Ahead of its Q1-2018 launch after a CES reveal, Intel's Core i7-8709G multi-chip module (MCM) was picked up by Thai PC enthusiast and tech vlogger "TUM APISAK," revealing some of its first specifications as read by Futuremark SystemInfo, a hardware-detection component common to various Futuremark benchmark suites. The "Kaby Lake-G" MCM combines a quad-core "Kaby Lake" CPU die with an AMD Radeon "Vega M" graphics die that has a dedicated HBM2 memory stack on-package.

Futuremark SystemInfo puts out quite a few specs of the i7-8709G, beginning with its 4-core/8-thread CPU based on the "Kaby Lake" micro-architecture, which is clocked at 3.10 GHz with 3.90 GHz Turbo Boost; Radeon RX Vega M (694C:C0) graphics core with 4 GB of HBM2 memory across a 1024-bit memory bus; with its GPU engine running at 1.19 GHz, and memory at 800 MHz (204.8 GB/s memory bandwidth); although the core-config of the iGPU remains a mystery. We recommend you maximize the video below for legible details.

Following today's surprise announcement of an Intel-AMD collaboration (of which NVIDIA seems to be the only company left in a somewhat more fragile position), there have already been a number of benchmark leaks for the new Intel + AMD devices. While Intel's original announcement was cryptic enough - to be expected, given the nature of the product and the ETA before its arrival to market - some details are already pouring out into the world wide web.

The new Intel products are expected to carry the "Kaby Lake G" codename, where the G goes hand in hand with the much increased graphics power of these solutions compared to other less exotic ones - meaning, not packing AMD Radeon graphics. For now, the known product names point to one Intel Core i7-8705G and Intel Core i7-8809G. Board names for these are 694E:C0 and 694C:C0, respectively.