The rumor mill turns, and Ages come and pass, leaving memories that become legend. However, some of those really do turn to reality, like recent accounts of an AMD Polaris 20 chip surfacing in the latest RX 500 series. This time, Intel is in the crosshairs, with the company's high-performance Skylake-X and Kaby Lake-X desktop components being pegged for release between June 19th and July 9th. This would place an announcement on the new chipset and CPUs debut to drop around Computex 2017, which kicks off on May 30 and runs through June 3 in Taipei.

Skylake-X and Kaby Lake-X parts are supposed to use the same LGA 2066 socket, with Skylake-X said to include anywhere between six to 10 cores, support quad-channel DDR4 memory and have a metric ton of PCIe 3.0 lanes. Kaby Lake-X parts, meanwhile, are reportedly limited to just four cores, dual-channel memory and just 16 PCIe lanes from the CPU - which gives an impression of a simple, Kaby Lake desktop CPUs being repackaged for the new socket.(And yes, inquisitive readers, that was a random reference to Robert Jordan's "The Wheel of Time" in the first line of this article.)

Intel's next-generation HEDT processor platform, based on the "Kaby Lake" micro-architecture, is the 7th generation Core i7 "Kaby Lake-X" family. The platform is based on the new LGA2066 CPU socket, and a new motherboard chipset, the Intel X299 Express. The platform builds on the strengths of the Intel HEDT (high-end desktop) market-segment, in offering double the memory bandwidth and PCIe lanes as the LGA1151 mainline desktop platform, and succeeds the current Core "Broadwell-E" family processors that run on socket LGA2011v3 motherboards, with Intel X99 Express chipsets.

The first chip on the X299 platform isn't a meaty two-figure core-count chip, but the 4-core Intel Core i7-7740K. This chip lacks an integrated graphics core. Its TDP has been increased to 112W from 91W of the i7-7700K. Someone with access to an i7-7740K sample paired it with an ASRock X299 Fatal1ty Gaming i7 motherboard, and posted SiSoft SANDRA processor arithmetic and multimedia performance scores of the chip. The chip performs close to the Ryzen 5 1600X six-core chip, but falls short of the Ryzen 7 1800X.

The two new quad-core processors Intel is fielding against AMD Ryzen, the Core i7-7740K and the Core i5-7640K, which we described in our older article, will be based on a refined (or at least relabeled) silicon, codenamed "Kaby Lake-X." The current i7-7700K and i5-7600K desktop chips are based on the same silicon as the rest of the 7th generation Core processor lineup, codenamed "Kaby Lake-S." It was also reported in the older article that the TDP of these chips will be rated at 100W. Turns out that they're rated even higher, at 112W, according to PC Games Hardware (PCGH). The top-dog AMD Ryzen R7-1800X features 95W TDP.

According to PCGH, what sets Kaby Lake-X apart from Kaby Lake-S appears to be Intel disabling the integrated graphics. You now need a graphics card to get going with these chips, and it will get trickier if you want to recover your graphics card from a bad BIOS flash. The chips also reportedly feature a high-performance thermal interface material (TIM) under the integrated heatspreaders (IHS). Compared to the i7-7700K and i5-7600K, these chips feature minor 100 MHz speed-bumps, but Intel could make them better overclockers.Update: Apparently these two chips are built in the new socket 2660 package, and will be launched around Gamescom, some time in August.

Intel's next high-end desktop (HEDT) platform to succeed the current "Broadwell-E" LGA2011v3 will be the X-series "Basin Falls" platform. This consists of the "Skylake-X" and "Kaby Lake-X" processors, and a chipset derived from Intel's upcoming 200-series. Just as Intel changed sockets for its previous three HEDT platforms (LGA1366 for "Nehalem" and "Westmere/Gulftown," LGA2011 for "Sandy Bridge-E" and "Ivy Bridge-E," and LGA2011v3 for "Haswell-E" and "Broadwell-E,") the company will launch a new socket, the LGA2066.

As with its HEDT predecessors, "Skylake-X" and "Kaby Lake-X" will be multi-core processors devoid of integrated graphics, with double the memory bus width and up to triple the PCIe lane budgets as the desktop ("Skylake-D," eg: Core i7-6700) processors. In an interesting move, Intel will launch both "Skylake-X" and "Kaby Lake-X" in quick succession, with a catch - "Skylake-X" will come in 6-core, 8-core, and 10-core variants; while the "Kaby Lake-X" will initially only be offered in quad-core. The "Kaby Lake-X" chip will further only feature a dual-channel memory bus, and the LGA2066 motherboard will have half its DDR4 DIMM slots disabled, besides a few PCIe lanes.