Kaiserpunk, the highly-anticipated grand city-builder, from Overseer Games and co-published by Elda Entertainment, is now available on Steam for $29.99. Kaiserpunk challenges players to build thriving cities, maximize industrial power, and lead military campaigns across an alternate-history Interbellum Era (1918-1945). Combining large scale city-building, deep production chains, and global conquest, Kaiserpunk offers a unique blend of creativity and strategy. Players can shape their empire through military might or diplomacy—creating a city-state that will rise from the ashes of war and leave its mark on history.

"Kaiserpunk has been a journey of ambition and passion," said Danijel Mihokovic, game director on Kaiserpunk and co-founder of Overseer Games. "We set out to create a city-builder that not only lets you construct a metropolis but also challenges you to shape its destiny on a global scale. We're beyond excited to see players dive into the world and make history their own."

MSI IPC, a global leader in industrial computing solutions, proudly unveils the MS-CF05, V2.0, a high-performance ATX motherboard engineered for industrial automation, edge computing, and embedded applications. Designed to support 14th, 13th, and 12th Gen Intel Core, Pentium, and Celeron processors, the MS-CF05, V2.0 delivers exceptional computing power, scalability, and I/O flexibility, including a PCI slot for legacy support, making it ideal for modern industrial needs.

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is currently showcasing its latest technologies at Embedded World 2025, held from March 11-13 at Nurnberg Messe, Germany.

BIOSTAR's showcase features AI-powered industrial PCs and edge computing platforms that provide secure, efficient, and scalable solutions for industries like automation, smart cities, and human-machine interfaces (HMI) at this year's exhibition. With cutting-edge solutions such as IPC motherboards, panel PC, and edge computing systems, and NVIDIA Jetson Orin edge AI system, the products demonstrate BIOSTAR's capabilities on edge AI and edge computing area for critical industrial applications.

Realtek Semiconductor will participate in the globally acclaimed top technology event—the Embedded World 2025 in Nuremberg, Germany, from March 11 to 13. Highlighted exhibits will include networking multimedia applications, Ethernet solutions for various transmission media, industrial Ethernet switch application solutions, as well as Bluetooth and Wi-Fi/IoT solutions. These exhibits will demonstrate Realtek's innovation in multimedia and communication networks, combined with AI-powered smart applications, providing customers with stable, reliable, and high-performance solutions.

Networked Multimedia Application
Realtek provides end customers with a highly secure, sustainably upgradeable, open-source, and shared Linux platform. Designed to meet the needs of SoCs, it leverages an advanced 12 nm process, a high-performance CPU/GPU, and Edge AI computing with NPU to fully support 4K video decoding and all HDMI 2.1 functions. It also enables audio and video transmission via DisplayPort. Additionally, the platform features high integration with multiple interfaces, including USB, PCIe, GPIO, UART, and SDIO. For system integration, Realtek incorporates its NICs (1G/2.5G/10 Gbps) and Wi-Fi/BT chips. SoCs are able to seamlessly connect to panels of various sizes via built-in MIPI or eDP, ensuring compatibility with networked multimedia applications.

Industrial digitalization is reshaping connectivity requirements across various sectors. From smart manufacturing floors to remote monitoring stations, the industrial environment demands wireless solutions that excel in extreme conditions. Temperature fluctuations ranging from -40°C to 85°C, which were once limiting factors for wireless deployments, now represent the standard operating range for mission-critical industrial systems. This shift reflects the growing importance of wireless connectivity in driving industrial automation, remote operations, and the broader Industrial Internet of Things (IIoT) ecosystem.

Wi-Fi 6: Mastering Temperature Extremes
The Cervoz new Wi-Fi module, MEC-WIFI-2042B-30 W delivers reliable wireless connectivity across the industrial temperature range of -40°C to 85°C. This temperature resilience, combined with Wi-Fi 6 (IEEE 802.11ax) technology, ensures consistent connectivity in environments where standard wireless solutions would fail. The module's 2T2R MIMO architecture delivers throughput up to 1201 Mbps on 80 MHz channels while maintaining stability across both 2.4 GHz and 5 GHz bands. Whether deployed in freezing outdoor installations or high-temperature industrial environments, this robust architecture ensures uninterrupted performance for data-intensive applications.

Team Group Inc. announced today that it will participate in Embedded World 2025, a premier global event for embedded technology. The company will unveil its latest industrial-grade solutions, spanning three key product lines designed to meet the evolving demands of AI, high-performance computing, and data security. These innovations demonstrate Team Group's commitment to advancing efficiency and stability in industrial applications while laying a solid foundation for future technological progress.

Highlighting its leadership in embedded applications and groundbreaking technology, Team Group's D500R WORM Memory Card has been recognized with the prestigious Embedded Award. Join Team Group from March 11-13, 2025, at NürnbergMesse Convention Center in Nuremberg, Germany (Hall 5 / 5-239) to explore the latest breakthroughs and optimal solutions in industrial solutions.

Qualcomm has introduced "Dragonwing," a new brand portfolio consolidating its non-Snapdragon products for industrial applications. The portfolio encompasses industrial IoT, networking, and cellular infrastructure solutions previously marketed under various product lines. The Dragonwing stack integrates AI processing capabilities with low-power computing and connectivity technologies optimized for edge deployment. Target applications include industrial robotics, specialized cameras, industrial handhelds, and unmanned aerial systems. Qualcomm aims to position these solutions in sectors including energy utilities, manufacturing, retail, supply chain, and telecommunications infrastructure.

The branding effort marks a strategic diversification beyond Qualcomm's consumer-focused Snapdragon line. Visually, Dragonwing adopts a purple color scheme that combines elements from Qualcomm's corporate identity with a stylized dragon icon. The portfolio will debut at the Mobile World Congress in Barcelona (March 3-7) and Embedded World in Nuremberg (March 11-13). Although limited, for now, information about Dragonwing processors and solutions should appear soon and give an insight into interesting low-power solutions that will power the next stage of the industrial revolution. Qualcomm has decided to use its mobile development experience and know-how to tap a large market, and solid branding will help it differentiate from competitors instead of the generic product names used in the past. Additionally, Qualcomm's Dragonwing products are mostly focused on more mature nodes like 14 nm and larger, instead of chasing the 3 nm and smaller like its Snapdragon product portfolio.

Advantech, a global leader in industrial and embedded computing, today announced the launch of seven new server platforms built on Intel Xeon 6 processors, optimized for industrial, transportation and communications applications. Designed to meet the increasing demands of complex AI storage and networking workloads, these innovative edge servers and network appliances provide superior performance, reliability, and scalability for system integrators, solutions, and service provider customers.

Intel Xeon 6 - Exceptional Performance for the Widest Range of Workloads
Intel Xeon 6 processors feature advanced performance and efficiency cores, delivering up to 86 cores per CPU, DDR5 memory support with speeds up to 6400 MT/s, and PCIe Gen 5 lanes for high-speed connectivity. Designed to optimize both compute-intensive and scale-out workloads, these processors ensure seamless integration across a wide array of applications.

Cincoze will showcase its full range of embedded computing solutions at Embedded World 2025 (Hall 1, Booth No.: 1-407) in Nuremberg, Germany, on March 11-13. Cincoze will display world-class industrial embedded computing products around the theme of "Edge AI, Smart Integration," encompassing the full spectrum of industrial application environments in four dedicated zones, including GPU embedded computers, DIN-Rail computers, rugged embedded computers, and industrial panel PCs and monitors.

GPU Embedded Computers: AI Application Solutions
The GPU Computing - GOLD product line combines powerful CPUs and GPUs to meet the ultimate performance requirements for edge AI applications. The three-series lineup covers Light, Medium, and Heavy AI use cases. The GJ series features an NVIDIA Jetson SoM GPU with a low-power design specially designed for Light AI applications. The GM series supports MXM GPUs and can meet mobile or Medium AI application requirements. The flagship GP series supports up to two 250 W full-length GPU cards and has patents for heat dissipation, scalability, and securing, making it the best choice for Heavy AI applications. The entire product line has passed EN50121-3-2, E-mark, and MIL-STD-810H to ensure reliability across applications in different industries.

Advantech, a leader in edge computing solutions, is excited to announce the launch of the UBX-330M, a compact NUC-sized edge computer designed to power intelligent city services with advanced AI capabilities.

The UBX-330M is powered by Intel Core Ultra Processors (Meteor Lake H and U), which integrate a CPU, GPU, and NPU to deliver exceptional AI performance in a small form factor. Built as an AI-ready platform, the UBX-330M is perfect for applications requiring robust processing power across industries such as smart retail, hospitality, public spaces, education, entertainment, enterprise, and smart buildings.

OnLogic, a leading provider of edge computing solutions, has launched the Axial AX300, a highly customizable and powerful edge server. The AX300 is engineered to help businesses of any size better leverage their on-site data and unlock the potential of AI by placing powerful computing capabilities on-site.

The Axial AX300 empowers organizations to seamlessly move computing resources closer to the data source, providing significant advantages in performance, latency, operational efficiency, and total cost of ownership over cloud-based data management. With its robust design, flexible configuration options, and advanced security features, the Axial AX300 is the ideal platform for a wide range of highly-impactful edge computing applications, including:

• AI/ML inference and training: Leveraging the power of AI/ML at the edge for real-time insights, predictive maintenance, and improved decision-making.
• Data analytics: Processing and analyzing data generated by IoT devices and sensors in real-time to improve operational efficiency.
• Virtualization: Consolidating multiple workloads onto a single server, optimizing resource utilization and simplifying deployment and management.

The future of AI at the edge has arrived, and ASRock Industrial is leading the way. With Super Mode support for the iEP-6010E Series and iEP-6010E Series Dev Kit, powered by NIVIDIA Jetson Orin NX and Jetson Orin Nano modules and optimized with NVIDIA JetPack 6.2 SDK, this upgrade supercharges AI acceleration, unlocking up to 2X faster generative AI performance. Delivering unprecedented inference speeds, real-time decision-making, and superior power efficiency, Super Mode is redefining edge AI computing - Powering everything from predictive maintenance and anomaly detection to AI-driven medical imaging, intelligent surveillance, and autonomous mobility - pushing performance beyond limits, faster, smarter, and more efficient than ever before. Whether driving Edge AI computing, real-time vision processing, intelligent autonomous vehicles, advanced robotics, industrial automation, or smart city infrastructure, ASRock Industrial's latest innovation empowers industries with cutting-edge AI capabilities that drive real-world transformation.

A Quantum Leap in Edge AI Performance
The iEP-6010E Series and iEP-6010E Series Dev Kit, now optimized with Super Mode, provides:

• Up to 2X Faster Gen AI Processing - Up to 157 TOPS (Sparse) on Orin NX 16 GB (Super) and 67 TOPS (Sparse) on Orin Nano 8 GB (Super), delivering blazing-fast generative AI performance for automation, robotics, and real-time vision systems.
• Optimized Power Boost and Efficiency - Supports power modes up to 40 W / MAXN Super on Orin NX and 25 W / MAXN Super on Orin Nano, while maintaining high-performance AI workloads in power-sensitive environments, making it ideal for industrial automation and smart city infrastructure.
• NVIDIA JetPack 6.2 Support - Fully compatible with the latest NVIDIA JetPack 6.2 SDK, offering enhanced libraries, frameworks, and tools to accelerate advanced AI development.

Shrinking components was (and still is) the main way to boost the speed of all electronic devices; however, as devices get tinier, making them becomes trickier. A group of scientists from SANKEN (The Institute of Scientific and Industrial Research), at Osaka University has discovered another method to enhance performance: putting a special metal layer known as a metamaterial on top of a silicon base to make electrons move faster. This approach shows promise, but the tricky part is managing the metamaterial's structure so it can adapt to real-world needs.

To address this, the team looked into vanadium dioxide (VO₂). When heated, VO₂ changes from non-conductive to metallic, allowing it to carry electric charge like small adjustable electrodes. The researchers used this effect to create 'living' microelectrodes, which made silicon photodetectors better at spotting terahertz light. "We made a terahertz photodetector with VO₂ as a metamaterial. Using a precise method, we created a high-quality VO₂ layer on silicon. By controlling the temperature, we adjusted the size of the metallic regions—much larger than previously possible—which affected how the silicon detected terahertz light," says lead author Ai I. Osaka.

Lantronix Inc., a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced it will launch its new 28-port SM24TBT4XPA Managed 2.5G Ethernet PoE++ network switch as well as feature its 24-port SM24TBT4SA and 8-port SM8TBT2SA Managed Gigabit Ethernet PoE++ network switches at the 2025 BICSI Winter Conference & Exhibition. Taking place Feb. 4-6, 2025, at the Gaylord Palms Resort & Convention Center in Orlando, Fla., Lantronix will exhibit these newest items, along with more IoT network solutions, at booth Number 910.

"At BICSI, we will feature our new PoE++ network switches that offer flexibility in port speed and power while delivering the always-on performance needed for critical applications, such as smart building, wireless and security and surveillance. Our users know they can rely on Lantronix's secure network solutions to stay connected at the network edge while gaining easy, intuitive control of end-to-end devices," said Mathi Gurusamy, chief strategy officer at Lantronix.

Rugged embedded computer brand—Cincoze has launched the latest addition to the Rugged Computing - DIAMOND product line, the Entry Performance & Compact industrial computer DC-1300 series. It packs maximum performance and expansion flexibility in a compact 185 x 131 x 56.5 mm chassis. The new generation DC-1300 series can be equipped with an Intel Alder Lake-N processor, supports the essential I/O interfaces for industrial applications, and provides complete wireless transmission solutions (Wi-Fi, 5G, GNSS, etc.). The DC-1300 continues the legacy of the DC series for successful integration in space-limited industrial automation applications, providing customers with the latest solutions.

The new generation DC-1300 series addresses the continued performance demands in automation applications. It supports the latest Alder Lake-N platform Intel Core i3-N305 processor, with computing performance of 4.5 times that of the previous generation. The DC-1300 supports up to 16 GB DDR5 4800 MHz in a single memory slot. It offers flexible storage options, such as 2.5-inch SATA HDD/SSD or Half-Slim SSD. Additionally, it supports expansion via the M.2 slot for NVMe SSD to meet the needs of different application scenarios.

Advantech, a global leader in embedded IoT computing, is excited to launch its latest Edge AI solutions featuring the advanced AMD Ryzen Embedded 8000 Series processors. The SOM-6873 (COMe Compact), AIMB-2210 (Mini-ITX motherboards), and AIR-410 (AI Inference System) deliver exceptional AI performance leveraging the first AMD embedded devices with integrated Neural Processing Units. These integrated NPUs are optimized to enhance AI inference efficiency and precision. Together with traditional CPU and GPU elements, the architecture delivers performance up to 39 TOPS. They also support dual-channel DDR5 memory and PCIe Gen 4, providing ample computing power with flexible TDP options and thermal solutions.

Within value-added software services, such as the Edge AI SDK that integrates the AMD Ryzen AI software, the model porting procedure is accelerated. These features make the solutions ideal for edge applications such as HMI, machine vision in industrial automation, smart management and interactive services in urban entertainment systems, and healthcare devices such as ultrasound machines.

ASRock Industrial is proud to announce the launch of its highly anticipated NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series built to revolutionize AI-driven computing. Powered by Intel Core Ultra 200H processors (Arrow Lake-H), the series delivers up to 99 TOPS of AI inferencing power, offering cutting-edge performance in a compact form factor. Designed to meet the growing needs of industries such as AI-enhanced business operations, immersive content creation, and high-performance gaming, the NUC(S) Ultra 200 BOX Series is engineered to provide next-level computing power with Intel's latest performance hybrid architecture, Intel Arc GPU, and NPU.

These compact systems are built for users who demand powerful multitasking capabilities, from AI inferencing to media-rich applications and data processing. With its space-saving design and exceptional versatility, the NUC(S) Ultra 200 BOX Series ensures efficient, high-speed performance across a range of applications—redefining what's possible in modern computing.

ASRock Industrial unveils the 4X4 BOX AI300 Series, a compact powerhouse designed to redefine AI computing with AMD Ryzen AI 300 Series processors. Featuring the Ryzen AI 7 350 and Ryzen AI 5 340 processors, this series delivers up to 50 TOPS of NPU performance, supporting Copilot+ PC experiences and AI-enhanced multitasking. With up to 96 GB dual-channel DDR5 5600 MHz memory, quad display up to 8K, and versatile connectivity, including dual LAN ports, Wi-Fi 6E, five USB ports with two USB4, it combines exceptional AI performance with scalability and efficiency.

Equipped with Ryzen AI as its dedicated AI engine, the 4X4 BOX AI300 Series ensures responsive AI processing paving the way for next generation productivity. Living up to its slogan, "Tiny Box AI Rocks," the 4X4 BOX AI300 Series is engineered for AI PCs, gaming, content creation, tech enthusiasts, prosumers, and AIoT applications.

ASRock Industrial proudly unveils its newest range of industrial motherboards, powered by Intel Core Ultra 200S Processors (Arrow Lake-S) with Intel 800 series chipsets. Featuring an advanced hybrid architecture with up to 24 cores and an upgraded NPU, these motherboards empower exceptional edge performance, energy-efficiency, and enhanced AI acceleration for complex AI driven workloads. The new range of motherboards support up to DDR5 6400 MHz memory, offering versatile I/O, expansion options, quad display capabilities. Featuring PCIe Gen 5, and USB4/ Thunderbolt 4 for ultra-fast connectivity, select models offer 10G LAN to meet the demands of high-speed networking. With flexible form factors including Mini-ITX, Micro-ATX, and ATX, these motherboards cater to versatile edge AI applications across industrial automation, robotics, AI agents, kiosks, retail, gaming and beyond.

Mini-ITX Models (High Rise I/O): IMB-1246 and IMB-1247
Leveraging Intel Core Ultra 200S Processors, the IMB-1246 utilizes the H810 Chipset, while the IMB-1247 features the Q870 Chipset, offering enhanced scalability. Both models support up to 96 GB DDR5 memory via two CSO-DIMM (DDR5 6400 MHz) or SO-DIMM (DDR5 5600 MHz) slots. Offering various expansion capabilities and I/O tailored for diverse applications, including one PCIe x16 (Gen 5) and one USB4/ Thunderbolt 4. The IMB-1246 provides two USB 3.2 Gen 2, one USB 3.2 Gen 1, four USB 2.0, one M.2 Key E, one M.2 Key M, four COM ports, and two SATA 3 ports, while the IMB-1247 enhances connectivity with five USB 3.2 Gen 2, two USB 3.2 Gen 1, two USB 2.0, one M.2 Key B, one M.2 Key E, two M.2 Key M, four COM ports, and three SATA 3 ports. Networking feature offers one 2.5G LAN and one 1G LAN. Display support includes triple display output on the IMB-1246 with two HDMI 2.1 TMDS, one DP 2.1 (via Type-C), and one LVDS/eDP while the IMB-1247 supports quad display output, adding one DP 1.4a for greater flexibility.

At CES 2025, Qualcomm Technologies, Inc., today announced Qualcomm AI On-Prem Appliance Solution, an on-premises desktop or wall-mounted hardware solution, and Qualcomm AI Inference Suite, a set of software and services for AI inferencing spanning from near-edge to cloud. The combination of these new offerings allows for small and medium businesses, enterprises and industrial organizations to run custom and off-the-shelf AI applications on their premises, including generative workloads. Running AI inference on premises can deliver significant savings in operational costs and overall total cost of ownership (TCO), compared to the cost of renting third-party AI infrastructure.

Using the AI On-Prem Appliance Solution in concert with the AI Inference Suite, customers can now use generative AI leveraging their proprietary data, fine-tuned models, and technology infrastructure to automate human and machine processes and applications in virtually any end environment, such as retail stores, quick service restaurants, shopping outlets, dealerships, hospitals, factories and shop floors - where the workflow is well established, repeatable and ready for automation.

Silicon Power (SP) is excited to announce the launch of its first M.2 PCIe 2230 E-Key SSD, the MEM3K0E, further solidifying its commitment to delivering innovative and versatile solutions for the growing demands of artificial intelligence (AI) and edge computing applications. With the introduction of this compact form factor, the company provides developers with more options to optimize system configurations while empowering next-generation AI technologies.

An Optimized Cache and Buffer Solution
Compliant to the PCIe 3.1 standard and NVMe 1.4 protocol, the MEM3K0E is specifically designed for devices equipped with E-Key slots, making it an ideal cache and buffer storage solution to complement M-Key slot primary drives. Its chief role is to maintain stable system performance by balancing the workload during resource-intensive tasks, which it achieves with features such as a thermal throttling function and built-in voltage detector. With storage capacity options of 64 GB, 128 GB, 256 GB, and 512 GB, the MEM3K0E offers scalability for various applications, ranging from compact embedded systems to high-performance computing environments.

Apacer Technology, a global leader in digital storage solutions, has announced the mass production of its latest industrial-grade DDR5-6400 CUDIMM and CSODIMM memory modules. These modules are the first to feature a fully lead-free resistor design, eliminating the need for exemptions under the EU RoHS directive. Equipped with premium professional-grade Clock Driver (CKD) components and Transient Voltage Suppressors (TVS) diode as dual-core technologies, the modules are specifically engineered for high-performance computing (HPC) and artificial intelligence (AI) applications. These products ensure exceptional stability and security even in extreme industrial environments, providing enterprises with reliable, eco-friendly, and high-performance solutions.

In alignment with the global push for sustainability, Apacer's fully lead-free DDR5 series has attracted significant customer interest, particularly for its compliance with the EU RoHS 7(c)-I lead exemption clause. By adopting this series early, customers can proactively mitigate risks associated with the expiration of exemption extensions. Now in mass production, these fully lead-free DDR5 CUDIMM and CSODIMM modules not only help customers meet international regulatory standards but also empower them to gain a competitive edge in the high-performance computing market.

Axelera AI - a leading edge-inference company - and Arduino, the global leader in open-source hardware and software, today announced a strategic partnership to make high-performance AI at the edge more accessible than ever, building advanced technology solutions based on inference and an open ecosystem. This furthers Axelera AI's strategy to democratize artificial intelligence everywhere.

The collaboration will combine the strengths of Axelera AI's Metis AI Platform with the powerful SOMs from the Arduino Pro range to provide customers with easy-to-use hardware and software to innovate around AI. Users will enjoy the freedom to dictate their own AI journey, thanks to tools that provide unique digital in-memory computing and RISC-V controlled dataflow technology, delivering high performance and usability at a fraction of the cost and power of other solutions available today.

Edimax is pleased to announce the release of the D5G-8459 Industrial 5G NR DIN-Rail Router, a powerful solution for seamless wireless and wired connectivity in the most challenging environments. Capable of operating within a temperature range of -20°C to 70°C, this router delivers reliable 5G NR internet access in locations where fixed broadband is unavailable or impractical.

Equipped with the RM520-GL (Qualcomm Snapdragon x62), the D5G-8459 router offers enhanced reliability, compatibility, and high performance. It supports automatic failover between 5G NR and wired Ethernet, ensuring continuous connectivity even during network disruptions. This level of redundancy is vital for industries reliant on uninterrupted services, including payment systems, remote data transfers, online meetings, and video streaming, making it an indispensable tool in ensuring smooth operations.

ADLINK Technology Inc., a global leader in edge computing, has introduced the all-new Mini PC EMP-100. The smallest of its kind of the series (just 13 x 10.7 x 2.8 cm), this fanless PC and Dual 4K Media Player is robust and extremely versatile. It includes an Intel Celeron N6210/J6412 processor; IoT connectivity (Single GbE LAN and Optional Wi-Fi 6/BT 5.2 module); an M.2 2280 Key M for optional storage and Key E for optional Wi-Fi/BT modules; and two HDMI output ports. This combination plus adaptable function expansion makes it truly multipurpose.

Exceptional Media player
The EMP-100 Series was developed to support sophisticated digital signage with Dual 4K UHD display for clear and vibrant content; interactive kiosks; and the development of IoT and AI applications in the smart retail sector - enhancing the customer experience and boosting commercial engagement. The fanless design can be operated continuously in a broad range of temperatures and significantly reduces maintenance.