NVIDIA has developed co-packaged optics (CPO) technology with TSMC for its upcoming Quantum-X InfiniBand and Spectrum-X Ethernet switches, integrating silicon photonics directly onto switch ASICs. The engineering approach reduces power consumption by 3.5x. It decreases signal loss from 22 dB to 4 dB compared to traditional pluggable optics, addressing critical power and connectivity limitations in large-scale GPU deployments, especially in 10,000+ GPU systems. The architecture incorporates continuous wave laser sources within the switch chassis, consuming 2 W per port, compared to the 10 W required by conventional externally modulated lasers in pluggable modules. This configuration, combined with integrated optical engines that use 7 W versus 20 W for traditional digital signal processors, reduces total optical interconnect power from approximately 72 MW to 21.6 MW in a 400,000 GPU data center scenario.

Specifications for the Quantum 3450-LD InfiniBand model include 144 ports running at 800 Gb/s, delivering 115 Tb/s of aggregate bandwidth using four Quantum-X CPO sockets in a liquid-cooled chassis. The Spectrum-X lineup features the SN6810 with 128 ports at 800 Gb/s (102.4 Tb/s) and the higher-density SN6800 providing 512 ports at 800 Gb/s for 409.6 Tb/s total throughput. The Quantum-X InfiniBand implementation uses a monolithic switch ASIC with six CPO modules supporting 36 ports at 800 Gb/s, while the Spectrum-X Ethernet design employs a multi-chip approach with a central packet processing engine surrounded by eight SerDes chiplets. Both architectures utilize 224 Gb/s signaling per lane with four lanes per port. NVIDIA's Quantum-X switches are scheduled for availability in H2 2025, with Spectrum-X models following in H2 2026.

Western Digital (Nasdaq: WDC) announced today that it has hired Ahmed Shihab as Chief Product Officer. Shihab, a seasoned expert in cloud storage needs and requirements, most recently served as Corporate Vice President of Azure Storage at Microsoft. In this role, he led the engineering and operations teams for Object and Block storage, driving the design and development of Microsoft's cloud storage solutions. As Western Digital's new Chief Product Officer, Shihab is responsible for leading product strategy and engineering as the company accelerates innovation and development of HDD products and solutions.

"Ahmed joins Western Digital at a pivotal time for the HDD industry with data generation, AI adoption, and the demand for scalable storage continuing to grow. His expertise will be instrumental in driving innovation and meeting the industry's evolving needs," said Irving Tan, CEO of Western Digital. "Given his tenure with storage and infrastructure design and development, Ahmed is the right leader to move Western Digital forward as we help our customers unleash the power and value of data."

IBM Research has unveiled a significant advancement in optical interconnect technology for advanced data center communications. The breakthrough centers on a novel co-packaged optics (CPO) system featuring a sophisticated Polymer Optical Waveguide (PWG) design, marking a potential shift from traditional copper-based interconnects. The innovation introduces a Photonic Integrated Circuit (PIC) measuring 8x10mm, mounted on a 17x17mm substrate, capable of converting electrical signals to optical ones and vice versa. The system's waveguide, spanning 12 mm in width, efficiently channels light waves through precisely engineered pathways, with channels converging from 250 to 50 micrometers.

While current copper-based solutions like NVIDIA's NVLink offer impressive 1.8 TB/s bandwidth rates, and Intel's Optical Compute Interconnect achieves 4 TBit/s bidirectional throughput, IBM's technology focuses on scalability and efficiency. The company plans to implement 12 carrier waves initially, with the potential to accommodate up to 32 waves by reducing spacing to 18 micrometers. Furthermore, the design allows for vertical stacking of up to four PWGs, potentially enabling 128 transmission channels. The technology has undergone rigorous JEDEC-standard testing, including 1,000 cycles of thermal stress between -40°C and 125°C, and extended exposure to extreme conditions including 85% humidity at 85°C. The components have also proven reliable during thousand-hour storage tests at various temperature extremes. The bandwidth of the CPO is currently unknown, but we expect it to surpass current solutions.

GLOBALFOUNDRIES today announced the appointment of Magnus Matthiasson as Chief Procurement Officer (CPO). Based at the company's corporate offices in Silicon Valley, Matthiasson will lead the GLOBALFOUNDRIES global purchasing activities, including managing all aspects of the company's supply base relationships worldwide. Matthiasson will report to GLOBALFOUNDRIES Chief Financial Officer, Dan Durn.

"Given the magnitude of our annual capital-equipment and purchasing investments, the right leadership to drive our strategic supply chain relationships and procurement operations is critical to our ability to provide value to our customers and grow our business profitably," said Durn. "With Magnus in place, our aim is to bolster a world-class procurement organization with programs that continuously optimize our purchasing and materials spend and management capabilities."