Usually for newer technology rollout, prices are significantly higher compared to the last-gen. However, with DRAM, the story is the opposite. For the first time since the launch of DDR5, buyers are paying more for DDR4 memory modules than for the newer standard. A combination of tariff uncertainty and rapidly depleting DDR4 inventories is the main driver behind this. TrendForce data show that some high-demand DDR4 kits rose by as much as 40% in just one week, while DRAMeXchange reports that the average spot price for a 16 Gb (1Gx16) DDR4 module at 3,200 MT/s from Samsung and SK Hynix climbed to $12.50, with peak offers hitting $24. By contrast, dual-8 Gb DDR5 kits running between 4,800 MT/s and 5,600 MT/s remain near $6 on average, rarely exceeding $9. This unexpected surge follows Micron's announcement that it will wind down DDR4 production by year's end, accelerating the depletion of existing stocks over the next six to nine months.

Samsung also announced plans earlier this spring to retire its DDR4 lines and shift its focus to DDR5 and high-bandwidth memory, while China's CXMT confirmed it will scale back its DDR4 output despite recently reaching peak production levels. Taiwan's Nanya Technology is among the biggest beneficiaries of this topsy-turvy market. In the first quarter, the company held a DDR4 inventory valued at approximately NT$37.6 billion ($1.2 billion). Nanya even paused public price quoting to manage sales at these elevated levels. Many in the tech industry worry that renewed US-China trade tensions could spark another wave of panic buying. If additional tariffs target China's remaining DDR4 supply, module costs could climb to more than three times the price of DDR5, extending this rare pricing inversion well into the next quarter.

China's Loongson has introduced its latest server processor family, the LS3C6000 series, its most powerful domestically designed processor. These new chips use Loongson's fourth-generation microarchitecture and pack 16 64-bit superscalar LA664 cores on each die. With simultaneous multi-threading, the single-die "S" model handles 32 logical threads, while the dual-die "D" and quad-die "Q" versions support 64 and 128 threads, respectively. Operating between 2.0 GHz and 2.2 GHz, the family delivers peak double-precision FP64 performance of 844.8 GigaFLOPS for S units, 1.612 TeraFLOPS for D units, and 3.072 TeraFLOPS for Q units. Each core benefits from 64 KB of dedicated instruction cache and 64 KB of data cache, plus a 256 KB private L2 cache, while a shared 32 MB L3 cache serves all cores on a die.

Memory bandwidth is served by four 72-bit DDR4-3200 channels in the S version and eight channels in larger SKUs, and connectivity comes via 64 PCI Express lanes for S models and 128 lanes for D and Q models, alongside SPI, UART, I²C and GPIO ports. Security is addressed through an integrated SE module with a secondary LA264 core that accelerates SM2, SM3, and SM4 cryptographic functions. Loongson relies on its proprietary Coherent Link interconnect, which uses PCI Express-style links and board-level direct paths to scale up to 256 logical cores in multi-socket systems. Power consumption ranges from 100 to 120 W for S parts, 180 to 200 W for D parts, and 250 to 300 W for Q parts. Loongson suggests that its 16-core S model competes with Intel's (now old) third-generation Xeon Scalable processors, while its 64-core Q model is roughly comparable to the Xeon Platinum 8380 with 40 cores and 80 threads.

Micron has informed its customers that its DDR4 memory products will reach the end of life in the coming quarters, with shipments expected to taper off over the next six to nine months. This announcement aligns Micron with the earlier plans of Samsung and SK Hynix to discontinue DDR4 production and focus on next-generation memory solutions, such as DDR5, LPDDR5, and high-bandwidth memory. In a recent interview, Micron's Executive Vice President and Chief Business Officer, Sumit Sadana, acknowledged that the phase‑out comes at a time when demand for DDR4 remains unexpectedly strong. He noted that shortages of both DDR4 and LPDDR4 modules have driven spot-market prices to levels that, in some cases, exceed those of newer DDR5 products.

To address this imbalance, Micron will prioritize supply for long‑term partners in the automotive, industrial, and networking sectors, where product reliability and contract stability are critical. The retirement of DDR4 has been partly driven by competitive pressure from Chinese memory manufacturers, which have flooded the market with lower‑cost modules. Yet, these newcomers may face challenges in matching the quality, long-term support, and volume capabilities that established players provide. Micron is urging its customer base to transition to DDR5 and LPDDR5 products, which have reached competitive price points and offer superior bandwidth and energy efficiency.

ASRock Industrial proudly announces its next generation industrial motherboards powered by Intel Core 200S series processors (Bartlett Lake-S), supporting up to 24 cores and 32 threads. The new series delivers improved single-thread, multi-thread and AI-performance, along with DDR5 5600 MHz memory support up to 192 GB, advanced I/O capabilities, PCIe Gen 5/4 expandability, 4K quad-display powered by Intel UHD Graphics 770 with Xe architecture. With BIOS-level update support, the new series enables customers to seamlessly upgrade existing 14th, 13th, and 12th Gen Intel CPU-based motherboards to the latest generation. Available in Mini-ITX, microATX, and ATX form factors with longevity support, the motherboards are built for intelligent edge applications across smart manufacturing, autonomous robotics, machine vision, retail, kiosks, digital signage, gaming, and security environments.

Intel Core 200S Processor Motherboards with DDR5 Support
ASRock industrial's Intel Core 200S DDR5 supported motherboards are available in Mini-ITX, microATX, and ATX form factors, built on Intel W680, Q670, and H610 chipsets to meet a broad range of industrial computing demands.

TrendForce's latest investigations find that DDR4 contract prices for servers and PCs are expected to rise more sharply in the second quarter of 2025 due to two key factors: major DRAM suppliers scaling back DDR4 production and buyers accelerating procurement ahead of U.S. tariff changes. As a result, server DDR4 contract prices are forecast to rise by 18-23% QoQ, while PC DDR4 prices are projected to increase by 13-18%—both surpassing earlier estimates.

TrendForce notes that DDR4 has been in the market for over a decade, and demand is increasingly shifting toward DDR5. Given the significantly higher profit margins for HBM, DDR5, and LPDDR5(X), suppliers have laid out EOL plans for DDR4, with final shipments expected by early 2026. Current EOL notifications largely target server and PC clients, while consumer DRAM (mainly DDR4) remains in production due to continued mainstream demand.

TrendForce's latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes. Samsung's redesign of its HBM3e products eased the HBM production squeezes. This prompted downstream players to clear inventories and extended the price declines seen since 4Q24.

Looking ahead to 2Q25, as PC OEMs and smartphone makers complete inventory corrections and ramp up system production ahead of the 90-day U.S. reciprocal tariff grace period, bit procurement momentum is expected to strengthen significantly. This will drive notable increases in supplier shipment volumes. On the pricing side, TrendForce forecasts a rebound across major application contract prices, with both conventional DRAM and combined DRAM (including HBM) contract prices expected to rise.

The rising profile of ChangXin Memory Technologies (CXMT) has supposedly attracted international scrutiny as-of-late. Despite dealing in commercial memory product lines—currently DDR5, DDR4, LPDDR5 and LPDDR4X—the Chinese manufacturer could be stepping up its game in the near future. According to a fresh DigiTimes Asia news report, the nation's "top DRAM supplier" could be freeing up production capacity—in favor of enterprise-grade third-gen High-Bandwidth Memory (HBM3). Industry moles believe that a major sacrifice will be made; namely CXMT's DDR4 line. Despite an alleged early 2025 ramping up of related activities, the firm's factories could refocus on new endeavors by mid-2026. Additionally, insiders reckon that company leadership is shifting commercial priorities: "by year-end 2025, DDR5 is expected to make up more than 60% of CXMT's output, alongside LPDDR4/5."

The move into more advanced memory technologies is reportedly the result of government instruction. DigiTimes outlined a new strategy: "as CXMT scales up, it's also shifting rapidly to DDR5. The company only began mass-producing DDR4 in late 2024, yet it's already expected to issue an end-of-life (EOL) notice by the third quarter of 2025. The speed of this pivot and retooling has surprised many across the industry. Industry sources say the sudden shift is policy-driven, as Beijing pushes key chipmakers to accelerate alignment with national goals, especially around AI and cloud infrastructure." Murmurs of CXMT's forthcoming exit from DDR4 production have spread across local chip making businesses; causing a sudden doubling of Nanya-branded 8 Gb DDR4 chip prices in China. The manufacturer's early journey into DDR5 territories looked promising on paper—around January 2025—but the latest DigiTimes report disclosed inside track info regarding troubled quality and yield issues. In particular, initial samples have reportedly exhibited unstable performance when crossing a 60°C (140°F) threshold.

Although Synology already announced its first plus series NAS in its 2025 range a month ago with the DS925+ and its accompanying expansion unit, the company had no less than six new devices on display at Computex. We also talked at length with the company and got an explanation as to why the company decided to move to supporting its own brand drives only and it turns out the situation isn't quite what Synology's press release made it seem like, but more on that after we go over the new devices.

The new range starts with the DS225+ and the DS425+, where the DS225+ is the new base model of the plus series. Both models are built around an Intel Celeron J4125—a chip that launched at the end of 2019—which is paired with 2 GB of DDR4 which can be expanded to 6 GB in total. Both models come with one 2.5 Gbps and one 1 Gbps Ethernet port, two 5 Gbps USB 3.2 Gen 1 ports and two or four drive bays. The DS425+ also gets a pair of M.2 2280 NVMe SSD slots, but unless the CPU information provided is wrong, these will only be PCIe 2.0 and will most likely not sport more than one or two lanes.

According to a Financial Times (FT) news article, the US Government's Bureau of Industry and Security (BIS) is considering an implementation of additional "export blacklist" entries. Roughly two months ago, a significant update affected the export trade of around eighty Chinese business "entities." Despite a recent "cooling off" of elevated tariff-related activities, significant political tensions still exist between the two powerhouse nations. According to five of FT's unnamed insiders, ChangXin Memory Technologies (CXMT)—a rising star within China's growing memory manufacturing industry—is a potential candidate for "banishment." Semiconductor Manufacturing International Corp (SMIC), and Yangtze Memory Technologies Co. are (allegedly) already categorized as blacklisted organizations.

Apparently, the nation's most prominent chipmaker and memory module producer (respectively) have managed to sidestep certain restrictions, via offshoot avenues. FT believes that the US administration is actively investigating several of these subsidiaries. CXMT seems to be an independent body, with no military connections—specializing in commercial DDR5 and DDR4 products—but its rising profile has attracted international attention. Around March 2024, Bloomberg heard rumors about the US BIS department's "weighing up" of sanctions, with CXMT in mind. The relatively young DRAM manufacturer (established back in 2016) still trails behind South Korean and Western competitors, in terms of technological advancements—but its initial DDR5 efforts have (supposedly) impressed local evaluators and early adopters.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced the successful interoperability of the Marvell Structera portfolio of Compute Express Link (CXL) with AMD EPYC CPUs and 5th Gen Intel Xeon platforms. This achievement underscores the commitment of Marvell to advancing an open and interoperable CXL ecosystem, addressing the growing demands for memory bandwidth and capacity in next-generation cloud data centers.

Marvell collaborated with AMD and Intel to extensively test Structera CXL products with AMD EPYC and 5th Gen Intel Xeon Scalable platforms across various configurations, workloads, and operating conditions. The results demonstrated seamless interoperability, delivering stability, scalability, and high-performance memory expansion that cloud data center providers need for mass deployment.

CHUWI, a global leader in innovative laptops, takes the CoreBook X lineup to the next level. CHUWI introduces a high-performance Intel Core i9 processor, expanded RAM, and enhanced storage, making it a powerhouse for productivity. This marks CHUWI's first-ever i9 laptop, 32 GB memory laptop, and 1 TB storage laptop—all combined into one ultimate powerhouse. While boosting its capabilities, the CoreBook X i9-13900HK laptop retains its sleek design and stunning 2K IPS display. The CHUWI CoreBook X with Intel Core i9-13900HK is now available on CHUWI's official website.

Power-Packed Performance:
Powering the new and updated CHUWI CoreBook X 2K laptop is the powerful Intel Core i9-13900HK processor with 14 cores, 20 threads, and clock speeds of up to 5.4 GHz, stepping up performance to a whole new level. Paired with the integrated Intel Iris Xe Graphics eligible laptop GPU, it offers sharp visuals for gaming, streaming, and content creation.

Earlier today, industry moles in South Korea have heard whispers about Samsung Electronics planning a new pricing strategy for NAND and DRAM product lines. According to an MK news articles, local sources believe that company leadership will: "raise memory chip prices—by 3-5% from the current level—for major global customers. It is reported that some customers have already begun contract negotiations that reflect the increase conditions." Regional watchdogs posit that the megacorporation is reacting to very current geopolitical tensions (i.e. tariffs). Earlier this week, a main rival—Micron—informed customers about forthcoming memory price increases. Naturally, the North American memory chip giant is not "fully" affected by recent seismic shifts. A "significant growth demand" has caused jacked up charges—effective across DRAM, NAND flash, and HBM portfolios—projected throughout 2025 and 2026.

Returning to South Korean shores and Samsung, one unnamed semiconductor insider opined to MK: "oversupply continued throughout last year, but supply has recently decreased as major companies have begun to reduce production...In addition, artificial intelligence (AI) devices are appearing one after another in China, and demand for semiconductors is gradually increasing due to industrial automation." DRAMeXchange—an appropriately named market research organization—has kept track relevant trends. As disclosed by the MK news piece—as of last month, general-purpose DRAM DDR4 prices: "remained flat for the fourth month in a row." Looking at conditions for DDR5 (used in high-performance PCs and enterprise equipment), prices soared by 12%. DRAMeXchange observed NAND costs rising by 9.6%: "continuing an upward trend for the third consecutive month."

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, introduces the COLORFUL X15 XS - a budget-friendly yet powerful gaming laptop designed for gamers and creators seeking performance and value. Building from the success of the X15 XS series gaming laptops, the latest model features a cleaner and simpler design and new packaging.

Powered by up to a 12th Gen Intel Core i5-12500H processor and an NVIDIA RTX 3050 laptop GPU, the COLORFUL X15 XS delivers the speed and efficiency needed to tackle a wide range of tasks. Whether you're working on demanding projects, studying for exams, or diving into immersive gaming sessions, the X15 XS ensures smooth multitasking, responsive performance, and stunning graphics. With advanced cooling and a high-refresh-rate display, the X15 XS is built to keep up with your productivity and entertainment needs without compromise.

TrendForce's latest research reveals that global DRAM industry revenue surpassed US$28 billion in 4Q24, marking a 9.9% QoQ increase. This growth was primarily driven by rising contract prices for server DDR5 and concentrated shipments of HBM, leading to continued revenue expansion for the top three DRAM suppliers.

Most contract prices across applications were seen to have reversed downward. However, increased procurement of high-capacity server DDR5 by major American CSPs helped sustain price momentum for server DRAM.

Inside sources—familiar with goings-ons at leading DRAM manufacturing firms—have predicted the end of DDR3 and DDR4 production lines. According to a DigiTimes Asia report (citing Nikkei), industry observers have noticed that the DRAM market is undergoing a so-called "shift." They believe that pricing trends are decreasing due to weak demand. Samsung Electronics, SK Hynix, and Micron are named as major players; allegedly involved in devising new strategies—in reaction to fluid market circumstances. The DigiTimes insider network proposes that the big three: "may phase out DDR3 and DDR4 by 2025...by the end of 2025...anticipating a future focused on advanced memory technologies." Older standards are falling out of favor, with DDR5 and high-bandwidth memory (HBM) on the ascent. Industry watchdogs reckon that possible DDR3 and DDR4 supply shortages could occur "post-summer 2025."

Taiwan's Nanya Technology has predicted that the overall DRAM market will "bottom out" within the first half of 2025. An eventual recovery is envisioned by the second quarter; AI-related demands could help drive up demand by a large margin. Additionally, Nanya points to improved inventory management and global economic stimulus. Taiwanese DRAM production houses are expected to pick up some slack, but an unnamed "key component distributor" anticipates serious after-effects. An anonymous source believes that the: "anticipated halt in production could lead to significant supply constraints, challenging market dynamics and impacting pricing strategies." Nanya Technology and Winbond Electronics produce specialized DRAM-types; therefore are not touted to be great gap fillers. The latter is reportedly reacting to weak demand for "mature" DDR products—DigiTimes commented on this development: "Winbond Electronics is advancing its manufacturing by transitioning to a 16 nm process in the latter half of 2025. This upgrade from the current 20 nm process, primarily used for 4 Gb DDR3 and DDR4, will enable Winbond to produce 8 Gb DDR memory."

Synology at the 2025 International CES showcased updates to its popular consumer network storage products, beginning with one for its popular BeeStorage line of flash-based personal cloud devices. The new BeeStation Plus comes with 8 TB of flash-based storage—double that of the original BeeStation from 2023—and updated system hardware that includes an Intel Celeron J4125 processor with 4 GB of DDR4 memory, USB 3.2 Gen 2 type-A and type-C ports; and an updated software frontend, including the BeeProtect software that makes snapshots and other forms of backups of your machine. The device continues to lack Wi-Fi, and relies on wired Ethernet to connect to the network.

Next up, the company showed off a couple of its entry-level desktop NAS solutions under the DiskStation brand, the DS224+ (2-bay), and the DS423+ (4-bay). Both feature SATA 6 Gbps drive bays, and you can expand storage using any USB mass-storage device that plugs into its 5 Gbps USB 3.2 port. The DS224+ comes with two 1 GbE interfaces. Under the hood are a Celeron J4125 processor backed by 6 GB of DDR4 memory. The DS423+ can hold up to 72 TB of storage, and besides the four SATA 6 Gbps bays, has two M.2-2280 slots with Gen 3 wiring. The NAS can access any of its drives at up to 226 MB/s reads, with up to 224 MB/s writes. Networking interfaces include a pair of 1 GbE. Lastly, the company showcased a series of "direct-to-cloud" WLAN and PoE surveillance cameras under the C2 Camera series.

TrendForce's latest investigations reveal that the DRAM market is expected to face downward pricing pressure in 1Q25 as seasonal weakness aligns with sluggish consumer demand for products like smartphones. Additionally, early stockpiling by notebook manufacturers—over potential import tariffs under the Trump administration—has further exacerbated the pricing decline.

Conventional DRAM prices are projected to drop by 8% to 13%. However, if HBM products are included, the anticipated price decline will range from 0% to 5%.

According to a recent Citigroup analysis, CXMT, China's domestic memory chipmaker, is demonstrating significant progress in its DDR5 production yields. The company's DDR5 yield rates had reached approximately 80%, marking a substantial improvement from its initial 50% yields when production began. This progress builds on CXMT's experience with DDR4 manufacturing, where the company has achieved yields of around 90%. The company currently operates two fab facilities in Hefei, with Fab 1 dedicated to DDR4 production on 19 nm process technology and a 100,000 wafer per month capacity. Fab 2 focuses on DDR5 production using 17 nm technology, with a current capacity of 50,000 wafers per month. CXMT's DDR5 yields could improve further to approximately 90% by the end of 2025.

Despite these improvements, CXMT faces technological challenges compared to industry leaders. The company's current production process is 19 nm for DDR4 and 17 nm for DDR5, lagging behind competitors like Samsung and SK Hynix, which manufacture 12 nm DDR5 chips. This technology gap results in higher power consumption and less favorable form factors for CXMT's products. The company primarily targets domestic Chinese smartphone and computing OEM customers. Looking ahead, CXMT plans to expand its DDR5 and HBM capabilities, with a potential additional capacity of 50,000 wafers per month at Fab 2 in 2025, if market conditions prove favorable. The company is also making progress on HBM2 development, with customer sampling underway and low-volume production expected to begin in mid-2025.

An SSD from Chinese manufacturer Zhitai has demonstrated impressive performance metrics, reaching sequential read speeds of up to 14.5 GB/s. Under the hood, the TiPro9000 2 TB SSD combines domestic YMTC 5th Generation 3D TLC NAND technology with Silicon Motion's SM2508 controller. The drive's architecture features a 2 GB LPDDR4X DRAM chip and two 3D TLC NAND dies utilizing 232-layer YMTC's Xtacking 4.0 architecture. While initial testing revealed peak sequential read and write speeds of 14,527 MB/s and 13,869 MB/s respectively, these rates are sustained through the SLC cache for approximately 24 seconds. Performance testing showed distinct operational phases. After the initial burst speed period, transfer rates stabilize at around 4,000 MB/s for 325 seconds before dropping to 1,700-1,800 MB/s. The drive then demonstrates recovery capabilities, returning to 4,000 MB/s after 259 seconds.

Random performance specifications are equally impressive, with the manufacturer claiming up to 2 million IOPS for reads and 1.6 million IOPS for writes. The TiPro9000's performance metrics position it competitively among top-tier PCIe 5.0 x4 drives. This shows the capabilities of Chinese-manufactured YMTC NAND memory technology paired with Silicon Motion's controller expertise, putting a lot of faith in China-made NAND Flash. With growing needs for AI and big data applications, performant storage systems are becoming key to many systems. However, Chinese companies still need a solid (pun intended) controller to compete with Western technology to complete storage manufacturing. Alibaba is working on a RISC-V-based controller, while InnoGrit has also been sampling controllers. We have yet to see commercial applications based on these two.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, introduces the Storming V 16 GB / 8 GB DDR4 memory ideal for budget-friendly, casual home entertainment systems.

The Storming V DDR4 memory is an excellent choice for modern home entertainment systems, combining outstanding performance with affordability. Designed for casual entertainment and gaming, it delivers exceptional speed and stability, handling popular mid-range titles effortlessly to provide smooth gameplay and rapid data transfer rates. With a strong emphasis on practicality and performance, the Storming V DDR4 is the smart choice to elevate your everyday computing and entertainment experience.

Netlist, Inc. today announced that it won a $118 million damages award against Samsung Electronics Co., LTD., Samsung Electronics America, Inc., and Samsung Semiconductor, Inc. (together "Samsung") in the United States District Court for the Eastern District of Texas. The award resulted from a jury trial which involved three Netlist patents: U.S. Patent Nos. 7,619,912, 11,093,417 and 10,268,608. The infringing products were all Samsung DDR4 RDIMMs and DDR4 LRDIMMs. Netlist filed the complaint against Samsung in August 2022.

The federal jury's unanimous verdict confirmed that all three Netlist patents had been infringed by Samsung, that none of the patents were invalid, that Samsung willfully infringed those patents, and that money damages were owed to Netlist for the infringement of all three patents.

TrendForce's latest investigations reveal that the global DRAM industry revenue reached US$26.02 billion in 3Q24, marking a 13.6% QoQ increase. The rise was driven by growing demand for DDR5 and HBM in data centers, despite a decline in LPDDR4 and DDR4 shipments due to inventory reduction by Chinese smartphone brands and capacity expansion by Chinese DRAM suppliers. ASPs continued their upward trend from the previous quarter, with contract prices rising by 8% to 13%, further supported by HBM's displacement of conventional DRAM production.

Looking ahead to 4Q24, TrendForce projects a QoQ increase in overall DRAM bit shipments. However, the capacity constraints caused by HBM production are expected to have a weaker-than-anticipated impact on pricing. Additionally, capacity expansions by Chinese suppliers may prompt PC OEMs and smartphone brands to aggressively deplete inventory to secure lower-priced DRAM products. As a result, contract prices for conventional DRAM and blended prices for conventional DRAM and HBM are expected to decline.

GEEKOM, a Taiwanese tech company also known as the Green Mini PC Global Leader, just released its first model powered by an Intel Alder Lake-N series SoC. The GEEKOM Mini Air12 Lite is a tiny desktop PC with an Intel N100 quad-core processor, DDR4-3200 RAM, a PCIe Gen 3 SSD, and support for dual displays. The mini PC is now available on Amazon and GEEKOM's official website.

The Mini Air12 Lite measures 135.5 x 115.5 x 34.5 mm (0.5L) and weighs about 1 kilogram. It features a single SO-DIMM slot which supports up to 16 GB of DDR4-3200 MHz memory, and an M.2 2280 slot that can accommodate a PCIe 3.0 or SATA SSD of up to 1 TB. The mini PC runs on a licensed copy of Windows 11 Pro out of the box.

AMD Ryzen 7 5800X3D has hit end-of-life, according to a ComputerBase.de report. Introducing the new 3D V-cache technology, the 5800X3D breathed life back into the Socket AM4 platform as Intel debuted its 12th Gen Core "Alder Lake" processors, while there was still some time to go before AMD could mount up a defense with Ryzen 7000 "Zen 4." AMD figured out a way to augment the 32 MB on-die L3 cache with an additional 64 MB stacked cache that appears as a contiguous 96 MB addressable block to software. Having such a large fast cache next to the CPU cores greatly enhances performance in gaming workloads.

The 5800X3D was able to match the gaming performance of Intel's flagship Core i9-12900K despite being based on the generationally older "Zen 3" microarchitecture, and being restricted with older DDR4 memory. It would go on to be an incredible upgrade option for those still on the Socket AM4 platform, giving them performance in league with Intel's 12th- and 13th Gen processors. As of this writing, US retailer Newegg no longer has the 5800X3D in stock. Amazon has it, and so do some of the smaller retailers. Across the pond, the chip is vanishing from European retailers. In the absence of the 5800X3D, users still have the option of the Ryzen 7 5700X3D and the 6-core 5600X3D, which were both launched in the last year.