Altair, a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design. "As the electronics industry pushes the boundaries of complexity and miniaturization, engineers have struggled with simulations that often compromise on detail for expediency. Altair SimSolid will empower engineers to capture the intricate complexities of PCBs and ICs without simplification," said James R. Scapa, founder and chief executive officer, Altair. "Traditional simulation methods often require approximations when analyzing PCB structures due to their complexity. Altair SimSolid eliminates these approximations to run more accurate simulations for complex problems with vast dimensional disparities."

Altair SimSolid has revolutionized conventional analysis in its ability to accurately predict complex structural problems with blazing-fast speed while eliminating the complexity of laborious hours of modeling. It eliminates geometry simplification and meshing, the two most time-consuming and expertise-intensive tasks done in traditional finite element analysis. As a result, it delivers results in seconds to minutes—up to 25x faster than traditional finite element solvers—and effortlessly handles complex assemblies. Having experienced fast adoption in the aerospace and automotive industries, two sectors that typically experience challenges associated with massive structures, Altair SimSolid is poised to play a significant role in the electronics market. The initial release, expected in Q2 2024, will support structural and thermal analysis for PCBs and ICs with full electromagnetics analysis coming in a future release.

Formovie Technology, Chinese maker of laser TV and smart projectors, unveiled its latest innovations at CES 2024 this week. The company showcased several new projectors leveraging cutting-edge laser technology to deliver new visual experiences. The star of the Formovie lineup was the new Formovie Theatre 4K Triple-Laser UST Projector. As the world's first 4K ultra-short throw projector with triple laser technology, it produces a staggeringly bright 2800 ANSI lumens image with 3000:1 contrast ration at a spectacular 150-inch scale. Viewers can expect true-to-life colors and infinite contrast thanks to Formovie's advanced laser light source. The company touts the product as the world's 1st Dolby Vision & Atmos UST projector, which also features ALLM and MEMC for smoother gaming. The sound system is a bespoke work by Bowers & Wilkins. A few booth demos were available to paint the picture of the technology.

In addition, Formovie introduced the slim and portable Formovie S5 projector. Weighing only 6.5 pounds, it's an ultra-compact model ideal for on-the-go use. The S5 still outputs a bright 1100 ANSI lumens image with smooth 4K quality enabled by ALPD laser technology. Rounding out the product showcase, Formovie displayed the award-winning Formovie V10 home theater projector. Recently honored with a CES 2023 Innovation Award, the V10 stands out for its 240 Hz refresh rate, 12 ms low latency, and 2500 ANSI lumens brightness—making it a top choice for gaming and movies.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."

The German Federal Network Agency, together with Agentschap Telecom Netherlands, BAKOM Switzerland and Elsäkerhetsverket Sweden have tested consumer HDMI and coaxial antenna cables and come to the conclusion that many of them don't meet regulations when it comes to Electromagnetic Compatibility (EMC). The four groups tested 30 coaxial antenna cables and 30 HDMI cables, of which only 11 percent of the antenna cables met the manufacturers declared attenuation and and only 10 percent of the HDMI cables met an acceptable EMC quality of at least 50 dB coupling attenuation.

Usually EMI, or electromagnetic interference is what's being discussed, but EMC is about how a device works and interacts in an environment so it doesn't cause EMI. In terms of cables, the normal cause for EMI tends to be because the cable ends up working like an antenna and starts to simplify the signal being transmitted inside the cable. This can cause all sorts of problems, with the most obvious example being poorly shielded USB 3.0 cables, which can interfere with 2.4 GHz radios, such as Wi-Fi, Bluetooth, wireless mice and headphones etc.

The U.S. Department of Energy's (DOE's) National Nuclear Security Administration (NNSA) selected next-generation Intel Xeon Scalable processors (code-named "Sapphire Rapids") to power the supercomputers used within NNSA's Life Extension Program for mission-critical efforts in stockpile stewardship. The NNSA's Lawrence Livermore National Laboratory awarded a subcontract to Dell Technologies to supply the Intel-powered computing systems that will be deployed at the NNSA's Tri-Labs (Lawrence Livermore National Laboratory, Los Alamos National Laboratory and Sandia National Laboratories).

Today's news supports the NNSA's Advanced Simulation and Computing (ASC) program operated at the NNSA's Tri-Labs. The Commodity Technology Systems contract (CTS-2) awarded today will enable these three national laboratories to build more powerful, energy-efficient computing systems that will focus on performing extensive modeling and simulation capabilities in support of NNSA's stockpile stewardship program.

At this year's International Supercomputing 2021 digital event, AMD (NASDAQ: AMD) is showcasing momentum for its AMD EPYC processors and AMD Instinct accelerators across the High Performance Computing (HPC) industry. The company also outlined updates to the ROCm open software platform and introduced the AMD Instinct Education and Research (AIER) initiative. The latest Top500 list showcased the continued growth of AMD EPYC processors for HPC systems. AMD EPYC processors power nearly 5x more systems compared to the June 2020 list, and more than double the number of systems compared to November 2020. As well, AMD EPYC processors power half of the 58 new entries on the June 2021 list.

"High performance computing is critical to addressing the world's biggest and most important challenges," said Forrest Norrod, senior vice president and general manager, data center and embedded systems group, AMD. "With our AMD EPYC processor family and Instinct accelerators, AMD continues to be the partner of choice for HPC. We are committed to enabling the performance and capabilities needed to advance scientific discoveries, break the exascale barrier, and continue driving innovation."

AMD today highlighted the latest expansion of the AMD EPYC processor ecosystem for virtualized and hyperconverged infrastructure (HCI) environments with VMware adding support for AMD Secure Encrypted Virtualization-Encrypted State (SEV-ES) in its newest vSphere release, 7.0U1. With the latest release, VMware vSphere now enables AMD SEV-ES, which is part of AMD Infinity Guard, a robust set of modern, hardware enabled features found in all 2nd Gen AMD EPYC processors. In addition to VM memory encryption, SEV-ES also provides encryption of CPU registers and provides VMware customers with easy-to-implement and enhanced security for their environments.

"As the modern data center continues to evolve into a virtualized, hybrid cloud environment, AMD and VMware are working together to make sure customers have access to systems that provide high levels of performance on virtualization workloads, while enabling advanced security features that are simple to implement for better protection of data," said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. "A virtualized data center with AMD EPYC processors and VMware enables customers to modernize the data center and have access to high-performance and leading-edge security features, across a wide variety of OEM platforms."

Cypress, an Infineon Technologies Company, today announced that in less than five years, the company has achieved a landmark milestone by shipping its one billionth USB-C device. As the leading provider of USB-C technology, Cypress' leadership position spans a wide range of markets with its controllers used within mobile, computing, and power applications.

Cypress offers the industry's most complete portfolio of USB solutions, including device controllers, embedded hosts, hubs, application-specific bridges, and transceivers. Cypress' EZ-PD portfolio was the first in the industry to support the latest USB Power Delivery (USB PD) 3.0 specification, which enables more robust end-to-end power delivery and charging solutions for laptop and mobile devices. Cypress also offers AEC-Q100 certified versions of its controllers for automotive-grade performance.

Today, Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel Corporation and Microsoft announce the incorporation of the Compute Express Link (CXL) Consortium, and unveiled the names of its newly-elected members to its Board of Directors. The core group of key industry partners announced their intent to incorporate in March 2019, and remain dedicated to advancing the CXL standard, a new high-speed CPU-to-Device and CPU-to-Memory interconnect which accelerates next-generation data center performance.

The five new CXL board members are as follows: Steve Fields, Fellow and Chief Engineer of Power Systems, IBM; Gaurav Singh, Corporate Vice President, Xilinx; Dong Wei, Standards Architect and Fellow at ARM Holdings; Nathan Kalyanasundharam, Senior Fellow at AMD Semiconductor; and Larrie Carr, Fellow, Technical Strategy and Architecture, Data Center Solutions, Microchip Technology Inc.

At the European launch in Rome, Italy AMD today highlighted the growing adoption of 2nd Gen AMD EPYC processors across cloud, enterprise and HPC customers. "Today, we are proud to have new platforms from Dell and new customers adopting 2nd Gen AMD EPYC for cloud, enterprise computing and HPC," said Forrest Norrod, senior vice president and general manager, Datacenter and Embedded Solutions Business Group. "We continue to take the AMD EPYC processor to new heights and are thrilled to have the ecosystem supporting us across hardware, software and cloud providers as we face the challenges of the modern data center head-on."

AMD also announced a new addition to the 2nd Generation AMD EPYC family, the AMD EPYC 7H12 processor. The 64 core/128 thread, 2.60 GHz base frequency, 3.30 GHz max boost frequency, 280 W TDP processor is specifically built for HPC customers and workloads, using liquid cooling to deliver leadership supercomputing performance. In an ATOS testing on their BullSequana XH2000, the new AMD EPYC 7H12 processor achieved a LINPACK score of ~ 4.2 TeraFLOPS, ~11% better than the AMD EPYC 7742 processor.

Dell Technologies announced today that it has reached an agreement with its Special Committee of independent directors to exchange the outstanding Class V tracking stock for Class C common stock of Dell Technologies or an optional cash election. Dell Technologies Class C common stock will become publicly listed on the New York Stock Exchange.

Dell Technologies will propose to exchange each share of Dell Technologies Class V tracking stock for 1.3665 shares of Dell Technologies Class C common stock, or at the holder's election, $109 in cash, subject to the aggregate amount of cash consideration not exceeding $9 billion. All of the shares of Class V tracking stock of holders who do not opt to receive cash will be converted into Class C common stock, and the Class V tracking stock will be eliminated.

Dell Technologies is unveiling the new Dell Wyse 5070 thin client, the company's most versatile and scalable thin client platform that enables organizations to select just the right configuration based on their employees' needs. In addition, Dell Technologies is expanding Dell EMC's VDI Complete Solutions, powered by VMware Horizon, to include support for 14th generation PowerEdge server infrastructure and virtualized graphics options for high-performance workloads. Both solutions lower the barrier to VDI adoption, making it easier than ever for organizations to plan, deploy, and run desktop and application virtualization within their IT environments.

Dell Wyse 5070 thin client provides unprecedented options and True 4K multi-display technology
Yesterday's thin clients had one configuration and little support for peripherals, browser-based solutions and unified communications. This meant that most organizations had to deploy a range of thin clients and PCs based on user profiles and workloads. Now, Dell has dramatically simplified standardization on a single thin client platform across the enterprise, making it easier for IT to deploy, and helping extend the security, cost and manageability benefits of thin clients for organizations.

AMD has been making waves on computing markets with its latest line of processors powered by its innovative Zen microarchitecture. Its strengths and weaknesses are very well known by now, so there's no use harking them all over again; suffice it to say that the company has regained competitiveness - and then some - with many of Intel's products in as many different industry sectors. The company's APU solutions, for one, are one of a kind solutions that allow users to do some very impressive gaming sans a discrete GPU. However, Intel's been spending the last several years before AMD's Zen entrenching themselves in all markets, so AMD clearly has an uphill battle in fighting existing relations and supply channels. Case in point: Dell.

Channel Pro is reporting that Dell EMC's CTO, John Roese, said today at WMC that "Intel is the big player, AMD is the second player. There's enough diversity between them that there are use cases to have them both in our portfolio, but just the sheer breadth of the Intel processor portfolio is massive compared to even the accelerated AMD world."

Ruckus Networks, an ARRIS company, today announced it has signed a global original equipment manufacturing (OEM) agreement with Dell EMC to deliver Ruckus' broad portfolio of wireless solutions, including access points (APs), controllers, virtualized and data analytics assets, and Cloudpath secure network access software-along with Ruckus IoT and CBRS LTE products-as Dell-branded solutions. This agreement gives Dell EMC's networking sales team and end-user customers access to Ruckus' award-winning portfolio of secure wireless connectivity solutions and strong brand presence not available through alternative suppliers. The agreement is effective immediately and encompasses a range of sales, marketing and customer support programs in international markets, including APAC, EMEA and the Americas.

"Delivering innovative wireless networking solutions to our partners is key to address the insatiable demand for high-performance wireless networking in the enterprise," said Dan Rabinovitsj, president, Ruckus Networks, an ARRIS company. "The Dell EMC brand and market reach is complementary to our own and represents a significant path for growth for both companies across a range of vertical markets, including education, public infrastructure, the federal government and service providers. We view Dell EMC's strength in storage and scalable computing platforms as critical to collaboration where complete bundled solutions are required to compete and win."

Dell EMC announced three new servers designed for software-defined environments, edge and high-performance computing (HPC). The PowerEdge R6415, PowerEdge R7415 and PowerEdge R7425 expand the 14th generation of the Dell EMC PowerEdge server portfolio with new capabilities to address the demanding workload requirements of today's modern data center. All three rack servers with the AMD EPYC processor offer highly scalable platforms with outstanding total cost of ownership (TCO).

"As the bedrock of the modern data center, customers expect us to push server innovation further and faster" said Ashley Gorakhpurwalla, president, Server and Infrastructure Systems at Dell EMC. "As customers deploy more IoT solutions, they need highly capable and flexible compute at the edge to turn data into real-time insights; these new servers that are engineered to deliver that while lowering TCO."

NVM Express, Inc., the organization that developed the NVM Express specification for accessing solid-state drives (SSDs) on a PCI Express (PCIe) bus, today announced the results of its recent board elections. Elected to Promoter positions were Facebook, Micron, Microsoft, Samsung, Seagate, Toshiba, and Western Digital. Facebook and Toshiba are new to the Promoter level, and the others are incumbents. The election winners join existing Promoters Cisco, Dell EMC, Intel, Microsemi, NetApp and Oracle, whose current terms expire at the end of 2017.

Representatives from the 13 Promoter companies form the NVM Express, Inc. Board of Directors, which governs the organization, including setting strategic direction. All Contributor and Promoter member companies are eligible to run for Promoter positions, where there are elections each year for roughly half the positions.

"We're very pleased to welcome Toshiba and Facebook to the NVM Express, Inc. Board, to help shape the future direction of NVM Express technology and the organization," said Amber Huffman, NVM Express President. "In 2016, we marked major milestones, such as publishing the NVM Express over Fabrics specification. We look forward to publishing revision 1.3 in the first half of this year - with much more to come later in 2017."

On the heels of the recent Gen-Z interconnect announcement, an aggregate of some of the most recognizable names in the tech industry have once again banded together. This time, it's an effort towards the implementation of a fast, coherent and widely compatible interconnect technology that will pave the way towards tighter integration of ever-more heterogeneous systems.

Technology leaders AMD, Dell EMC, Google, Hewlett Packard Enterprise, IBM, Mellanox Technologies, Micron, NVIDIA and Xilinx announced the new open standard to appropriate fanfare, considering the promises of an up-to 10x performance uplift in datacenter server environments, thus accelerating big-data, machine learning, analytics, and other emerging workloads. The interconnect promises to provide a high-speed pathway towards tighter integration between different types of technology currently making up the heterogeneous server computing's needs, ranging through fixed-purpose accelerators, current and future system memory subsistems, and coherent storage and network controllers.

A group of leading technology companies today announced the Gen-Z Consortium, an industry alliance working to create and commercialize a new scalable computing interconnect and protocol. This flexible, high-performance memory semantic fabric provides a peer-to-peer interconnect that easily accesses large volumes of data while lowering costs and avoiding today's bottlenecks. The alliance members include AMD, ARM, Cavium Inc., Cray, Dell EMC, Hewlett Packard Enterprise (HPE), Huawei, IBM, IDT, Lenovo, Mellanox Technologies, Micron, Microsemi, Red Hat, Samsung, Seagate, SK hynix, Western Digital Corporation, and Xilinx.

Modern computer systems have been built around the assumption that storage is slow, persistent and reliable, while data in memory is fast but volatile. As new storage class memory technologies emerge that drive the convergence of storage and memory attributes, the programmatic and architectural assumptions that have worked in the past are no longer optimal. The challenges associated with explosive data growth, real-time application demands, the emergence of low latency storage class memory, and demand for rack scale resource pools require a new approach to data access.

iXsystems, an industry leader in storage and servers driven by Open Source, today announced that its TrueNAS arrays continue to receive accolades from industry research firm DCIG. The TrueNAS Z50 "TrueFlash" array ranked "Excellent" in the DCIG 2015-2016 All-Flash Array Buyer's Guide. This news comes just months after DCIG awarded the TrueNAS Z20 with an "Excellent" rating in their 2015-2016 Small/Midsize Enterprise (SME) Hybrid Storage Buyer's Guide. DCIG also awarded the TrueNAS Z30 an "Excellent" in their 2015-2016 Midsize Enterprise Hybrid Storage Buyer's Guide.

More than 90 different criteria from 28 different products were evaluated, weighted, and scored in the DCIG 2015-2016 All-Flash Array Buyer's Guide. There is an "Overall Score" as well as rankings for "Management & Software", "Virtualization" and "Hardware". DCIG ranked each category into "Best in Class", "Excellent", "Good", and "Basic."

Micron Technology, Inc., and Seagate Technology plc today announced a strategic agreement that establishes a framework for combining the innovation and expertise of both companies. The framework of the agreement will enable customers of the two companies to benefit from a focused approach to deliver industry-leading storage solutions, helping them innovate faster and more effectively

While initially focusing on next-generation SAS SSDs and strategic NAND supply, Micron and Seagate anticipate that this multi-year agreement will extend into future collaboration on enterprise storage solutions featuring Micron NAND flash memory. "As two of our key partners, we look forward to the benefits of this Micron and Seagate collaboration in future NAND flash-based storage technologies," said Mike Kerouac, President of Global Product Operations for EMC Corporation.

"The strategic agreement between Micron and Seagate promises to deliver new and innovative flash-based storage solutions," said Trevor Schick, Senior Vice President, EG Global Supply Chain, HP.

Worldwide purpose-built backup appliance (PBBA) factory revenues declined -2.5% year over year to $664.5 million in the first quarter of 2014 (1Q14), according to the International Data Corporation (IDC) Worldwide Quarterly Purpose-Built Backup Appliance Tracker. In addition, the total PBBA open systems market fell -2.6% year over year in 1Q14 with revenues totaling $598.9 million while the mainframe market experienced a decline of -1.1% for the same period. Total worldwide PBBA capacity shipped for open systems and mainframe PBBA systems reached 398,280 terabytes, increasing 7.1% year over year.

"The worldwide PBBA market is showing maturity coupled with a typically slow first quarter of the calendar year," said Robert Amatruda, Research Director, Data Protection and Recovery. "We expect the PBBA market will resume growth over the months ahead as customers continue to embrace appliance form factors to meet their growing data protection and recovery challenges."

Diablo Technologies today announced that it will present on Memory Channel Storage (MCS) at EMC World 2014 in Las Vegas. Experts at Diablo will demonstrate the performance of MCS-based devices for virtualized environments in the VMware Theatre on May 7 at 4:15 p.m. PDT.

According to TechNavio, the global enterprise server virtualization market will grow 32 percent over the period 2010-2014. With the increasing adoption of virtualized computing, the need for higher I/O throughput and capacity has reached an important turning point. Traditionally, storage architectures have been unable to leverage the vast processing capabilities of modern CPUs. As a result, the number of virtual machines (VMs) that can be serviced on a single physical server is limited by the properties of pre-existing storage solutions. By leveraging the parallelism of the memory subsystem, Diablo's MCS technology enables ultra-low response times to VMs while simultaneously servicing heavy I/O workloads.

LenovoEMC Limited today announced the worldwide availability of the new LenovoEMC px4-400d Network Storage, a high performance four-bay desktop NAS that delivers advanced data protection plus local and remote content sharing utilizing the simplicity and power of the LenovoEMC LifeLine operating system.

Debuting this week at 2014 International CES tradeshow in Las Vegas, the new LenovoEMC px4-400d utilizes hot swap 7200rpm SATA-III Server Class drives in a compact form factor with up to 16 TB in storage capacity (4 x 4 TB) and up to 25% higher data read and write performance than the previous generation of product.

Lenovo today announced, at the EDUCAUSE annual conference here, two new performance-optimized rack servers, the ThinkServer RD540 and ThinkServer RD640. Armed with the latest Intel Xeon E5 processors, these highly efficient and flexible servers are designed for easy integration into existing IT infrastructures that handle demanding virtualization, cloud and compute-intensive workloads.

Lenovo's ThinkServer RD540 and RD640 are an ideal choice for educational institutions seeking affordable options that pack a punch. The RD540 and RD640 provide the performance, security and reliability needed to support large university workloads and operations. When optionally equipped with Stoneware's webNetwork software, school administrators, students and staff can access data, applications and services from a multitude of devices and platforms using just a browser. With low price points, built-in redundancy, high reliability components and sophisticated cooling technology, the RD540 and RD640 deliver outstanding value for higher education.

LenovoEMC Ltd, a joint venture between industry-leaders Lenovo and EMC that includes the Iomega network storage product business, today announced the rebranding of Iomega products and programs worldwide, emphasizing the identity of this transformative joint venture and laying the foundation for new product and partnership announcements, beginning with a new Acronis agreement to provide PC backup software for select Lenovo network storage products.

Effective immediately, the former Iomega-branded network storage products are available worldwide with new branding that reflects the LenovoEMC business while continuing to utilize the Iomega mark on entry-level consumer network storage products. Lenovo consumer network storage solutions include the desktop single-drive Lenovo Iomega EZ Media and Backup Center (former the Iomega EZ Media and Backup Center), and two models in the Lenovo Iomega ix series of network storage products (formerly the Iomega StorCenter ix series): the desktop double-drive Lenovo Iomega ix2-300d Network Storage, and the desktop quad-drive Lenovo EMC ix4-300d Network Storage.