G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Zeta R5 Neo series overclocked DDR5 R-DIMM memory kits for the latest AMD Ryzen Threadripper 7000 series and AMD Ryzen Threadripper Pro 7000 WX-series processors with AMD TRX50 chipset motherboards. This is the first R-DIMM platform from AMD that officially supports memory overclocking, so the Zeta R5 Neo features AMD EXPO memory overclocking profiles for easy memory overclocking. Built with hand-screened ICs and will be available in DDR5-6400 CL32 16 GB x4 and 32 GB x4 kit specifications at launch, Zeta R5 Neo series is the ideal R-DIMM memory solution to build an overclocked performance AMD workstation.

Overclocked DDR5-6400 R-DIMM Kits Designed for Quad-Channel AMD TRX50 Platform
With the launch of the AMD TRX50 workstation platform that supports DDR5 R-DIMM overclocking, G.SKILL is bringing AMD EXPO memory overclocking profile support to its R-DIMM memory lineup under the Zeta R5 Neo series. Available in quad-channel configurations of DDR5-6400 CL32-39-39-102 64 GB (16 GB x4) and 128 GB (32 GB x4) specifications, visit the G.SKILL product pages for more product information.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming Peripherals, and Enthusiast Memory solutions, is excited to launch the TOUGHRAM XG RGB D5 Memory DDR5 7600/8000 MT/s 32 GB (16 GB x2) available in black and white. The TOUGHRAM XG RGB D5 is a high-performance DDR5 RAM module that features a unique X-shaped light bar with 16 LEDs. To satisfy different speed demands, the TOUGHRAM XG RGB D5 series provides frequency options starting from 5600MT/s, and now has new higher frequency additions of up to 8000MT/s and can support the latest Intel 14th Gen.

The TOUGHRAM XG RGB D5 7600/8000 MT/s are made with superior components to achieve uncompromised speed. Built with tightly-screened ICs and a 10-layer PCB with 2oz copper inner layer, The TOUGHRAM XG RGB D5 can deliver outstanding response time performance and overclocking performance. The high-quality 10μ gold fingers on the ram provide high wear resistance to reinforce durability. Additionally, the TOUGHRAM XG RGB D5 Memory DDR5 is equipped with a doubled bank group architecture, increasing capacity without lag. To reach long-term stability, the DDR5 memory features a native Power Management IC (PMIC) to optimize power efficiency with merely 1.1 V low operating voltage. The TOUGHRAM XG RGB D5 7600/8000 MT/s include the on-die error correction code (ECC) can strengthen stability and reliability through its auto error correction.

Lexar, a leading global brand of flash memory solutions, is excited to announce THOR OC DDR5 Desktop Memory. Featuring a complete redesign that pays homage to Thor's hammer, this memory also boasts a durable, solid aluminium heatsink that more than stands up to the challenges of overclocking by providing superior heat dissipation. Lexar THOR OC DDR5 Desktop Memory delivers up to 6000MT/s with timing as low as CL32 for a truly next-gen experience. It features a low-profile form factor that is perfect for compact PC builds. It also supports Intel XMP 3.0 and AMD EXPO overclocking and is compatible with most DDR5 motherboards.

Lexar THOR OC DDR5 Desktop Memory's on-die Error Correction Code (ECC) offers improved stability and reliability while its on-board Power Management IC (PMIC) enhances power efficiency. Another option for PC users is THOR OC DDR4 Desktop Memory. It offers 3200MT/s performance with timing of CL16 and is designed for PC enthusiasts and extreme gamers. It has an aluminium heat spreader with a winged design to keep systems running cool and is compatible with INTEL XMP 2.0 and AMD Ryzen.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company's new customized ultra-bandwidth elements (CUBE) enable memory technology to be optimized for seamless performance running generative AI on hybrid edge/cloud applications.

CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions. Designed to meet the growing demands of edge AI computing devices, it is compatible with memory density from 256 Mb to 8 Gb with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.

Today Lenovo is announcing its top-of-the-line Lenovo Legion 9i (16", 8), the first 16-inch gaming laptop in Lenovo Legion's ecosystem—and in the world—with a self-contained liquid-cooling system, designed for gamers and creators with heavy graphic workflow requirements who need a full development studio in their bag. The Lenovo Legion 9i caps out the Lenovo Legion lineup that also includes the Lenovo Legion Pro series for competitive gamers and the Lenovo Legion Slim series for gamers who value agility, as well as Lenovo Legion displays and peripherals. Also announced today are the Lenovo Legion 16" Gaming Backpack GB700 and GB400, two backpack options that give gamers a choice between slim and lightweight agility or extra storage without sacrificing protection for their Lenovo Legion 9i (16", 8) or any other laptops and accessories.

"The introduction of the Lenovo Legion 9i (16", 8) marks the latest pinnacle of Lenovo Legion's gaming laptop innovation. The Lenovo Legion 9i is first laptop in the Lenovo Legion ecosystem with an integrated liquid-cooling system and hardware AI chip tuning. The forged carbon A-cover, which in addition to its 'unique-to-each-laptop aesthetics' means a lighter laptop for gamers and creators who demand nothing but the best." said Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "We are constantly challenging ourselves to push the limits when designing gaming solutions. The Lenovo Legion 9i (16", 8) has set a new benchmark for us that we are excited to meet—and exceed—in the future."

V-COLOR Technology Inc, a leading memory manufacturer is proud to present the revolutionary DDR5 OC R-DIMM Workstation Memory in configurations 16 GB, 32 GB, and 64 GB. Designed for use with the latest unlocked Intel Xeon W-2400X and W-3400X series processors on respective Intel W790 chipset-based motherboards supporting quad-channel and octo-channel memory

Extreme Overclocking: Experience unrivaled power with OC R-DIMM Workstation Memory. Engineered for extreme overclocking capabilities, this memory module dares to push the limits and achieve unparalleled speeds. With v-color technology, effortlessly unlock the full potential of workstations and conquer even the most demanding tasks. Intel XMP 3.0 Certified: Seamlessly compatible with Intel XMP 3.0, OC R-DIMM Workstation Memory ensures a hassle-free and optimized experience. Effortlessly enhance system's performance and achieve the perfect balance between speed and stability.

Valve's Steam Deck handheld gaming console has launched with 16 GB of LPDDR5 memory running at 5500 MT/s. This is distributed over four 32-bit channels for 88 GB/s total bandwidth memory bandwidth. While the storage option can be upgraded, the memory is limited to 16 GB, and the memory chips are soldered. However, it seems like that problem can also be solved only if you are a professional and can solder well. Thanks to the Balázs Triszka on Twitter/X, we have witnessed a mod of Steam Deck, where memory gets upgraded from 16 to 32 GB.

The modder successfully bumped up the system memory using Samsung's LPDDR5 K3LKCKC0BM-MGCP memory chips. All it was needed was some experience with ball grid array (BGA) resoldering. No glue was under the chips, and they were easy to remove. You can see the pictures below, and the system shows the higher memory count.

During yesterday's HBM3 Gen2 memory products yesterday, Micron also shared an updated roadmap with select media and partners. The most interesting details on that roadmap were updates to DRAM and GDDR memory products, with increases in capacity coming for both types of memory. Micron is aiming to launch 32 Gbit or 4 GB DDR5 memory ICs somewhere in the beginning of 2024, which means we can look forward to 32 GB single sided DIMMs with a single DRAM die per memory IC. This should, in theory at least, enable cheaper 32 GB DIMMs, but as always, it's unlikely that the cost saving will be passed on to the end customer. As far as server customers goes, Micron is planning 128 GB DIMMs for 2024, followed by 192 GB DIMMs in 2025 and 256 GB DIMMs in 2026.

When it comes to GDDR, Micron will be launching JEDEC standard GDDR7 memory with 16 and 24 Gbit dies, or 2 and 3 GB capacity, the latter could be the highest capacity GDDR7 memory IC on the market and could see some interesting graphics card configurations. Micron is promising speeds of up to 32 Gbps per pin or 128 GB/s per chip, which is a big jump up from its current best GDDR6X memory which tops out at 24 Gbps per pin or 96 GB/s per chip. GDDR7 differs from Micron's proprietary GDDR6X by using PAM-3 rather than PAM-4 signalling, although this is simply something that the likes of AMD and NVIDIA would have to design their GPUs around. Micron doesn't appear to have any plans for GDDR7X at this point in time. The company is also working on several new iterations of HBM memory over the coming years, with the company expecting to hit 2 TB/s sometime in 2026 or later.

XPG, the e-sports arm of ADATA, the world's leading memory brand, specializes in creating high-performance and stunningly designed e-sports products for e-sports enthusiasts, technology-minded gamers, and overclockers. XPG today announced the launch of LANCER BLADE RGB DDR5 and LANCER BLADE DDR5 memory, emphasizing its low-profile heatsink design, freeing motherboard assembly from heatsink height, and providing a profile that is perfect for small cases with limited space. The XPG LANCER BLADE series includes two models with top speeds of 6000MT/s and 6400MT/s.

By utilizing high-quality carefully selected Hynix chips, these memory modules are low latency and easy to overclock while allowing gamers to enable a hassle-free speed boost with one-click overclocking. At the same time, The XPG LANCER BLADE series supports Intel XMP 3.0 and AMD EXPO and is compatible with the latest Intel and AMD platforms, ensuring excellent memory stability and a smoother operating experience when multitasking or running large-scale applications. In addition, the XPG LANCER BLADE series adopts a high price-performance strategy, combined with excellent operation and quality, it is definitely the foremost choice when gamers upgrade their systems.

Introducing Page: our Most Advanced 7" eReader with Built-in Page-Turn Buttons. The BOOX Page is a cutting-edge 7" eReader equipped with our most advanced processor and customizable page-turn buttons. Discover the impressive array of features on our newest model below.

A Supercharged Journey of eReading
With its Qualcomm advanced octa-core CPU and enhanced configuration of 3 GB RAM + 32 GB ROM, the all-new Page guarantees an incredibly smooth experience while reading ebooks, browsing websites, or using third-party apps, which is made possible by the open Android 11 system it operates on. The 7-inch ePaper screen comes with the E Ink Carta 1200 touchscreen technology, replicating the sensation of reading on traditional paper. With a 300 PPI high definition, each word is presented with extra sharpness and more distinct contrast, resulting in a gentler visual effect and diminished strain on the eyes.

HYTE, the PC components, peripherals, and lifestyle brand of iBUYPOWER, today, unveiled the new limited-edition Mori Calliope Y40 case and accessory bundle, in collaboration with hololive English, represented by the VTuber agency COVER Corporation.

HYTE's third case collaboration with hololive English and illustrator Rosuuri, depicts the famous VTuber, Mori Calliope, along with her mascot Death Sensei and scythe, Ricky, on the front and side panels of its Black Y40 PC case. Mori Calliope appears on the main side panel floating above a large skull hand, holding Ricky, surrounded by thorns, roses, and souls of the underworld reaching for her. On the front tempered glass, Mori Calliope appears in a closeup holding Death Sensei with her name in Japanese script descending the panel.

An AMD Navi 32 die was belatedly observed in a Forbes video feature on the company's CEO and President Lisa Su—this small tidbit fired up the PC hardware community once again with speculation about why Team Red has not yet released proper mid-range RDNA 3 game-oriented models. A handful of news sites have recently reported that a Navi 32 GPU sits at the heart of AMD's fairly new workstation-grade AMD Radeon Pro W7800 32 GB GDDR6 graphics card, but fact checkers have quickly pointed out that the $2499 (MSRP) product is actually based on Navi 31. Sites have theorized about the makeup of a possible "Radeon RX 7800" GPU and assumed that a similarly named/numbered workstation model would offer a preview of things to come.

Igor Wallossek (of Igor's Lab fame) has conducted an interesting investigation into this matter. He has put a Radeon Pro W7800 test unit through its paces as a gaming card, but the high-end nature of the Navi 31 GPU leads him to believe that the performance level on tap would be roughly equivalent to a hypothetical "RX 7800 XT." Igor assumes that his simulated gaming card will have access to a smaller pool of VRAM (16 GB instead of 32 GB)—he achieves this via the memtestcl program, since "RDNA 3 no longer allows us to emulate the cards directly." He also sets provisions for differing power consumption due to the workstation card being an efficiency-focused product: "The Radeon Pro W7800 has a TBP of 260 watts, my own extrapolation results in a TBP of around 270 watts for the RTX 7800XT based on the efficiency values of the other two Navi 31 cards."

Anacomda, a Taiwanese memory, storage, and accessories maker, had a booth at Computex 2023, where the company presented the new DDR5 memory kits with speeds ranging up to 7000 MHz. Starting off, we have the model called "Standard," which is just a standard DDR5 UDIMM memory kit available as 8 and 16 GB DIMM, in 2x 8 GB and 2x 16 GB capacities. Running at 4800 MHz, the standard kit has a CAS latency of 40, with a running voltage set to 1.1 Volts. Next is the KingSnake Overclocking UDIMM, which is, as the name suggests, a kit optimized for overclocking. Available in frequencies of 5600/6000/6200/7000 MHz, these memory modules run at 1.25 or 1.45 Volts at CAS latencies of 40 and 36. They also come in 16 GB and 32 GB capacities.

Last but not least, there is an ET (EryxTataricus) unbuffered UDIMM kit that is basically an RGB version of KingSnake, with all the same features except the inclusion of RGB lighting capable of syncing with all modern motherboard RGB software.

GeIL, one of the world's leading PC components & peripheral manufacturers today announced the latest Pristine R5 series as well as Spear R5 series server memory products, providing solutions not only for the needs of standard Registered DIMMs which fully complies with the JEDEC specifications but also the market of high-end applications which requires high-performance server memory.

GeIL stated that the popularity of online games and the metaverse brings not simply the growth momentum of the server market, related requirements such as the gaming service, the big data analysis, and AI applications also create the massive needs of cloud computing which customers are now asking for great performance rather than just focusing on stability, reliability and security when it comes to the server products. GeIL further pointed out that the demand for high-bandwidth and large-capacity server memory is therefore continuously and rapidly growing.

Last year, Crucial canned its Ballistix brand of gaming focused memory, but it seems like the company still wants to offer its customers a more premium product, as Crucial has just introduced its new Pro series of memory products. Crucial will offer its new Pro series in both DDR5 and DDR4 flavours at either DDR5-5600 or DDR4-3200 speeds. It should be noted that the DDR4 modules still rely on a green PCB, while the DDR5 modules get the same black PCB as Crucial's regular DDR5 modules. Beyond the heatsink, there isn't much that differs between the Pro series and Crucial's regular modules, but there is one thing that might matter to potential buyers.

Crucial has added support for AMD EXPO and Intel XMP 3.0 to its Pro series of modules. In the case of AMD EXPO this only applies to DDR5 modules, whereas the DDR4 modules support Intel XMP 2.0, in this case a feature its standard DDR4 modules lack. This should make it easier for end users to take advantage of the extra performance offered by some of these modules. That said, as Crucial has stuck to JEDEC timings, taking the Pro DDR5-5600 UDIMM kit as an example, you end up with timings of 46-46-45-45 at 1.1 Volts, where competing products have timings in the range of 36-36-36-36, although usually at 1.25 Volts or higher. Even as far as JEDEC timing goes, Crucial has chosen the middle ground for DDR5 5600, as there is a timing option from JEDEC that supports 40-40-40-40, which would make more sense for a more premium product. Price wise, a 32 GB kit with two 16 GB modules of DD5-5600 modules carries an $11 price premium over Crucials standard modules, with a retail price of US$114.99 versus US$103.99, but there are better options out there at this price point.

Thanks to the latest release of the Power On newsletter from Mark Gurman, we have additional information about Apple's upcoming M3 Pro chip. Currently in testing and reported on by an App Store developer, Apple is looking to upgrade the microarchitecture of the forthcoming chip and add additional cores to the system for more performance. As the report notes, the entry-level M3 Pro chip currently in testing will have 12 CPU cores, six for efficiency and six for performance tasks, with 18 graphics cores, all manufactured on TSMC's 3 nm node. The current baseline for M2 Pro is 10 CPU cores, where four are dedicated to efficiency, and six are dedicated to performance. The current generation entry-level M2 Pro also features a 16-core GPU, which is two cores fewer than the upcoming model.

Generally, the M3 Pro chip will boost integrated memory across the board, as the sample spotted in testing shows 36 GB of memory. The M2 Pro offered 32 GB in that memory tier, so a four GB increase is inbound there. Presumably, the 16 GB version (if it exists) and 64 GB version will also get memory bumps by going the M3 Pro route. Of course, we have to wait for more information as these chips become more widely available to developers.

TrendForce reports that mass production of new server platforms—such as Intel Sapphire Rapids and AMD Genoa—is imminent. However, recent market reports have indicated a PMIC compatibility issue for server DDR5 RDIMMs; DRAM suppliers and PMIC vendors are working to address the problem. TrendForce believes this will have two effects: First, DRAM suppliers will temporarily procure more PMICs from Monolithic Power Systems (MPS), which supplies PMICs without any issues. Second, supply will inevitably be affected in the short term as current DDR5 server DRAM production still uses older processes, which will lead to a convergence in the price decline of DDR5 server DRAM in 2Q23—from the previously estimated 15~20% to 13~18%.

As previously mentioned, PMIC issues and the production process relying on older processes are all having a short-term impact on the supply of DDR5 server DRAM. SK hynix has gradually ramped up production and sales of 1α-nm, which, unlike 1y-nm, has yet to be fully verified by consumers. Current production processes are still being dominated by Samsung and SK hynix's 1y-nm and Micron's 1z-nm; 1α and 1β-nm production is projected to increase in 2H23.

Acer today announced new TravelMate business laptops, all powered by 13th Gen Intel Core vPro processors, and feature 16:10 premium OLED displays, 65 Wh fast charging long battery life, and secured log-in with fingerprint reader or IR camera, coming together to achieve the performance and mobility requirements of today's hybrid workforce.

Acer TravelMate P6 14
The latest TravelMate P6 14 is the ultimate premium business laptop for mobile professionals and executives. Professionals can experience elevated viewing experiences on a large screen surface with a 2.8K OLED (2880x1800) display panel, a 16:10 aspect ratio, and support for 100% coverage of the DCI-P3 color space. Powered by Intel vPro, and an Intel Evo design, the high-end business laptop is packed with power as it comes with 13th Gen Intel Core i7 processors, 32 GB LPDDR5 memory and a 65 Wh[1] fast-charging battery. Online business meetings and video calls are further enhanced with the laptop's FHD IR webcam, AI-powered noise-reduction technology through Acer PurifiedVoice, and upward-facing speakers with DTS Audio. A PrivacyPanel feature helps obscure viewing angles beyond 90° to defend against prying eyes. The TravelMate P6 14 laptop also features 2x2 Wi-Fi 6E and 5G connectivity for faster and stronger wireless internet connection needed by mobile professionals.

Dynabook Americas, Inc., formerly Toshiba PC Company, has announced that it has refreshed its ultralight Portégé X40L-K and performance-rich 14-inch Tecra A40-K and 15-inch Tecra A50-K laptops to include the new hybrid-architecture 13th Gen Intel Core P-Series 28 W processors. All three laptops also include Windows 11 Pro standard for an enhanced productivity and intuitive computing experience.

"Next generation computing solutions capable of exceeding the demands of modern businesses and individuals is vital to Dynabook's success," said James Robbins, general manager, Dynabook Americas, Inc. "The addition of the 13th Gen Intel Core processors with our own mobile innovations allows Dynabook to deliver uncompromising, premium mobile computing solutions that seamlessly integrate into any business or learning environment. The immense power these three new laptops deliver demonstrates Dynabook's unrelenting commitment to producing the market's best professional-grade computing solutions."

LG Electronics USA announced pricing and availability of its 2023 LG gram Style laptops at LG.com and select LG-authorized retailers. Created for those who love to express their unique style wherever they go, the LG gram Style laptops will be offered in 16- and 14-inch versions (models 16Z90RS and 14Z90RS). Exclusively available at LG.com from March 20, 2023 to April 16, 2023, customers can now get a 32 GB memory LG gram Style laptop for the price of a 16 GB model of the same screen size.

The LG gram Style features an elegant glass design that changes color when viewed from different angles. The focus on design continues inside the new laptop where a "hidden" haptic touch-pad with soft LED backlighting illuminates at the user's touch. Maintaining its reputation for its lightweight portability, the gram Style weighs under 3 pounds.

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 64 GB, 32 GB, and 16 GB Server Premier DDR5 4800MT/s Registered DIMMs have been validated on the 4th Gen Intel Xeon Scalable Processor (formerly codenamed Sapphire Rapids). For over 35 years Kingston has been the memory brand trusted by leading server manufacturers and the world's largest data centers. Server Premier is Kingston's industry standard memory solution sold by specification for use in white-box servers, and is platform validated and qualified by leading motherboard/system manufacturers. Featuring a locked BOM (Bill of Materials) to provide a consistent brand and revision of primary components (including DRAM, register, PMIC, SPD hub, thermal sensors, and PCB), all Kingston server memory solutions are 100% tested and undergo a rigorous dynamic burn-in process designed to catch early-life failures at the factory.

Intel's 4th Gen Xeon Scalable Processor is their first to support next-generation DDR5 server-class memory and features eight memory channels, arranged in up to two DIMMs per channel, or 16 DIMMs per CPU socket. At 4800MT/s, each DDR5 Registered DIMM provides a peak bandwidth of 38.4 GB/s, which when grouped in multi-channel configurations provides a marked increase in performance over DDR4-based servers. DDR5 introduces advanced features for a more reliable and more efficient memory subsystem, including on-die ECC (ODECC), double the number of banks and double the burst length, improved refreshes, inclusion of a power management circuit (PMIC), additional temperature sensors, decision feedback equalization (DFE), and dual independent 32-bit subchannels (40-bit for ECC).

Apple today unveiled the new Mac mini, supercharged by M2 and the all-new M2 Pro. With the M2 chip, Mac mini is even more powerful, capable, and affordable with a new starting price of just $599. The new M2 Pro chip delivers pro-level performance to Mac mini for the first time, enabling users to run high-performance workflows that were previously unimaginable in such a compact design. Mac mini with M2 and M2 Pro delivers faster performance, even more unified memory, and advanced connectivity, including support for up to two displays on the M2 model, and up to three displays on the M2 Pro model. Paired with Studio Display and Magic accessories, along with the power and ease of macOS Ventura, Mac mini provides a phenomenal desktop experience that will take users' productivity and creativity to the next level. Customers can order the new Mac mini models today, with availability beginning Tuesday, January 24.

"With incredible capabilities and a wide array of connectivity in its compact design, Mac mini is used in so many places, in so many different ways. Today, we're excited to take it even further with M2 and M2 Pro," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Bringing even more performance and a lower starting price, Mac mini with M2 is a tremendous value. And for users who need powerful pro performance, Mac mini with M2 Pro is unlike any other desktop in its class."

The newest 2023 Lenovo Legion lineup of battle-ready PCs, monitors, and accessories are unveiled today, setting a new standard in PC gaming for 2023 that gives gamers the edge they need to top the leaderboards. Lenovo is harnessing the pure power of PC gaming with its new lineup for CES 2023, unlocking the freedom to dominate the battlefield with AI-tuned performance that lets gamers crush both framerates and the competition. Brand new for 2023 is the new Lenovo LA AI chip, the world's first dedicated AI chip on a gaming laptop, installed on the new Lenovo Legion Pro 7 and 7i (16", 8) laptops and the Lenovo Legion Pro 5 and 5i (16", 8) laptops.

Lenovo AI Engine+, powered by the Lenovo LA AI chip, deploys a software machine learning algorithm to optimally tune system performance. The chip uses software machine learning, deployed through Lenovo Vantage, to help monitor in-game FPS and dynamically adjust for the highest performance output. Offering up to 15% higher TDP, this chip and machine learning software combo allows Legion Pro Series laptops to deliver higher performance compared to previous generations. Lenovo Legion Pro 7i and Lenovo Legion Pro 5 and 5i laptops also come with Tobii Horizon, providing gearless head tracking that gives players an extra level of immersion when playing their favorite games, as well as Tobii Aware.

Acer announced two powerful Predator Helios gaming laptops and a pair of Predator gaming monitors. The laptops feature an all-new design with 16-inch and 18-inch display sizes, the latest 13th Gen Intel Core mobile processors and NVIDIA GeForce RTX 40 Series GPUs, making them Acer's most powerful gaming laptops to date. The Predator X45 showcases a massive 800R curved monitor and has earned a CES Innovation Award in the "Computer Peripherals & Accessories" category. Along with the Predator X27U, both monitors include OLED technology with fast 240 Hz refresh rates.

Predator Helios 16, Predator Helios 18 Laptops
The all-new Predator Helios 16 (PH16-71) and Predator Helios 18 (PH18-71) bring the latest and greatest tech to Acer's most powerful gaming laptop series. Sporting a completely new design and upgraded thermals, they both offer models that include 13th Gen Intel Core i9 or i7 HX processors paired with up to NVIDIA GeForce RTX 4080 Laptop GPU (MGP up to 165 W) and a plethora of must-have top-of-the-line gaming features.

IceWhale Technologies has launched ZimaBoard, a low-cost single board server that functions as personal cloud storage and software router, and allows users to set up a VPN, stream 4K video, access media collections, and reinvent smart home projects on Amazon. Three models with tiered processing power are available in the brand's shop for US customers: ZimaBoard 216 (2 GB RAM, 16 GB eMMC storage, dual-core Intel Celeron processor) is $139.99 USD, ZimaBoard 432 (4 GB RAM, 32 GB eMMC storage, quad-core Intel Celeron processor) is $169.99 USD, and ZimaBoad 832 (8 GB RAM, 32 GB eMMC storage, quad-core Intel Celeron processor) is $229.99 USD.

"Following our Kickstarter campaign and fulfillment to backers in July, we're excited to announce our move to Amazon," said founder Lauren Pan. "Getting here was no small feat, especially after more than a year of chip shortages and unpredictable lockdowns, but here we are. ZimaBoard is one board to rule them all—one that puts individuals back in control."