MSI IPC, a leading provider of industrial computing solutions, is set to exhibit at Japan IT Week Spring 2025, held from April 23-25 at Tokyo Big Sight, Booth East Hall 3 #21-2. The company will showcase its latest innovations in AI computing, embedded systems, and edge intelligence, designed for smart manufacturing, medical, transportation, and industrial applications.

Explore the Future of Industrial Computing
MSI IPC will host a static demo featuring Intel Twin Lake, Raptor Lake, and Arrow Lake, allowing attendees to experience next-gen performance and AI acceleration. Key platforms include:

• MS-CF20 ATX (W880 chipset)- Built for high-performance workloads with expandability for industrial applications.
• MS-CF23 Mini-ITX (H810 chipset) - Compact yet powerful, ideal for space-sensitive deployments.
• MS-C927 Embedded Box PC (Arrow Lake-U & Meteor Lake-U) - Fanless, wide-temp system for industrial and embedded environments.

ADLINK Technology Inc., a global leader in edge computing, proudly announces that its newly released EMP-520 Series industrial compact box PC has been recognized for its excellence, securing the Best-in-Show award in the Computer Boards, Systems, Components & Peripherals category at embedded world 2025. It was selected for its innovative design, user-centric features, and exceptional performance in industrial environments.

Smart, Reliable, and Efficient Industrial Computing Solution
Designed to meet the needs of modern industrial applications, the EMP-520 Series delivers high computing performance with minimal maintenance, helping businesses maximize productivity and reduce downtime. Powered by Intel 14th Gen Core processors, it ensures energy-efficient operation, making it ideal for high-demand environments that require continuous, reliable computing. Supporting four simultaneous 4K video outputs and EDID emulation, users can achieve seamless visual performance. The compact design enables easy integration into space-constrained environments while ensuring reliable operation in mission-critical applications.

As industrial systems become more interconnected and data-driven, the need for connectivity solutions that offer superior performance, scalability, and flexibility is growing rapidly. Cervoz, a leading provider of industrial embedded modules, is meeting this demand with an expanding portfolio of innovative, real-world expansion solutions.

Seamless Expansion for Future-Ready Performance
Picture a smart logistics hub handling tens of thousands of packages a day, where Autonomous Mobile Robots (AMRs) operates across vast spaces. In such environments, traditional RJ45 connections may initially suffice—but as operation expand and AMRs navigate distances beyond 100 meters, connectivity becomes prone to signal degradation and industrial interference.

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, today unveils the MS-X7433RE, a compact, high-performance embedded system purpose-built for modern kiosk applications and edge computing environments. Powered by the Intel Amston Lake X7433RE processor, the MS-X7433RE delivers efficient performance with its quad-core architecture, reaching speeds up to 3.4 GHz while maintaining a low TDP of just 9 W. Integrated Intel UHD Graphics drives both HDMI 2.0 and DisplayPort 1.4++ outputs, making it an excellent choice for digital displays, payment machines, and access control systems.

Designed for system integrators and developers, the MS-X7433RE combines reliable hardware with flexible expansion options. It supports up to 16 GB of DDR5 4800 MHz memory and includes a SATA III port alongside an M.2 Key-M slot, enabling both traditional and high-speed NVMe storage. A Mini-PCIe slot and M.2 Key-B interface with support for 4G/5G modules make it easy to tailor the system for wireless connectivity and real-time data processing unlocking superior edge computing capability.

The BCM MX-MTLPS is a Thin Mini-ITX motherboard designed to take advantage of Intel's latest Core Ultra 3/5/7 processors, built on the Meteor Lake-PS (MTL-PS) platform. As one of the first Mini-ITX form factor boards to support Intel's new socketed SoC design, the MX-MTLPS offers an ideal blend of AI acceleration, integrated graphics, and power-efficient compute—all in a low-profile, fanless-capable footprint.

With a strong focus on edge AI, multi-display, and embedded computing, the MX-MTLPS allows system developers to bring mobile-class performance to desktop-style deployments in space-constrained or thermally sensitive environments.

Hey Module Makers, and welcome to a special edition of the Modulus Dev Log! We've got big news: the Modulus demo is officially live! If you've been waiting to dive into our factory automation sandbox, now's the perfect time to jump in, start optimizing, and let those conveyor belts roll. But today, we're not just celebrating the demo launch, we're also taking a look back at how Modulus has evolved throughout development. From early prototypes to the design choices that shaped the demo, we're pulling back the curtain on what it takes to bring a game like this to life. As well as introducing you to some of the team.

Award-winning developer Happy Volcano (You Suck at Parking, The Almost Gone) and publisher Astra Logical are proud to announce the first-ever demo for Modulus, a factory automation game where players build every piece from the ground up with building-block modules. Cut, color, stamp, and assemble these modules to design an impressive factory with your own creative twist. There are no fixed recipes in Modulus. Players produce each construct from the very modules they manufacture, resulting in a highly personalized approach to factory-building. Witness these structures rise and construct in real time, with each block becoming a visible part of the design. The more complex the buildings, the more advanced the modules must become.

In industrial environments, equipment runs 24/7, handling frequent and intensive write operations. To support these demanding workloads, storage solutions must offer high endurance to extend lifespan, minimize downtime, and lower Total Cost of Ownership (TCO). Designed to meet these demands, the Cervoz T455 Series, M.2 2280 NVMe SSD delivers 35% greater endurance through a refined firmware architecture and proven storage technologies. Ideal for industrial automation, edge computing, and high-performance computing (HPC), it ensures reliable performance under heavy workloads.

Enhanced Endurance for Demanding Industrial Applications—Over-Provisioning Technology: Endurance SSD Performance and Longevity
Cervoz's Over-Provisioning technology optimizes SSD performance by reserving extra storage space, boosting efficiency, and extending lifespan. How SSD Over-Provisioning Delivers Benefits:

• Extended Lifespan: Efficiently reserves additional storage space, enhancing NAND durability at least 35%.
• Consistent Performance: Maintains steady performance levels even under high-intensity workloads.
• Optimized Resource Management: Reserved space allocation for optimal write efficiency.

ASRock Industrial introduces the iEP(F)-9040 Series, a next-generation Robust Edge AIoT Platform designed to deliver high-performance edge AI computing, real-time industrial automation, and scalable expansion for smart manufacturing, intelligent vision systems, autonomous robotics, and edge AI applications. Powered by Intel Core 200S Processors (Bartlett Lake-S), the iEP(F)-9040 Series enables seamless AI inferencing, high-speed data processing, and intelligent edge computing for industrial IoT and AIoT applications. With support for up to 24 cores and 32 threads with enhanced longevity, DDR5 5600 MHz memory up to 96 GB, PCIe Gen 5 expansion, the Series is built to handle complex AI workloads. Designed to thrive in extreme industrial conditions, the series supports up to -40°C~75°C wide operating temperature range and 9 V-36 V DC power input with ignition control, ensuring reliable operation in mission-critical environments. The iEP(F)-9040 Series features rich industrial I/O, supports real-time TSN/TCC, and connectivity options like 5G/4G LTE, Wi-Fi 6E and BT 5.4 for high-speed, low-latency communication. The Series is ideal for various industrial applications such as smart factory, AI-based Inspection, robotics, surveillance, smart transportation, and more, providing a future-ready AIoT solution for next generation edge and industrial intelligence.

Optimized AI and Compute Performance with Intel Core 200S Processors
The iEP(F)-9040 Series harness the power of Intel Core 200S Processors (Bartlett Lake-S) to deliver superior computing performance and AI acceleration with long-term support. With up to 24 (8P+16E) cores, delivering up to 32 threads, the series enables real-time AI inferencing, industrial automation, and intelligent edge computing. Compared to previous generations, Intel Core 200S Processors (Bartlett Lake-S) achieve up to 1.06x faster single-threaded and 1.08x faster multi-thread performance. Supporting dual DDR5 5600 MHz SO-DIMM memory up to 96 GB, the iEP(F)-9040 Series significantly boosts machine vision, AI model deployment, and automation. Integrated Intel UHD Graphics provides up to 4K high-resolution AI-driven imaging, with DisplayPort 1.4a, HDMI 2.0b, and VGA outputs for flexible industrial display configurations.

Kaiserpunk, the highly-anticipated grand city-builder, from Overseer Games and co-published by Elda Entertainment, is now available on Steam for $29.99. Kaiserpunk challenges players to build thriving cities, maximize industrial power, and lead military campaigns across an alternate-history Interbellum Era (1918-1945). Combining large scale city-building, deep production chains, and global conquest, Kaiserpunk offers a unique blend of creativity and strategy. Players can shape their empire through military might or diplomacy—creating a city-state that will rise from the ashes of war and leave its mark on history.

"Kaiserpunk has been a journey of ambition and passion," said Danijel Mihokovic, game director on Kaiserpunk and co-founder of Overseer Games. "We set out to create a city-builder that not only lets you construct a metropolis but also challenges you to shape its destiny on a global scale. We're beyond excited to see players dive into the world and make history their own."

MSI IPC, a global leader in industrial computing solutions, proudly unveils the MS-CF05, V2.0, a high-performance ATX motherboard engineered for industrial automation, edge computing, and embedded applications. Designed to support 14th, 13th, and 12th Gen Intel Core, Pentium, and Celeron processors, the MS-CF05, V2.0 delivers exceptional computing power, scalability, and I/O flexibility, including a PCI slot for legacy support, making it ideal for modern industrial needs.

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is currently showcasing its latest technologies at Embedded World 2025, held from March 11-13 at Nurnberg Messe, Germany.

BIOSTAR's showcase features AI-powered industrial PCs and edge computing platforms that provide secure, efficient, and scalable solutions for industries like automation, smart cities, and human-machine interfaces (HMI) at this year's exhibition. With cutting-edge solutions such as IPC motherboards, panel PC, and edge computing systems, and NVIDIA Jetson Orin edge AI system, the products demonstrate BIOSTAR's capabilities on edge AI and edge computing area for critical industrial applications.

Realtek Semiconductor will participate in the globally acclaimed top technology event—the Embedded World 2025 in Nuremberg, Germany, from March 11 to 13. Highlighted exhibits will include networking multimedia applications, Ethernet solutions for various transmission media, industrial Ethernet switch application solutions, as well as Bluetooth and Wi-Fi/IoT solutions. These exhibits will demonstrate Realtek's innovation in multimedia and communication networks, combined with AI-powered smart applications, providing customers with stable, reliable, and high-performance solutions.

Networked Multimedia Application
Realtek provides end customers with a highly secure, sustainably upgradeable, open-source, and shared Linux platform. Designed to meet the needs of SoCs, it leverages an advanced 12 nm process, a high-performance CPU/GPU, and Edge AI computing with NPU to fully support 4K video decoding and all HDMI 2.1 functions. It also enables audio and video transmission via DisplayPort. Additionally, the platform features high integration with multiple interfaces, including USB, PCIe, GPIO, UART, and SDIO. For system integration, Realtek incorporates its NICs (1G/2.5G/10 Gbps) and Wi-Fi/BT chips. SoCs are able to seamlessly connect to panels of various sizes via built-in MIPI or eDP, ensuring compatibility with networked multimedia applications.

Industrial digitalization is reshaping connectivity requirements across various sectors. From smart manufacturing floors to remote monitoring stations, the industrial environment demands wireless solutions that excel in extreme conditions. Temperature fluctuations ranging from -40°C to 85°C, which were once limiting factors for wireless deployments, now represent the standard operating range for mission-critical industrial systems. This shift reflects the growing importance of wireless connectivity in driving industrial automation, remote operations, and the broader Industrial Internet of Things (IIoT) ecosystem.

Wi-Fi 6: Mastering Temperature Extremes
The Cervoz new Wi-Fi module, MEC-WIFI-2042B-30 W delivers reliable wireless connectivity across the industrial temperature range of -40°C to 85°C. This temperature resilience, combined with Wi-Fi 6 (IEEE 802.11ax) technology, ensures consistent connectivity in environments where standard wireless solutions would fail. The module's 2T2R MIMO architecture delivers throughput up to 1201 Mbps on 80 MHz channels while maintaining stability across both 2.4 GHz and 5 GHz bands. Whether deployed in freezing outdoor installations or high-temperature industrial environments, this robust architecture ensures uninterrupted performance for data-intensive applications.

Team Group Inc. announced today that it will participate in Embedded World 2025, a premier global event for embedded technology. The company will unveil its latest industrial-grade solutions, spanning three key product lines designed to meet the evolving demands of AI, high-performance computing, and data security. These innovations demonstrate Team Group's commitment to advancing efficiency and stability in industrial applications while laying a solid foundation for future technological progress.

Highlighting its leadership in embedded applications and groundbreaking technology, Team Group's D500R WORM Memory Card has been recognized with the prestigious Embedded Award. Join Team Group from March 11-13, 2025, at NürnbergMesse Convention Center in Nuremberg, Germany (Hall 5 / 5-239) to explore the latest breakthroughs and optimal solutions in industrial solutions.

Qualcomm has introduced "Dragonwing," a new brand portfolio consolidating its non-Snapdragon products for industrial applications. The portfolio encompasses industrial IoT, networking, and cellular infrastructure solutions previously marketed under various product lines. The Dragonwing stack integrates AI processing capabilities with low-power computing and connectivity technologies optimized for edge deployment. Target applications include industrial robotics, specialized cameras, industrial handhelds, and unmanned aerial systems. Qualcomm aims to position these solutions in sectors including energy utilities, manufacturing, retail, supply chain, and telecommunications infrastructure.

The branding effort marks a strategic diversification beyond Qualcomm's consumer-focused Snapdragon line. Visually, Dragonwing adopts a purple color scheme that combines elements from Qualcomm's corporate identity with a stylized dragon icon. The portfolio will debut at the Mobile World Congress in Barcelona (March 3-7) and Embedded World in Nuremberg (March 11-13). Although limited, for now, information about Dragonwing processors and solutions should appear soon and give an insight into interesting low-power solutions that will power the next stage of the industrial revolution. Qualcomm has decided to use its mobile development experience and know-how to tap a large market, and solid branding will help it differentiate from competitors instead of the generic product names used in the past. Additionally, Qualcomm's Dragonwing products are mostly focused on more mature nodes like 14 nm and larger, instead of chasing the 3 nm and smaller like its Snapdragon product portfolio.

Advantech, a global leader in industrial and embedded computing, today announced the launch of seven new server platforms built on Intel Xeon 6 processors, optimized for industrial, transportation and communications applications. Designed to meet the increasing demands of complex AI storage and networking workloads, these innovative edge servers and network appliances provide superior performance, reliability, and scalability for system integrators, solutions, and service provider customers.

Intel Xeon 6 - Exceptional Performance for the Widest Range of Workloads
Intel Xeon 6 processors feature advanced performance and efficiency cores, delivering up to 86 cores per CPU, DDR5 memory support with speeds up to 6400 MT/s, and PCIe Gen 5 lanes for high-speed connectivity. Designed to optimize both compute-intensive and scale-out workloads, these processors ensure seamless integration across a wide array of applications.

Cincoze will showcase its full range of embedded computing solutions at Embedded World 2025 (Hall 1, Booth No.: 1-407) in Nuremberg, Germany, on March 11-13. Cincoze will display world-class industrial embedded computing products around the theme of "Edge AI, Smart Integration," encompassing the full spectrum of industrial application environments in four dedicated zones, including GPU embedded computers, DIN-Rail computers, rugged embedded computers, and industrial panel PCs and monitors.

GPU Embedded Computers: AI Application Solutions
The GPU Computing - GOLD product line combines powerful CPUs and GPUs to meet the ultimate performance requirements for edge AI applications. The three-series lineup covers Light, Medium, and Heavy AI use cases. The GJ series features an NVIDIA Jetson SoM GPU with a low-power design specially designed for Light AI applications. The GM series supports MXM GPUs and can meet mobile or Medium AI application requirements. The flagship GP series supports up to two 250 W full-length GPU cards and has patents for heat dissipation, scalability, and securing, making it the best choice for Heavy AI applications. The entire product line has passed EN50121-3-2, E-mark, and MIL-STD-810H to ensure reliability across applications in different industries.

Advantech, a leader in edge computing solutions, is excited to announce the launch of the UBX-330M, a compact NUC-sized edge computer designed to power intelligent city services with advanced AI capabilities.

The UBX-330M is powered by Intel Core Ultra Processors (Meteor Lake H and U), which integrate a CPU, GPU, and NPU to deliver exceptional AI performance in a small form factor. Built as an AI-ready platform, the UBX-330M is perfect for applications requiring robust processing power across industries such as smart retail, hospitality, public spaces, education, entertainment, enterprise, and smart buildings.

OnLogic, a leading provider of edge computing solutions, has launched the Axial AX300, a highly customizable and powerful edge server. The AX300 is engineered to help businesses of any size better leverage their on-site data and unlock the potential of AI by placing powerful computing capabilities on-site.

The Axial AX300 empowers organizations to seamlessly move computing resources closer to the data source, providing significant advantages in performance, latency, operational efficiency, and total cost of ownership over cloud-based data management. With its robust design, flexible configuration options, and advanced security features, the Axial AX300 is the ideal platform for a wide range of highly-impactful edge computing applications, including:

• AI/ML inference and training: Leveraging the power of AI/ML at the edge for real-time insights, predictive maintenance, and improved decision-making.
• Data analytics: Processing and analyzing data generated by IoT devices and sensors in real-time to improve operational efficiency.
• Virtualization: Consolidating multiple workloads onto a single server, optimizing resource utilization and simplifying deployment and management.

The future of AI at the edge has arrived, and ASRock Industrial is leading the way. With Super Mode support for the iEP-6010E Series and iEP-6010E Series Dev Kit, powered by NIVIDIA Jetson Orin NX and Jetson Orin Nano modules and optimized with NVIDIA JetPack 6.2 SDK, this upgrade supercharges AI acceleration, unlocking up to 2X faster generative AI performance. Delivering unprecedented inference speeds, real-time decision-making, and superior power efficiency, Super Mode is redefining edge AI computing - Powering everything from predictive maintenance and anomaly detection to AI-driven medical imaging, intelligent surveillance, and autonomous mobility - pushing performance beyond limits, faster, smarter, and more efficient than ever before. Whether driving Edge AI computing, real-time vision processing, intelligent autonomous vehicles, advanced robotics, industrial automation, or smart city infrastructure, ASRock Industrial's latest innovation empowers industries with cutting-edge AI capabilities that drive real-world transformation.

A Quantum Leap in Edge AI Performance
The iEP-6010E Series and iEP-6010E Series Dev Kit, now optimized with Super Mode, provides:

• Up to 2X Faster Gen AI Processing - Up to 157 TOPS (Sparse) on Orin NX 16 GB (Super) and 67 TOPS (Sparse) on Orin Nano 8 GB (Super), delivering blazing-fast generative AI performance for automation, robotics, and real-time vision systems.
• Optimized Power Boost and Efficiency - Supports power modes up to 40 W / MAXN Super on Orin NX and 25 W / MAXN Super on Orin Nano, while maintaining high-performance AI workloads in power-sensitive environments, making it ideal for industrial automation and smart city infrastructure.
• NVIDIA JetPack 6.2 Support - Fully compatible with the latest NVIDIA JetPack 6.2 SDK, offering enhanced libraries, frameworks, and tools to accelerate advanced AI development.

Shrinking components was (and still is) the main way to boost the speed of all electronic devices; however, as devices get tinier, making them becomes trickier. A group of scientists from SANKEN (The Institute of Scientific and Industrial Research), at Osaka University has discovered another method to enhance performance: putting a special metal layer known as a metamaterial on top of a silicon base to make electrons move faster. This approach shows promise, but the tricky part is managing the metamaterial's structure so it can adapt to real-world needs.

To address this, the team looked into vanadium dioxide (VO₂). When heated, VO₂ changes from non-conductive to metallic, allowing it to carry electric charge like small adjustable electrodes. The researchers used this effect to create 'living' microelectrodes, which made silicon photodetectors better at spotting terahertz light. "We made a terahertz photodetector with VO₂ as a metamaterial. Using a precise method, we created a high-quality VO₂ layer on silicon. By controlling the temperature, we adjusted the size of the metallic regions—much larger than previously possible—which affected how the silicon detected terahertz light," says lead author Ai I. Osaka.

Lantronix Inc., a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced it will launch its new 28-port SM24TBT4XPA Managed 2.5G Ethernet PoE++ network switch as well as feature its 24-port SM24TBT4SA and 8-port SM8TBT2SA Managed Gigabit Ethernet PoE++ network switches at the 2025 BICSI Winter Conference & Exhibition. Taking place Feb. 4-6, 2025, at the Gaylord Palms Resort & Convention Center in Orlando, Fla., Lantronix will exhibit these newest items, along with more IoT network solutions, at booth Number 910.

"At BICSI, we will feature our new PoE++ network switches that offer flexibility in port speed and power while delivering the always-on performance needed for critical applications, such as smart building, wireless and security and surveillance. Our users know they can rely on Lantronix's secure network solutions to stay connected at the network edge while gaining easy, intuitive control of end-to-end devices," said Mathi Gurusamy, chief strategy officer at Lantronix.

Rugged embedded computer brand—Cincoze has launched the latest addition to the Rugged Computing - DIAMOND product line, the Entry Performance & Compact industrial computer DC-1300 series. It packs maximum performance and expansion flexibility in a compact 185 x 131 x 56.5 mm chassis. The new generation DC-1300 series can be equipped with an Intel Alder Lake-N processor, supports the essential I/O interfaces for industrial applications, and provides complete wireless transmission solutions (Wi-Fi, 5G, GNSS, etc.). The DC-1300 continues the legacy of the DC series for successful integration in space-limited industrial automation applications, providing customers with the latest solutions.

The new generation DC-1300 series addresses the continued performance demands in automation applications. It supports the latest Alder Lake-N platform Intel Core i3-N305 processor, with computing performance of 4.5 times that of the previous generation. The DC-1300 supports up to 16 GB DDR5 4800 MHz in a single memory slot. It offers flexible storage options, such as 2.5-inch SATA HDD/SSD or Half-Slim SSD. Additionally, it supports expansion via the M.2 slot for NVMe SSD to meet the needs of different application scenarios.

Advantech, a global leader in embedded IoT computing, is excited to launch its latest Edge AI solutions featuring the advanced AMD Ryzen Embedded 8000 Series processors. The SOM-6873 (COMe Compact), AIMB-2210 (Mini-ITX motherboards), and AIR-410 (AI Inference System) deliver exceptional AI performance leveraging the first AMD embedded devices with integrated Neural Processing Units. These integrated NPUs are optimized to enhance AI inference efficiency and precision. Together with traditional CPU and GPU elements, the architecture delivers performance up to 39 TOPS. They also support dual-channel DDR5 memory and PCIe Gen 4, providing ample computing power with flexible TDP options and thermal solutions.

Within value-added software services, such as the Edge AI SDK that integrates the AMD Ryzen AI software, the model porting procedure is accelerated. These features make the solutions ideal for edge applications such as HMI, machine vision in industrial automation, smart management and interactive services in urban entertainment systems, and healthcare devices such as ultrasound machines.

ASRock Industrial is proud to announce the launch of its highly anticipated NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series built to revolutionize AI-driven computing. Powered by Intel Core Ultra 200H processors (Arrow Lake-H), the series delivers up to 99 TOPS of AI inferencing power, offering cutting-edge performance in a compact form factor. Designed to meet the growing needs of industries such as AI-enhanced business operations, immersive content creation, and high-performance gaming, the NUC(S) Ultra 200 BOX Series is engineered to provide next-level computing power with Intel's latest performance hybrid architecture, Intel Arc GPU, and NPU.

These compact systems are built for users who demand powerful multitasking capabilities, from AI inferencing to media-rich applications and data processing. With its space-saving design and exceptional versatility, the NUC(S) Ultra 200 BOX Series ensures efficient, high-speed performance across a range of applications—redefining what's possible in modern computing.