As the industry is preparing for a shift to the new DDR standard, companies are trying to adopt the new technology and many companies are manufacturing the latest DDR5 memory modules. One of them is Shenzhen Longsys Electronics Co. Ltd, a Chinese manufacturer of memory chips, which has today demonstrated the power of DDR5 technology. Starting with this year, client platforms are expected to make a transition to the new standard, with the data center/server platform following. Using Intel's yet unreleased Alder Lake-S client platform, Longsys has been able to test its DDR5 DIMMs running at an amazing 6400 MHz speed and the company got some very interesting results.

Longsys has demoed a DDR5 module with 32 GB capacity, CAS Latency (CL) of 40 CL, operating voltage of 1.1 V, and memory modules clocked at 6400 MHz. With this being an impressive memory module, this is not the peak of DDR5. According to JEDEC specification, DDR5 will come with up to 8400 MHz speeds and capacities that are up to 128 GB per DIMM. Longsys has run some benchmarks, using an 8-core Alder Lake CPU, in AIDA64 and Ludashi. The company then proceeded to compare these results with DDR4-3200 MHz CL22 memory, which Longsys also manufactures. And the results? In AIDA64 tests, the new DDR5 module is faster anywhere from 12-36%, with the only regression seen in latency, where DDR5 is doubling it. In synthetic Ludashi Master Lu benchmark, the new DDR5 was spotted running 112% faster. Of course, these benchmarks, which you can check out here, are provided by the manufacturer, so you must take them with a grain of salt.

In the name of Odin, Chinese manufacturer Asgard has launched their first DDR5 memory modules to market - beating some competing western companies that are still "gearing up" for it. Owned by the much less interestingly-named Shenzhen Jiahe Jinwei Electronic Technology Co., Ltd., Asgard likewise lost some of its flair in naming these DDR5 sticks - the best they could do was VMA5AUK-MMH224W3. The modules will be available in 32 GB, 64 GB and 128 GB per-stick densities.

The initial modules don't have any flair - they're built with the same green PCB that's actually the forerunner of today's colored ones. The company hs also announced that the modules win run at a relatively mild 4,800 MHz (the DDR5 specification goes up to 8,400 MHz), and that its timings coincide with JEDEC's "B" classification, which should mean 40-40-40. The voltage likewise remains at the JEDEC-set standard of 1.1 V. The company announced that mass-production rollout will only occur after there are actual CPUs and platforms that can take advantage of the DDR5 memory spec, and said that they expect Intel's Alder-Lake, Sapphire Rapids and Tiger Lake-U from the blue team, as well as Van Gogh and Rembrandt APUs from the AMD camp. No word on consumer pricing was available at time of writing.

Stealth (a Sparton company), a leader in the industrial computer, displays and peripherals market, has released the new model WPC-905, a high performance rugged Waterproof PC computer that is completely sealed, surviving liquids, chemicals, dust and dirt intrusion and meeting IP67 environmental specifications

Fanless by design, this durable environmentally sealed small form factor PC features powerful 8th Generation Intel Celeron and Core Processors, solid state drives (SSD) with optional onboard RAID configurations and a wide ranging 9 - 48VDC power input making it a perfect fit for mobile and transportation based applications. The WPC-905 is RoHS, CE & FCC, EN50121-3-2, EN50155 certified and also incorporates TPM 2.0 (Trusted Platform Module) to provide increased hardware security.

Alienware, the gaming division of Dell Technologies, has today announced a lineup refresh, meaning that all of the existing products will get upgraded to versions with the latest hardware. And to start off, the company has equipped their thin and powerful Alienware m15 R4 and m17 R4 laptops with the latest hardware we saw announced just yesterday. The laptops are equipped with 12-phase voltage regulation modules to power the newest NVIDIA GeForce RTX 3000 series of mobile GPUs. To pair with a strong GPU, Alienware decided to use 10th generation Intel Comet Lake-H designs. These new laptops can be equipped with up to 4 TB of PCIe 3.0 NVMe SSD storage and up to 32 GB of 2933 MHz RAM. For display, options range from FHD LCD to a 4K OLED panel and 360 Hz refresh rate for the m17 R4 model.

In the upstream semiconductor industry, the major foundries such as TSMC and UMC are reporting fully loaded capacities, while in the downstream, the available production capacity for OSAT is also lacking, according to TrendForce's latest investigations. Given this situation, suppliers of NAND Flash controller ICs such as Phison and Silicon Motion are now unable to meet upside demand from their clients. Not only have many controller IC suppliers temporarily stopped offering quotes for new orders, but they are also even considering raising prices soon because the negotiations between NAND Flash suppliers and module houses over 1Q21 contracts are now at the critical juncture. The potential increases in prices of controller ICs from outsourced suppliers (IC design houses) are currently estimated to be the range of 15-20%.

With regards to the demand side, demand has risen significantly for eMMC solutions with medium- and low-density specifications (i.e., 64 GB and lower), for which NAND Flash suppliers have mostly stopped updating the NAND Flash process technology, while maintaining support with the legacy 2D NAND or the 64L 3D NAND process. This is on account of strong sales for Chromebook devices and TVs. As older processes gradually account for a lowering portion of bit output proportions from NAND Flash suppliers, these companies are exhibiting a lowered willingness to directly supply such eMMC products to clients. As a result, clients now need to turn to memory module houses, which are able to source NAND Flash components and controllers, to procure eMMC products in substantial quantities.

The percentage distribution of 2021 NAND Flash bit demand by application currently shows that client SSD accounts for 31%, enterprise SSD 20%, eMMC/UFS 41%, and NAND wafer 8%, according to TrendForce's latest investigations. TrendForce expects NAND Flash ASP to undergo QoQ declines throughout 2021, since the number of NAND suppliers far exceeds DRAM suppliers, and the bit supply remains high. As Samsung, YMTC, SK Hynix, and Intel actively expand their NAND Flash bit output in 1Q21, the oversupply situation in the industry will become more severe, with a forecasted 6% QoQ increase in NAND Flash bit output and a 10-15% QoQ decline in NAND Flash ASP in 1Q21.

HyperX has launched their Impact lineup of DDR4 DRAM, which boasts of high memory densities per stick for space-constrained setups such as laptops or SFF PCs. The new Impact SODIMMs are available in capacities up to 32 GB per stick, which should make possible for users to install up to 64 GB of DDR4 RAM in their system. All Impact SODIMM operate at 1.2 V, thus enabling relatively low power consumption.

Available operating frequencies stand at 2400 MHz (15-15-15); 2666 MHz (16-18-18); 2933 MHz (17-19-19); and 3200 MHz (20-22-22) - timings are slightly loose, but that's to be expected at these densities and, most importantly in space and/or cooling-constrained environments, voltage. HyperX Impact SODIMMs are available in single modules, dual channel kits, and quad channel kits. MSRP starts at $77 for a 16 GB module running at 2400 MHz, and apparently tops out at $358.99 for 2x 32 GB modules at 3200 MHz.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing new high-performance, low-latency memory kits at DDR4-4000 CL16 32 GB (16 GB x2) and DDR4-4400 CL16 16 GB (8 GB x2), and available across the Trident Z Royal, Trident Z RGB, and Ripjaws V series. Engineered with high quality hand-screened Samsung B-die components, these new memory specifications provide more efficient latency options at extreme frequency speeds.

TeamGroup recently announced another addition to their DDR4 memory lineup especially aimed at creators. The new, aptly named T-Create lineup features clean, back-to-basics aesthetics with slim metal heatspreaders that aren't too gaudy and are absent of any RGB. The new chips are available in capacities ranging from 16 GB (2 x 8 GB) through to 64 GB (2x 32 GB). Available speeds are set at DDR4-3200 (22-22-22-52 timings and 1.20 V) and DDR4-2666 (19-19-19-43 timings and 1.20 V).

The TeamGroup T-Create Classic 10L feature a 10-layer PCB and limited lifetime warranty, and are available in silvery-white. Pricing starts at $56.99 for the 2x 8 GB 2666 MHz kit and goes up to $216.99 for the 2x 32 GB 3200 MHz one.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing new extreme-speed DDR4 memory kits that push 16 GB and 8 GB modules up to DDR4-4400 with a low latency of CL17-18-18-38 across the board, under the Trident Z Royal family. Upgrading specifications across all three fronts of memory frequency speed, module capacity, and low memory latency, these specifications are engineered with Samsung B-die ICs and designed for the latest Intel Z490 platform to achieve higher performance for gaming and content creation.

As 32 GB memory total capacity becomes the standard for gaming PC and performance PC builds, G.SKILL recognizes the importance of extreme performance 16 GB x2 memory kit configurations. Rising to the challenge, G.SKILL has created the DDR4-4400 CL17-18-18-38 memory kit with 32 GB (16 GB x2) capacity under the Trident Z Royal family. See the memory kit stress testing on the MSI MPG Z490 GAMING PLUS motherboard with an Intel Core i5-10600K processor in the screenshot below.

GeIL, Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers announced ORION series memory for gamers and content creators providing high speed as well as massive memory capacity scalable up to 4000 MHz CL18 64 GB (2 x 32 GB) kit.

High speed and low latencies used to be gamers' favorite while massive memory capacity which greatly helps the multimedia creation is preferred for content creators. Scaling up to 2x 32 GB 4000 MHz CL18, GeIL ORION series memory is an exceptionally balanced choice designed to satisfy multiple needs, especially for users require both extraordinary performance for gaming and massive memory capacity for multimedia creation.

VIPER GAMING by PATRIOT, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, is excited to announce the launch of their new 32 GB memory modules into the VIPER STEEL SERIES DDR4 PERFORMANCE MEMORY. The new 32 GB modules are available in both UDIMM and SODIMM. The frequencies from 3000 MHz to 3600 MHz are available for UDIMM and the frequencies from 2400 MHz to 3000 MHz for SODIMM. The new modules are built from rigorously tested memory chips and components on a ten-layer PCB for optimum performance in gaming desktops and laptops.

The VIPER STEEL provides extra gaming performance and stability for the most demanding desktop and laptop environments across the latest Intel and AMD platforms. The VIPER STEEL modules bring Intel XMP 2.0 performance to the next level by offering hardcore gamers and enthusiasts the possibility to upgrade their gaming systems with more DRAM memory capacity and further extending their potential.

ADATA, a leading manufacturer of high-performance DRAM modules, NAND Flash products, gaming products, and mobile accessories,today announces the launch of the XPG SPECTRIX D50 DDR4 RGB memory module. Reaching performance of up to 4800 MHz, sporting a maximum capacity of 32 GB, and featuring an elegant geometric design, the XPG SPECTRIX D50 offers immense performance and minimalist styling gamers, overclockers, and PC enthusiasts will appreciate.

Made with only the highest quality chips and PCBs, the XPG D50 provides ultimate stability, reliability, and speeds of up to 4800 MHz. What's more, it supports the latest Intel and AMD platforms. To ensure all that amazing performance inside is protected from impact, the XPG D50 sports a robust heatsink with a wall thickness of nearly 2 mm for excellent durability. The D50 support Intel XMP 2.0 for hassle-free and stable overclocking without the need to go into BIOS.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce the launch of its industrial-grade 32 GB DDR4-3200 memory modules. With tested transfer rates of up to 3200 MT/s and 32 GB of capacity, the modules are ideal for segments and applications experiencing continuous growth of temporarily stored data as a result of 5G network and AIoT deployment, and thus require higher capacity and performance. These segments and applications include telecommunications, surveillance systems, autonomous vehicles, medical equipment, and industrial robots among others.

The modules come in U-DIMM, SO-DIMM, R-DIMM, ECC-DIMM, and ECC SO-DIMM variants and are compatible with the latest 3rd Gen AMD Ryzen and 10th Gen Intel Core processors. Made with the latest advancements in soldering and manufacturing. Utilizing a 288-pin design, operating voltage has been reduced from 1.5 V on DDR3 to 1.2 V, which not only helps save power by 20%, but also boosts transfer bandwidth speed.

Acer today announced its new Predator Triton 500 and Acer Nitro 5 gaming notebooks. Alongside significant developments in thermal performance, both devices come with the latest 10th Gen Intel Core processors and newly announced NVIDIA GeForce RTX SUPER and GTX GPUs.

"In addition to the latest processors and GPUs, we've made exciting across-the-board updates to the Predator Triton 500 and Acer Nitro 5 this year," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "Most importantly we've applied new thermal technology which keeps the devices cool so gamers can enjoy the performance improvements from the latest silicon technology."

Have you ever wondered how a laptop with a desktop CPU that has 16 cores and 32 threads would look like on a laptop? Well, today is your lucky day as XMG, a German laptop maker, has decided to launch a laptop that has AMD's latest and greatest desktop CPU - the Ryzen 3950X 16C/32T monster. The 3950X CPU, while featuring a regular TDP of 105 W, has been configured to 65 W in Eco Mode, and it runs anywhere from 2.6 to 4.2 GHz. The CPU also isn't soldered to the motherboard and there is a full AM4 socket, that is capable of housing any 3000 series desktop CPU.

Besides a powerful CPU, there are options for NVIDIA GeForce RTX 2060 or RTX 2070 graphics cards, which drive a 15.6-inch Full HD 144 Hz IPS panel equipped with anti-glare technology. The GPUs are a "Max-P incarnation" as XMG calls it, which presumably means that they are designed for maximum performance i.e. possibly higher boost speeds. Additionally, you can configure the laptop with up to 64 GB of DDR4 2666 MHz RAM. This configuration, containing Ryzen 9 3950X, RTX 2070, 32 GB of RAM and 1 TB NVM, costs around 2631 EUR. For more configuration options, you can check out this website. Availability is supposed to be in 6-8 weeks.

TEAMGROUP today announces that T-FORCE VULCAN Z and DARK Z gaming memory will be the first to release the large capacity, 32 GB single stick memory. There are DDR4 2666 and DDR4 3000 two different frequency of memory modules available to offer desktop PC a complete selection of expansions. It can provide the powerful computer equipment with high storage speed and multitasking capabilities that creators need for video content creation and editing. It can also perfectly support all AMD and Intel's consumer platforms.

The invincible T-FORCE gaming series is your top choice in 2020 when it comes to large capacity upgrades. T-FORCE VULCAN Z and DARK Z, which are praised by the media around the world, will be the first to release the large capacity, 32 GB single stick memory. VULCAN Z launches DDR4-2666 MHz and DDR4-3000 MHz, two different frequencies of single channel kit and dual channel kit (32 GB X2). And DARK Z will mainly provide a DDR4-3000 MHz dual channel kit (32 GB X2). Consumers can choose a suitable specification based on their personal usage. Not only can process large files easily, but it can also upgrade capacity and handle multiple data computing at the same time. This can increase the applications of desktop computers.

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products,today announced its lineup of DDR4-3200 32 GB Low Profile industrial Mini-DIMMs. SMART has several new 32 GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases. SMART has been providing Mini-DIMM support for many years, offering customers long-term support as well as a solid roadmap of new higher-density, higher-speed options.

SMART's DDR4-3200 32 GB industrial Mini-DIMMs undergo stringent in-house environmental temperature screening to operate between -40 °C to +85 °C which makes SMART's DDR4 Mini-DIMMs an ideal solution for telecom and networking equipment being deployed under harsh operating conditions. Customized ruggedizing features can be added, such as conformal coating and anti-sulfur resistors to protect against toxic operating conditions or underfill for excessive vibration, all to allow reliable, long-term system operation.

At this year's CES, ASUS announced the latest addition to their TUG gaming lineup of laptops - two 15-inch TUF Gaming A15 and TUF Gaming F15, and two 17-inch TUF Gaming A17 and TUF Gaming F17. Being advertised as durable, high-performance gaming laptops, the TUF lineup is here to bring "unprecedented experience for the price" meaning that the pricing of these models will be more than adequate for what they offer. Inside these new machines are the latest mobile processors from both Intel and AMD. The "A" series, as it is called, is an AMD based solution that features Ryzen 4000 series of mobile processors, which can be configured to go up to 8 cores and 16 threads, while the so-called "F" series is based on Intel's 10th generation of Core processors, which can be configured to go up to 6 cores and 12 threads.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory kit specification based on 32 GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series. Available in 256 GB (32GBx8), 128 GB (32GBx4), and 64 GB (32GBx2) kit capacities for quad-channel and dual-channel platforms, these new DDR4 memory specifications are built with the latest high-density 16Gb components and provide the perfect mix of extreme performance and high memory capacity.

DDR4-3200 CL14 has always been the ultimate sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-performance efficiency to the latest 32 GB high-capacity DDR4 modules. Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) memory kit capacity can be seen validated in the screenshots below with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of the XPG Hunter DDR4 memory module. Geared toward PC enthusiasts and gamers, the XPG Hunter delivers all the benefits of DDR4 with remarkable performance and efficiency. It supports XMP 2.0 for easy overclocking and offers great stability, making it ideal for performance seekers - gaming to competitive benchmarking. It comes in U-DIMM and SO-DIMM variants to meet the needs of desktop and notebook users alike.

The XPG Hunter modules are made with high-quality chips selected through a strict filtering process. They are equipped with the finest PCBs and pass rigid reliability and compatibility tests to ensure longevity and rugged durability, which are vital for overclocking, gaming, and extreme benchmarking. The modules deliver high-speed performance of up to 3200 MHz and comes with capacities of 4 GB, 8 GB, 16 GB, or 32 GB to meet the needs of diverse users and budgets.

The leading global motherboard & graphics card manufacturer, ASRock, a pleasure to launch brand new compact Mini PC - Mars Series. Supports up to Intel Core i5 Quad-Core processor, 32 GB DDR4-2666 MHz, PCIe NVMe M.2 SSD, 2.5-inch hard drive, and wireless connectivity; all implies into 0.7-liter chassis with 26 mm height.

ASRock Mars offers abundant USB devices connectivity, features a total of 7 USB ports, including one Type-C port; In addition, the native SD card reader and dual display outputs to provide more productive and convenience.

TEAMGROUP releases large-capacity memory Elite / Elite PLUS DDR4 32 GB for audio and video creator upgrade selections. ELITE DDR4 and Elite PLUS DDR4 are both 1.2 V memory module and massive 32 GB Kit capacity. In response to the trend of live streaming and the increasing number of digital contents, there are many other high-quality products available for creators with a full range of upgrade options.

The improvement of the specifications of built-in memory and hard drive is very important for meeting creators' needs for computer upgrades. TEAMGROUP releases the large capacity memory Elite/Elite PLUS DDR4 32 GB; it also works with MP34 M.2 PCIe Solid State Drive that has the new generation PCIe Gen3 x4 high speed interface and the latest NVMe1.3 protocol. Even under multitask processing, 1 TB of high capacity and up to 3000/2600 MB/s of excellent read/write speed can still provide stable and smooth use experience.

Team Group launched its first 32 GB memory module, the Team Elite TED432G2400C1601. This is a dual-rank DIMM with eight 32 Gbit DRAM chips, with a rated clock-speed of DDR4-2400, and timings of 16-16-16-39, and module voltage of 1.20 V. The module features a simple black PCB of standard height (32 mm), and comes without any heatspreader or heatsink.

Team Group is also selling a 64 GB (2x 32 GB) dual-channel kit with two of these DIMMs, which bears the SKU TED464G2400C16DC01. To use these modules, you'll need either a 9th generation or 10th generation Intel Core processor, or 3rd generation AMD Ryzen, as 32 GB dual-rank DIMMs are unlikely to be supported by older processors. Team Group is backing these modules with lifetime warranty, and is likely to price the 32 GB single-module at USD $150, and the dual-channel kit at $300.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32 GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256 GB (32 GB x8), Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4), Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4), and Trident Z Neo DDR4-3800 C18 64 GB (32 GB x2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.

With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.