TEAMGROUP today announces that T-FORCE VULCAN Z and DARK Z gaming memory will be the first to release the large capacity, 32 GB single stick memory. There are DDR4 2666 and DDR4 3000 two different frequency of memory modules available to offer desktop PC a complete selection of expansions. It can provide the powerful computer equipment with high storage speed and multitasking capabilities that creators need for video content creation and editing. It can also perfectly support all AMD and Intel's consumer platforms.

The invincible T-FORCE gaming series is your top choice in 2020 when it comes to large capacity upgrades. T-FORCE VULCAN Z and DARK Z, which are praised by the media around the world, will be the first to release the large capacity, 32 GB single stick memory. VULCAN Z launches DDR4-2666 MHz and DDR4-3000 MHz, two different frequencies of single channel kit and dual channel kit (32 GB X2). And DARK Z will mainly provide a DDR4-3000 MHz dual channel kit (32 GB X2). Consumers can choose a suitable specification based on their personal usage. Not only can process large files easily, but it can also upgrade capacity and handle multiple data computing at the same time. This can increase the applications of desktop computers.

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products,today announced its lineup of DDR4-3200 32 GB Low Profile industrial Mini-DIMMs. SMART has several new 32 GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases. SMART has been providing Mini-DIMM support for many years, offering customers long-term support as well as a solid roadmap of new higher-density, higher-speed options.

SMART's DDR4-3200 32 GB industrial Mini-DIMMs undergo stringent in-house environmental temperature screening to operate between -40 °C to +85 °C which makes SMART's DDR4 Mini-DIMMs an ideal solution for telecom and networking equipment being deployed under harsh operating conditions. Customized ruggedizing features can be added, such as conformal coating and anti-sulfur resistors to protect against toxic operating conditions or underfill for excessive vibration, all to allow reliable, long-term system operation.

At this year's CES, ASUS announced the latest addition to their TUG gaming lineup of laptops - two 15-inch TUF Gaming A15 and TUF Gaming F15, and two 17-inch TUF Gaming A17 and TUF Gaming F17. Being advertised as durable, high-performance gaming laptops, the TUF lineup is here to bring "unprecedented experience for the price" meaning that the pricing of these models will be more than adequate for what they offer. Inside these new machines are the latest mobile processors from both Intel and AMD. The "A" series, as it is called, is an AMD based solution that features Ryzen 4000 series of mobile processors, which can be configured to go up to 8 cores and 16 threads, while the so-called "F" series is based on Intel's 10th generation of Core processors, which can be configured to go up to 6 cores and 12 threads.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory kit specification based on 32 GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series. Available in 256 GB (32GBx8), 128 GB (32GBx4), and 64 GB (32GBx2) kit capacities for quad-channel and dual-channel platforms, these new DDR4 memory specifications are built with the latest high-density 16Gb components and provide the perfect mix of extreme performance and high memory capacity.

DDR4-3200 CL14 has always been the ultimate sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-performance efficiency to the latest 32 GB high-capacity DDR4 modules. Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) memory kit capacity can be seen validated in the screenshots below with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of the XPG Hunter DDR4 memory module. Geared toward PC enthusiasts and gamers, the XPG Hunter delivers all the benefits of DDR4 with remarkable performance and efficiency. It supports XMP 2.0 for easy overclocking and offers great stability, making it ideal for performance seekers - gaming to competitive benchmarking. It comes in U-DIMM and SO-DIMM variants to meet the needs of desktop and notebook users alike.

The XPG Hunter modules are made with high-quality chips selected through a strict filtering process. They are equipped with the finest PCBs and pass rigid reliability and compatibility tests to ensure longevity and rugged durability, which are vital for overclocking, gaming, and extreme benchmarking. The modules deliver high-speed performance of up to 3200 MHz and comes with capacities of 4 GB, 8 GB, 16 GB, or 32 GB to meet the needs of diverse users and budgets.

The leading global motherboard & graphics card manufacturer, ASRock, a pleasure to launch brand new compact Mini PC - Mars Series. Supports up to Intel Core i5 Quad-Core processor, 32 GB DDR4-2666 MHz, PCIe NVMe M.2 SSD, 2.5-inch hard drive, and wireless connectivity; all implies into 0.7-liter chassis with 26 mm height.

ASRock Mars offers abundant USB devices connectivity, features a total of 7 USB ports, including one Type-C port; In addition, the native SD card reader and dual display outputs to provide more productive and convenience.

TEAMGROUP releases large-capacity memory Elite / Elite PLUS DDR4 32 GB for audio and video creator upgrade selections. ELITE DDR4 and Elite PLUS DDR4 are both 1.2 V memory module and massive 32 GB Kit capacity. In response to the trend of live streaming and the increasing number of digital contents, there are many other high-quality products available for creators with a full range of upgrade options.

The improvement of the specifications of built-in memory and hard drive is very important for meeting creators' needs for computer upgrades. TEAMGROUP releases the large capacity memory Elite/Elite PLUS DDR4 32 GB; it also works with MP34 M.2 PCIe Solid State Drive that has the new generation PCIe Gen3 x4 high speed interface and the latest NVMe1.3 protocol. Even under multitask processing, 1 TB of high capacity and up to 3000/2600 MB/s of excellent read/write speed can still provide stable and smooth use experience.

Team Group launched its first 32 GB memory module, the Team Elite TED432G2400C1601. This is a dual-rank DIMM with eight 32 Gbit DRAM chips, with a rated clock-speed of DDR4-2400, and timings of 16-16-16-39, and module voltage of 1.20 V. The module features a simple black PCB of standard height (32 mm), and comes without any heatspreader or heatsink.

Team Group is also selling a 64 GB (2x 32 GB) dual-channel kit with two of these DIMMs, which bears the SKU TED464G2400C16DC01. To use these modules, you'll need either a 9th generation or 10th generation Intel Core processor, or 3rd generation AMD Ryzen, as 32 GB dual-rank DIMMs are unlikely to be supported by older processors. Team Group is backing these modules with lifetime warranty, and is likely to price the 32 GB single-module at USD $150, and the dual-channel kit at $300.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32 GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256 GB (32 GB x8), Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4), Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4), and Trident Z Neo DDR4-3800 C18 64 GB (32 GB x2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.

With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.

Samsung's B die has been widely known as a good, high performance variant of DRAM memory, loved by overclockers because of its ability to get to a high frequency with relatively low timings. However, B die has been discontinued and now Samsung started offering its replacement in form of the newly developed A die manufactured in 1z nm (1z class) lithography process. Despite the lack of technical details surrounding the new die type, Hardwareluxx has received a tip from its reader about new RAM offering that incorporates A die memory.

The M378A4G43AB2-CVF, as it is called in the listing, is a 32 GB, single dimm DDR4 RAM with operating speed of 2933 MHz and CL21-21-21 timings. This particular offer isn't something to be excited about as the frequency is good, but the timings are quite high for that speed. Given that we don't know where the A die is targeted at, we can speculate that its current aim is at mid-tier systems, where the mediocre performance is okay and the system isn't suffering (performance wise) because of it. Nonetheless this find is quite interesting as it gives first hints at what can we expect in therms of future A die DRAM offerings. Remember, it took some time for B die as well to get to the level of performance we have today, so it is entirely possible that A die will improve and try to aim for greater performance level than it currently has.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing a highly optimized, extremely low latency Trident Z Neo series DDR4-3800MHz CL14 RGB memory kit in 16 GB (8 GB x2) and 32 GB (8 GB x4) capacities for the AMD Ryzen 3000 series CPU and X570 chipset platform. Built with the powerful Samsung B-die component, this is the perfect DDR4 memory kit for those looking to push the limits of memory bandwidth on your new AMD Ryzen 3000 platform.

At this point, it's well-known that memory performance with the new AMD Ryzen 3000 processor series is best when Infinity Fabric being tied to the memory clock at a 1:1 ratio. The G.SKILL R&D team is dedicated to push the performance boundaries even further and developed a high-frequency, low-latency memory kit at DDR4-3800 CL14-16-16-36 in capacity configurations of 8GBx2 and 8GBx4, reaching a superb memory bandwidth performance under the optimal 1:1 ratio.

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today announced the addition of 32 GB modules to its range of VENGEANCE LPX high-performance DDR4 memory, allowing PC builders to equip their systems with more DDR4 memory than ever before. VENGEANCE LPX has long been a premiere choice for custom PC builders looking for high frequencies and ambitious overclocks, and that tradition continues with the launch of 32 GB modules - the first time that such a capacity of premium DRAM has been made widely available to consumers in a standard size DDR4 module.

The new modules feature the same craftsmanship and quality that CORSAIR customers expect from the VENGEANCE LPX name. Thoroughly tested for wide compatibility with most current DDR4 motherboards, designed for high-performance overclocking with a pure aluminium heatspreader, and available in multiple colors to match your system's look, VENGEANCE LPX 32 GB DDR4 modules set the standard for enthusiast memory. Launching in frequencies of 2,400 MHz and 2,666 MHz in kits of 1x, 2x,4x and 8x modules, or 3,000 MHz in kits of 1x and 2x modules, you'll be sure to find a configuration to fit your custom PC and take its memory capacity up to 128 GB on mainstream 4-DIMM slot, and up to 256 GB on high-end desktop 8-DIMM slot motherboards.

ZADAK announces the very first double capacity DDR4 featuring personalized AURA2 RGB lighting which was built ahead of many competitors, the SHIELD DC(Double Capacity) DDR4. Co-developed with ASUS ROG team, it amazingly supports small form factor motherboards of Intel Z390 including ROG MAXIMUS XI APEX, MAXIMUS XI GENE, and ROG STRIX Z390-I Gaming. With the whole new architecture, it achieves not only double capacity of 32GB for single slot, but also high frequency of 3600MHz with impressive stability. Such a widely praised high-end memory module in the PC world comes along once in a lifetime.

The next step in Intel's Optane product launch could be right around the corner, as retailers have started listing the company's upcoming Optane MEM M10 cache drives up for pre-order. If you'll remember, these products were first leaked in some Intel product roadmap slides, where they appeared identified as "System Acce. Gen 1.0". Whether or not today's workloads and faster SSD-based storage require the introduction of a faster caching solution is up for debate; however, Intel seems to think there is room in the market for these caching solutions, even if the vast majority of users would be much better served by acquiring a higher capacity SSD as their primary drive (especially if they're coming from the HDD world).

These new Optane MEM M10 cache drives will come in capacities ranging from 16 GB to 64 GB. The M10 modules will take the M.2 2280 form-factor and deliver data through the PCIe 3.0 interface. Prices are being quoted at $47.58 for the 16 GB model, $82.03 for the 32 GB model, and $154.37 for the largest, 64 GB model. These should ensure lower latency and higher throughput than traditional SSDs do, due to their caching of users' more heavily requested data; however, due to the very nature of these caching solutions, and the memory footprint available for them, it's likely most users will hit severe performance bottlenecks, at the very least, on the 16 GB model.

At the SC17 show, Micron Technology, Inc., today announced a new 32GB NVDIMM-N offering twice the capacity of existing NVDIMMs, providing system designers and original equipment manufacturers (OEMs) with new flexibility to work with larger data sets in fast persistent memory. The solution is architected to support the increasing performance, energy efficiency and uptime requirements of data analytics and online transaction processing applications. Compared to server configurations using traditional far storage, deploying NVDIMMs can deliver up to 400 percent performance benefits.

As data center storage volumes grow, database queries increasingly need key datasets to be retained in-memory to improve access speeds due to the rising business requirement for higher availability. Many businesses are seeing increased value in placing fast memory near the processor to reduce the need to transfer data from far storage.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of two new offerings in its server memory product portfolio: 32 GB DDR4 VLP RDIMMs and 64 GB DDR4 LRDIMMs. With speeds of 2400 MT/s and engineered to enable higher densities by implementing a dual stack of 8 Gb DDR4 DRAM die to engineer a single 16 Gb component, these new DDR4 server memory modules allow for increased memory density, performance and bandwidth.

The 32 GB VLP RDIMMs are the highest density server memory modules Crucial offers for that module form factor, and are almost half the height (40 percent shorter) of a standard RDIMM module. These high density modules help enable memory dense systems like blade servers and microservers without compromising performance. Additionally, they can be installed at a 90-degree angle to the motherboard in these height-constrained systems, which enables better airflow to keep the system cool..

At the 2016 National Association of Broadcasters (NAB) Show, AMD announced the new AMD FirePro W9100 32 GB -- the world's first workstation graphics card with industry leading 32 GB memory support for large asset workflows with creative applications planned for availability in Q2 2016. AMD also introduced the AMD FireRender plug-in for Autodesk 3ds Max, which enables VR storytellers to bring ideas to life through enhanced 4K workflows, photorealistic rendering functionality, and powerful creation support.

"The imagination of the creator is limitless so much so that the professional creator consumes all available resources to produce new and never before seen designs and experiences. Some professional creative workflows demand very high bandwidth memory subsystems while others demand high memory size. AMD pioneered the era of High Bandwidth and Ultra Efficient Memory through the introduction of HBM technology in 2015 and will bring it to content creators with the introduction of Radeon Pro Duo graphics. With the new AMD FirePro W9100 32 GB, AMD is unleashing the world's largest memory size professional workstation graphics card," said Raja Koduri, senior vice-president and chief architect, Radeon Technologies Group (RTG), AMD. "Along with exceptional hardware, AMD is also delivering software tools to leverage our high bandwidth and large memory GPU configurations effectively."

Apacer is pleased to announce its groundbreaking achievement in DDR history, BLADE FIRE DDR4 with heartbeat LED, perfectly for gaming, overclocking, and M.O.D enthusiasts. It is astonishing to see speed at 3200 MHz with LED pulsing at 44 beats per minute yet it is still consuming low voltage at 1.35V. It is compatible with Intel Z170 platforms, providing unprecedented performance and energy-saving efficiency. Backed by the world's best technology in industrial memory module and storage, BLADE FIRE DDR4 makes users on fire in the gaming/ overclocking star-war.

The world-class BLADE FIRE DDR4 is an advanced generation of Blade DDR4 which was published in Feb 2015, featured a sensational armory design on heat spreader as well as LED lights heartbeat effect. The meticulously screened ICs allow the optimized stability and compatibility while playing in the heavy workload games. BLADE FIRE is available in 4 GB, 8 GB, and 16 GB capacities in dual-module package and comes equipped with total capacity of 32 GB (16 GB x2). The fastest memory kit available is clocked at 3200 MHz, and BLADE FIRE kits are ranged in four different clock speeds from 2400 MHz 1.2V to 3200 MHz 1.35V with 16-16-18-38. The XMP 2.0 support for simple overclocking setup delivers instant top-level performance for motherboards with Intel's 100 Series. Not only low latency for outstanding DDR4 performance but also lower power consumption with less heat and higher reliability provides users the fastest speeds and the highest stability when it comes to gaming and overclocking.

Toshiba Corporation today announced the expansion of its line-up of "FlashAir", the SDHC memory card with embedded wireless LAN communications, with the launch of the latest 32 GB card. The new card will go on sale on November 16th in the Japanese market, and sales in markets around the world will follow.

"FlashAir" is an SDHC memory card that incorporates a wireless LAN chip set plus an antenna for wireless communications. The card supports wireless sharing and transfers of photos from digital cameras to smartphones and tablets.

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has entered the removable solid state drive (SSD) market and is sampling its new mSATA ArmourDrive GLS86 product line. Based on SATA NANDrive, using Greenliant's internally developed NAND controller, mSATA ArmourDrive is designed for applications that require industrial temperature capability, high reliability and long-life data storage.

mSATA ArmourDrive operates at extreme temperatures between -40 to +85 degrees Celsius with 1-bit-per-cell (SLC) or 2-bits-per-cell (MLC) NAND flash memory, which gives customers a dependable, industrial temperature mSATA SSD using cost-effective MLC NAND. Addressing the needs of space-constrained embedded systems, mSATA ArmourDrive measures 29.85mm x 50.80mm x 4.80mm (JEDEC MO-300).

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced its completely redesigned Qosmio X75 enthusiast-class laptop and PX35t All-In-One Touchscreen Desktop Computer, two powerful entertainment hubs equipped with 4th generation Intel Core processors.

"These entertainment-driven PCs are designed to help consumers do more and be more productive with Windows 8," said Carl Pinto , vice president of marketing, Toshiba America Information Systems, Inc., Digital Products Division. "Both systems enable users to do everything from creating, managing and enjoying HD content, multitasking and playing graphics-intensive games with an amazingly responsive experience."

G.SKILL International Co. Ltd., the worldwide leading high performance memory designer and manufacturer, is pleased to announce the fastest, new DDR3 Memory Kit, "DDR3 3000MHz 32GB(4x8GB)"; it is the latest addition to the TridentX Series designed for the latest 4th Gen Intel Core Processors and Z87 system.

G.SKILL presents the ultimate speed of DDR3 3000 MHz C12 with up to 32GB (4x8GB) ultra high capacity. The following screen shows the kit passing Memtest pro with the low voltage of 1.65v, this was achieved using an Intel 4770K processor and the ASUS Maximus VI Extreme.

Are you still spending your quality time waiting for your computer to boot up? Have you experienced lag problems while operating multiple applications? SP/Silicon Power, the world's leading provider of memory storage solutions, today introduces an addition of the Velox series 2.5" SATA III SSD - Velox V50 to solve your problems. The Velox V50 features the latest controller technology to provide a brand new computer experience in excellent performance and cost effectiveness for those who are about to retire their traditional hard drives.

Different from the other solutions in the market, SP Velox V50 is equipped with a brand new controller, delivering a more stable and more powerful user experiences. Combining with the latest firmware and advanced controller circuit design, Velox V50 is able to maintain a long-standing IOPS performance while using it under extended period.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

G.SKILL - world renowned for producing memory modules at extreme speeds, has once again proven as "a brand to be reckoned with" in the DDR3 memory sector by announcing the world's fastest DDR3 32GB Memory kit, adding 32GB kit to the world's dominating DDR3 Series - G.SKILL "Trident X." The new Trident X 32GB kit - F3-2800C11Q-32GTXD features 4 sticks of 8 GB memory modules, which will fit perfectly on Z77 chipset & IVY Bridge CPU, and it's also the one and only 32 GB Memory kit running @ 2800 MHz CL11 in the market today.

Being the first to introduce such large capacity memory kit running at an incredible speed of 2800MHz, G.SKILL continues to impress power users/professional overclockers by offering the best memory solution with highest quality.