The latest update to CPU-Z, the popular system information and diagnostic tool, has rolled out comprehensive support for upcoming processor architectures from both AMD and Intel, along with new memory standards. Among the notable additions is support for AMD's Ryzen 7 9800X3D, which builds upon AMD's successful 3D V-Cache technology and is scheduled to launch tomorrow. The update also covers Intel's "Arrow Lake" processors, including both HX and H series variants. The Arrow Lake lineup integration spans multiple performance tiers, from the flagship Core Ultra 9 285HX down to the mainstream Core Ultra 5 series. The H-series mobile processors, including the Core Ultra 9 285H and various Ultra 7 and Ultra 5 models, are also fully supported.

Additionally, CPU-Z now recognizes Intel's complete Raptor Lake refresh, covering an extensive range of processors across different power segments. This includes the Core 7 series (160HL through 150U), Core 5 series (130HL through 120U), and Core 3 series (100HL through 100U), catering to various computing needs from high-performance to energy-efficient applications. The update extends beyond processors to support CUDIMM ((Clocked Unbuffered DIMM) DDR5 memory. CUDIMMs represent a modified DDR5 memory featuring an integrated Client Clock Driver (CKD) that generates its clock signal to minimize noise and jitter at speeds of 6400 MT/s and above, ensuring better stability and data integrity than traditional DDR5 modules.

DOWNLOAD CPU-Z 2.12 here.

In a surprising development, Intel plans to extend the longevity of its Socket LGA1700 platform even as the newer LGA1851 platform led by the Core Ultra 200 "Arrow Lake" remains on track for a late-Q3/early-Q4 2024 debut. This, according to a sensational leak by Jaykihn. It plans to do this with a brand-new silicon for LGA1700, codenamed "Bartlett." This should particularly interest gamers for what's on offer. Imagine the "Raptor Lake-S" die, but with four additional P-cores replacing the four E-core clusters, making a 12-core pure P-core processor—that's "Bartlett." At this point we're not sure which P-core is in use—whether it's the current "Raptor Cove," or whether an attempt will be made by Intel to backport a variant of "Lion Cove" to LGA1700.

This wouldn't be the first pure P-core client processor from Intel after its pivot to heterogeneous multicore—the "Alder Lake" H0 die has six "Golden Cove" P-cores, and lacks any E-core clusters. Intel is planning to give launch an entire new "generation" of processor SKUs for LGA1700 which use the newer client processor nomenclature by Intel, which is Core 200-series, but without the "Ultra" brand extension. There will be SKUs in the Core 3, Core 5, Core 7, and Core 9 brand extensions. Some of these will be Hybrid, and based on the rehashed "Raptor Lake-S" 8P+16E silicon, and some "Alder Lake-S" 8P+8E; but "Bartlett" will be distinctly branded within the series, probably using a letter next to the numerical portion of the processor model number. There will not be any Core 3 series chips based on "Bartlett," but Core 5, Core 7, and Core 9.

Dynabook Americas, Inc., the gold standard for long-lasting, professional-grade laptops, today announced that it has refreshed its value-packed 14-inch Satellite Pro C40 and 15.6-inch Satellite Pro C50 laptops with Intel Core processors (Series 1) and spill-resistant keyboards, and +Care Service Warranty with On-site.

"Our refreshed Satellite Pro C Series laptops underscore Dynabook's commitment to meeting the diverse needs of the public, private and education sectors. With their blend of modern performance, durability, and affordability, these laptops empower organizations of all sizes to thrive in today's dynamic and competitive landscape," said James Robbins, General Manager, Dynabook Americas, Inc.

Intel's current generation mobile processor product stack is vast, to say the least. In Q4-2023, the company launched its Core Ultra "Meteor Lake" mobile processors spanning the U-segment (7 W to 28 W), and H-segment (35 W to 45 W). Today, the company capped the upper end of the stack with the 14th Gen Core HX-series mobile processors based on "Raptor Lake Refresh," which dial up core counts to 8P+16E. And now, the company is adding more choice to the U-segment with the Core Processor Series 1, based on a lower core-count variant of the "Raptor Lake Refresh" architecture.

The Core Processor Series 1 follows the same nomenclature as the Core Ultra, where the "Ultra" denotes the latest "Meteor Lake" architecture. Processor model numbering and case badges are similar between Core Processor Series 1 and Core Ultra, except the lack of the "Ultra" brand extension. These chips are built on the monolithic "Raptor Lake Refresh" dies on the Intel 7 foundry node, and lack innovations such as the Low-power Island cores, 3D Performance Hybrid architecture, the all important AI Boost and on-silicon NPU; as well as that 2x faster Arc Xe-LPG integrated graphics, but use existing combinations of "Raptor Cove" and "Gracemont" CPU cores, along with older Xe-LP graphics with up to 96 EU; and a mostly similar I/O.

With the reality of high performance Arm processors from Apple and Qualcomm threatening Intel's market share in the client computing space, Intel is working on learner more PCB-efficient client SoCs that can take the fight to them, while holding onto the foundations of x86. The first such form-factor of processors are dubbed -MX. These are essentially -U segment processors with memory on package, to minimize PCB footprint. Intel has fully integrated the PCH into the processor chip with "Meteor Lake," with PCH functions scattered across the SoC and I/O tiles of the processor. An SoC package with dimensions similar to those of -UP4 packages meant for ultrabooks, can now cram main memory, so the PCBs of next-generation notebooks can be further compacted.

Intel had recently shown Meteor Lake-MX packages to the press as a packaging technology demonstration in its Arizona facility. It's unclear whether this could release as actual products, but in a leaked company presentation, confirmed that its first commercial outing will be with Lunar Lake-MX. The current "Alder Lake-UP4" package measures 19 mm x 28.5 mm, and is a classic multi-chip module that combines a monolithic "Alder Lake" SoC die with a PCH die. The "Meteor Lake-UP4" package measures 19 mm x 23 mm, and is a chiplet-based processor, with a Foveros base tile that holds the Compute (CPU cores), Graphics (iGPU), SoC and I/O (platform core-logic) tiles. The "Lunar Lake-MX" package is slightly larger than its -UP4 predecessors, measuring 27 mm x 27.5 mm, but completely frees up space on the PCB for memory.

Intel today announced its first major branding change for its client-segment Core desktop and mobile processor family in over 15 years (since the introduction of the very first Core "Nehalem"). "Core" still remains Intel's main client-segment processor brand, but the way the company draws its processor model numbers, is being significantly changed. The company is also introducing the Core Ultra brand of premium processors. The new nomenclature also sees Intel discontinue the use of "generations" within the SKU name.

The current Intel naming scheme sees the company mention processor generation before the main brand Core. For example, the 13th Gen Core is Intel's current line of client-segment products. Right next to Core, Intel places the brand extension "i" followed by the product tiering number 3, 5, 7, or 9. The product model number follows, and even this model number tends to begin with the processor generation. For example, the "i9-13900" already conveys that it is a processor from Intel's 13th Gen Core family. This is where Intel is making its two main changes.