Thursday, November 10th 2016
Intel Readies Skylake-X As its Next High-end Desktop Platform
Intel's next high-end desktop (HEDT) platform to succeed the current "Broadwell-E" LGA2011v3 will be the X-series "Basin Falls" platform. This consists of the "Skylake-X" and "Kaby Lake-X" processors, and a chipset derived from Intel's upcoming 200-series. Just as Intel changed sockets for its previous three HEDT platforms (LGA1366 for "Nehalem" and "Westmere/Gulftown," LGA2011 for "Sandy Bridge-E" and "Ivy Bridge-E," and LGA2011v3 for "Haswell-E" and "Broadwell-E,") the company will launch a new socket, the LGA2066.
As with its HEDT predecessors, "Skylake-X" and "Kaby Lake-X" will be multi-core processors devoid of integrated graphics, with double the memory bus width and up to triple the PCIe lane budgets as the desktop ("Skylake-D," eg: Core i7-6700) processors. In an interesting move, Intel will launch both "Skylake-X" and "Kaby Lake-X" in quick succession, with a catch - "Skylake-X" will come in 6-core, 8-core, and 10-core variants; while the "Kaby Lake-X" will initially only be offered in quad-core. The "Kaby Lake-X" chip will further only feature a dual-channel memory bus, and the LGA2066 motherboard will have half its DDR4 DIMM slots disabled, besides a few PCIe lanes.The Core i7 "Skylake-X" processors, besides coming in 6-core, 8-core, and 10-core variants, could have sub-variants with fewer PCIe lanes. All chips will, however, feature quad-channel memory interfaces. Besides the DMI 3.0 (PCI-Express 3.0 x4 physical layer) chipset bus, "Skylake-X" chips will offer up to 44 PCI-Express gen 3.0 lanes. Interestingly, the chipset will have a much wider downstream PCIe lane budget than what we're used to seeing on Intel PCH chips for the past several generations - it offers a whopping 22 PCI-Express gen 3.0 downstream lanes. This could prove useful in driving bandwidth-hungry onboard devices such as Thunderbolt controllers, multiple PCI-Express SSDs, etc.
Intel plans to launch the Core i7 "Skylake-X" processors in as early as Q3-2017 (July-September 2017).
Source:
BenchLife.info
As with its HEDT predecessors, "Skylake-X" and "Kaby Lake-X" will be multi-core processors devoid of integrated graphics, with double the memory bus width and up to triple the PCIe lane budgets as the desktop ("Skylake-D," eg: Core i7-6700) processors. In an interesting move, Intel will launch both "Skylake-X" and "Kaby Lake-X" in quick succession, with a catch - "Skylake-X" will come in 6-core, 8-core, and 10-core variants; while the "Kaby Lake-X" will initially only be offered in quad-core. The "Kaby Lake-X" chip will further only feature a dual-channel memory bus, and the LGA2066 motherboard will have half its DDR4 DIMM slots disabled, besides a few PCIe lanes.The Core i7 "Skylake-X" processors, besides coming in 6-core, 8-core, and 10-core variants, could have sub-variants with fewer PCIe lanes. All chips will, however, feature quad-channel memory interfaces. Besides the DMI 3.0 (PCI-Express 3.0 x4 physical layer) chipset bus, "Skylake-X" chips will offer up to 44 PCI-Express gen 3.0 lanes. Interestingly, the chipset will have a much wider downstream PCIe lane budget than what we're used to seeing on Intel PCH chips for the past several generations - it offers a whopping 22 PCI-Express gen 3.0 downstream lanes. This could prove useful in driving bandwidth-hungry onboard devices such as Thunderbolt controllers, multiple PCI-Express SSDs, etc.
Intel plans to launch the Core i7 "Skylake-X" processors in as early as Q3-2017 (July-September 2017).
63 Comments on Intel Readies Skylake-X As its Next High-end Desktop Platform
you are trying to be AMUSING ??
The sole reason they chose 28 lanes is because people want 32 for dual gpu's
assholes
But most of these processors are E5 Xeons anyway, with targeted use cases.
If they do that, it's a new low blow. They're entitled to do so as a business but right now I am sorely crossing my fingers for Zen. Though I'm not too hopeful.