes out at 2,050 MB/s, 1650 MB/s, 240,000 IOPS and 280,000 IOPS, respectively. The Goodram PX500 series of NVMe SSDs are backed by a three-year warranty, and prices have not yet been announced.

Apple today updated MacBook Air, the world's most loved notebook, with faster performance, the new Magic Keyboard, twice the storage and a new lower price of $999, and $899 for education. The new MacBook Air delivers up to two times faster CPU performance and up to 80 percent faster graphics performance, letting customers breeze through daily activities and play more games. Now starting with 256 GB of storage, MacBook Air allows customers to store even more movies, photos and files. With its brilliant 13-inch Retina display for vivid images and sharp text, Touch ID for easy login and secure online purchases, spacious trackpad, and all-day battery life combined with the power of macOS Catalina, it's the best MacBook Air ever made.

"From students and consumers buying their first computer to customers looking to upgrade, everyone loves the Mac, and they especially love MacBook Air. Today we're giving it a huge update, with two times faster performance, the new Magic Keyboard, double the storage, a new lower price of $999 and an even lower price of $899 for education," said Tom Boger, Apple's senior director of Mac and iPad Product Marketing. "With its stunning, thin and light design, brilliant Retina display, all-day battery life and the power and ease-of-use of macOS, MacBook Air is the world's best consumer notebook."

PATRIOT, a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, is pleased to announce the official launch of P300 Gen3 x4 NVMe m.2 SSD with capacities available from 256 GB up to 1 TB. The P300 is designed to deliver the most significant all-around performance for desktop and laptop users. Built with next-generation PCIe Gen3 x4 NVMe controller and best-in-class components, the P300 is posed to bring out rapid data transfer speeds and best in class reliability for the user. P300 represents a milestone for the next generation of PCIe Gen3 x4 NVMe SSD, which can offer 25% higher transfer speeds better IOPs over standard PCIe 3 x2 solutions and attribute to its low power consumption is the best solution for laptop battery endurance.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce an all-new high capacity, low-latency memory kit, Trident Z Neo DDR4-3600 CL16-20-20 256 GB (32GBx8) 1.35 V, for the latest AMD Ryzen Threadripper 3990X processor. Built with the latest high-density 16Gb components, this new DDR4 memory specification offers a perfect choice for those pursuing ultimate memory performance or attempting to build a powerful workstation for heavy content creation workloads.

With the ultra-high kit capacity of 256 GB, G.SKILL is now pushing the performance boundary of 32 GB modules to a high level of DDR4-3600 on the high core-count AMD Threadripper platform. Optimized to unlock the full potential of the newest AMD 64-core processor, the Trident Z Neo DDR4-3600 CL16 256 GB (32 GB x8) has been validated with the AMD Ryzen Threadripper 3990X processor and the ASUS ROG ZENITH II EXTREME ALPHA motherboard, as shown in the screenshot below.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory kit specification based on 32 GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series. Available in 256 GB (32GBx8), 128 GB (32GBx4), and 64 GB (32GBx2) kit capacities for quad-channel and dual-channel platforms, these new DDR4 memory specifications are built with the latest high-density 16Gb components and provide the perfect mix of extreme performance and high memory capacity.

DDR4-3200 CL14 has always been the ultimate sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-performance efficiency to the latest 32 GB high-capacity DDR4 modules. Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) memory kit capacity can be seen validated in the screenshots below with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.

Gigabyte today announced they were expanding their SSD storage lineup (started with the UD PRO series SATA III SSDs) with M.2 solutions. The new SSDs transfer data under the NVMe protocol and carry the M.2 form factor, in 128 GB, 256 GB and 512 GB sizes.

According to Gigabyte's own product pages, the 256 GB version has a sequential read and write speed of up to 1200 MB/s and 800 MB/s, while the 128 GB model cuts those speeds down to 1100 MB/s read and 500 MB/s write.

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today a 256 GB capacity addition to its 'Canvas' React Flash memory microSD card line. With the new capacity consumers will now have a complete range from 32 GB to 256 GB to fit their storage and performance needs.

Kingston's Canvas React line of microSD cards are designed to be the solution shooters need when capturing photos continuously in burst mode or stunning 4K video where the action does not stop. It gives users the flexibility to experience more and worry less about running out of space on their device. The cards are designed to deliver the speed, capacity, and durability needed for life's memories, even in the most extreme conditions. With Class 10 UHS-I U3 speeds up to 100 MB/s read and 80 MB/s write, users have the freedom to capture adventures in full HD or record in 4K on their DSLR, mirrorless camera or premium smartphone.

Sk Hynix has added to its product catalog single-die 16 Gb DDR4 memory chips, which should enable a two-fold increase in maximum memory capacity per single DIMM. This allows SK Hynix to sell same-capacity chips with fewer memory semiconductor dies, due to the increase in storage density, and to increase maximum memory capacity at the same memory die populations as before. The benefits are lower power consumption (due to the reduced number of memory dies to power), and the possibility of putting together either dual-ranked 64 GB modules, quad-ranked 128 GB LRDIMMs and octal-ranked 256 GB LRDIMMs. That last part is the most important: theoretically, the maximum amount of memory on top Intel or AMD server platforms could double, which could enable up to 4 TB RAM in EPYC systems, for example. And as memory-hungry as big data applications have become, there's ever need for higher memory capacity.

SK Hynix's 16 Gb DDR4 chips are organized as 1Gx16 and 2Gx8 and supplied in FBGA96 and FBGA78 packages, respectively. Current 16 Gb density speeds stand at DDR4-2133 CL15 or DDR4-2400 CL17 modes at 1.2 V. SK Hynix plans increase the available frequencies in the third quarter of this year, adding DDR4-2666 CL19 to the lineup.

Intel today released their mainstream answer to users' fast, NVMe-based storage needs, the SSD 760p. We've already covered this new consumer, mainstream SSD series in our news pieces; however, information and press decks have now come directly from Intel, allowing us a clearer picture of how Intel sees its products to fit into the consumer market - and hopefully, in consumer's choices.

Following up on its CA3 NVMe SSD series launch from earlier this month, LiteOn introduced the new CV6 line of value SSDs featuring the SATA 6 Gbps interface. The drives come in 7 mm-thick 2.5-inch, and M.2-2280 form-factors (M-key), taking advantage of SATA 6 Gbps interface. The drives combine a Marvell 88SS1074 controller with Toshiba-made 3D TLC NAND flash memory. The controller features LDPC gen 3 error correction, and SLC caching, a feature with which it treats a small portion of the TLC NAND flash as SLC, juggling hot data in and out of it for more performance.

The 2.5-inch CV6 series is available in 128 GB, 256 GB, and 512 GB capacities, while the M.2 variant comes in 128 GB and 256 GB. All variants offer sequential transfer rates of up to 520 MB/s reads, with up to 450 MB/s writes. The 256 GB and 512 GB variants offer 4K random read performance of up to 85,000 IOPS, while the 128 GB variant offers 58,000 IOPS. 4K random write performance is rated at 28,000 IOPS for the 2.5-inch 128 GB variant, 30,000 IOPS for the M.2 128 GB variant; and up to 45,000 IOPS for both the 256 GB and 512 GB variants. The company didn't reveal pricing.

Phison has been working hard towards bringing to market a new, budget SSD controller in the form of its Phison E8 solution. The controller was designed with the purpose to try and dethrone Intel's 600p solutions from the budget, entry-level NVMe options, through offering increased performance at the same affordable prices. To do this, and so as to decrease power consumption, Phison opted for a PCIe 2x support for the E8 - this means the company is trading burst performance for decreased power consumption. E8-based SSDs are expected in capacities of 128 GB, 256 GB, 512 GB, and 1 TB, with prices lower than the current 600p and Phison's own E7-based products like the MyDigitalSSD BPX.

The Phison E8 controller should still offer plenty of increased performance over a typical HDD, and has been designed to work with 3D NAND technology. even with the firmware in its non-final stages, Tom's Hardware is reporting that the Phison E8's performance is already higher than Intel's 600p and WD's Black PCIe solutions. As we all know, though, firmware optimizations are paramount to SSD controllers' performance, so we can only expect these performance numbers to go up. All in all, it seems we'll have yet another low-cost NVMe SSD solution in the market, though desktop users will likely opt for a PCIe 4x solution, since that environment doesn't care about power consumption as much as a mobile solution would.