PerformanceDatabases has uncovered details relating to an alleged engineering sample of AMD's Ryzen 8000 "Strix Point" APU—likely insider sourced CPU-Z screengrabs from early last month revealed that the upcoming Zen 5-based laptop chip (in their words): "is built on a 4 nm Process and features the Big.Little CPU architecture with 4 Performance Cores and 8 Efficiency Cores. Both the P and E-Cores support hyper-threading. On the P-Core and E-Core, the L1 Data cache is 48 KB, while the L1 instruction cache is 32 KB. Each P Core boasts 1 MB of cache, and with E-Cores, it looks like there are 4 in a group, sharing 1 MB of L2 Cache. This setup is quite similar to Intel's design. Keep in mind, it's still in the engineering sample (ES) stage, so there's more to come. We'll keep you posted on any further updates!"

Another "AMD Strix - Internal GPU" example emerged late last week, this time in the form of a leaked HWInfo64 screen grab with some information completely covered up—the visible parts seems to point to this "Strix Point" APU featuring a core configuration as seen in the earlier leak, along with 1024 unified shaders. We can presume that the sampled Zen 5-based mobile APU possessing 16 RDNA 3.5 compute units (16 × 64 = 1024). Other details include a 45 W TDP rating, and the socket type being FP8 (as utilized by current Ryzen 7040U and 7040H(S) mobile SoCs). The 512 MB GDDR6 memory configuration is very likely an error—according to HWInfo64, the tested system was fitted with 32 GB of LPDDR5 memory. "Strix Point" looks to be the logical successor (in 2024) to AMD's current "Phoenix" lineup of mobile processors, as featured in gaming handhelds and laptops. PC hardware enthusiasts are expressing excitement about the upcoming APU series wielding impressive iGPU performance, with the potential to rival modern discrete mobile solutions.

Benchmark results for Qualcomm's Snapdragon 8cx Gen 4 SoC appeared on Geekbench Browser early yesterday morning, under the designation Snapdragon 8cx Next Gen. This chipset is tipped to be a successor to the Snapdragon 8cx Gen 3, which was launched at the end of 2021 as the world's first 5 nm Arm-based SoC for Windows laptops. A tipster on Twitter has highlighted the very underwhelming results posted by the next gen chipset, and these figures would indicate that an engineering sample was the test subject, not final silicon. The 8-core Snapdragon 8cx Gen 3 is shown to outperform its supposed successor, and the clock frequencies for the latter appear to be lower than anticipated.

The Geekbench 5 database entry for Snapdragon 8cx Gen 4 also reveals details about its specifications - a 12-core configuration that is split into eight performance cores and four power-efficiency ones. The base core frequency is listed as being 2.38 GHz, and the benchmark was completed under a Balanced Power plan in Windows 11 Home Insider Preview. 16 GB of RAM was used in the test kit, although earlier leaks have indicated that the chipset can support up to a maximum of 64 GB LPDDR5 RAM.

AMD launched the 7 nm Zen 3 microarchitecture which powers Ryzen 5000 processors in late 2020, we expect AMD to follow this up with a Zen 3+ on 6 nm later this year and a 5 nm Zen 4 in 2022. We are now beginning to receive the first rumors about the 3 nm Zen 5 architecture which is expected to launch in 2024 in Ryzen 8000 series products. The architecture is reportedly known as "Strix Point" and will be manufactured on TSMC's 3 nm node with a big.LITTLE core design similar to the upcoming Intel Alder Lake and the Apple M1. The Strix Point lineup will consist exclusively of APUs and could feature up to 8 high-performance and 4 low-performance cores which would be less than what Intel plans to offer with Alder Lake. AMD has allegedly already set graphics performance targets for the processors and that they will bring significant changes to the memory subsystem but with rumors for a product 3 years away from launch take them with a healthy dose of skepticism.

Hold on to your helmets: a wild rumor that Intel may be looking to introduce the same design considerations as they already did with their Lakefield architecture has appeared. According to momomo via Twitter (a user who has already shared many rumors and details in the PC hardware space) as well as some other sources, Intel is looking to bring a Big.Little-like design (which Intel calls Hybrid architecture) to the desktop platform in the form of Alder Lake-S, to be reportedly built on the 10 nm process. While Intel's Lakefield (especially geared for the mobile market) only sported four Atom (Intel's low power) Tremont cores combined with one high-performance Sunny Cove core, Alder Lake-S could sport as many as an 8+8 configuration, with a TDP currently set up to 80 W (and up to 125 W TDP is also set in the revealing slides with a disclosure regarding investigating performance scaling in up to 150 W TDP).

Should this actual Alder Lake-S product materialize in the 10 nm process, this could be a way for Intel to salvage what it can from the 10 nm process for the desktop platform. As we know from multiple reports on the state of Intel's 10 nm, yields and operating frequencies aren't close to what was expected, and Intel's CFO George Davis even said at last week's Morgan Stanley's Analyst Conference that their 10 nm process wouldn't be as profitable as even 22 nm, which does show that Intel is already looking past this process for their 7 nm deployment. A Big.Little design for a desktop architecture does seem like a more plausible design decision for a struggling process than a full 16-core monolithic die such as those Intel currently employs.