Friday, December 27th 2024
CXMT Achieves 80% Yield for DDR5 Chips, HBM2 Production and Capacity Expansion Underway
According to a recent Citigroup analysis, CXMT, China's domestic memory chipmaker, is demonstrating significant progress in its DDR5 production yields. The company's DDR5 yield rates had reached approximately 80%, marking a substantial improvement from its initial 50% yields when production began. This progress builds on CXMT's experience with DDR4 manufacturing, where the company has achieved yields of around 90%. The company currently operates two fab facilities in Hefei, with Fab 1 dedicated to DDR4 production on 19 nm process technology and a 100,000 wafer per month capacity. Fab 2 focuses on DDR5 production using 17 nm technology, with a current capacity of 50,000 wafers per month. CXMT's DDR5 yields could improve further to approximately 90% by the end of 2025.
Despite these improvements, CXMT faces technological challenges compared to industry leaders. The company's current production process is 19 nm for DDR4 and 17 nm for DDR5, lagging behind competitors like Samsung and SK Hynix, which manufacture 12 nm DDR5 chips. This technology gap results in higher power consumption and less favorable form factors for CXMT's products. The company primarily targets domestic Chinese smartphone and computing OEM customers. Looking ahead, CXMT plans to expand its DDR5 and HBM capabilities, with a potential additional capacity of 50,000 wafers per month at Fab 2 in 2025, if market conditions prove favorable. The company is also making progress on HBM2 development, with customer sampling underway and low-volume production expected to begin in mid-2025.
Source:
@Jukanlosreve on X
Despite these improvements, CXMT faces technological challenges compared to industry leaders. The company's current production process is 19 nm for DDR4 and 17 nm for DDR5, lagging behind competitors like Samsung and SK Hynix, which manufacture 12 nm DDR5 chips. This technology gap results in higher power consumption and less favorable form factors for CXMT's products. The company primarily targets domestic Chinese smartphone and computing OEM customers. Looking ahead, CXMT plans to expand its DDR5 and HBM capabilities, with a potential additional capacity of 50,000 wafers per month at Fab 2 in 2025, if market conditions prove favorable. The company is also making progress on HBM2 development, with customer sampling underway and low-volume production expected to begin in mid-2025.
17 Comments on CXMT Achieves 80% Yield for DDR5 Chips, HBM2 Production and Capacity Expansion Underway
Well, give me please some very tight DDR5-8000 OR 9000 32GB kits, and is all good.
Being lagged behind the competition means less profit.
Less profit means less room for price cuts.
i wish there was a Chinese manufacturer of spinning rust storage
hey don’t even need to compete with the top end to make a significant difference there
The board is set... they're re-living Polaris as we speak. Its almost like fashion, same trends keep passing us by it seems lol
to me that makes it sound like it’s very much optimised for density
The same story happened when the Chinese makers entered the SSD market.
They did enter the market, yes.
But it didn't came to significant price cuts.
Their main selling point isn't "cheap" but "made in China" to aim for "products complied with the Chinese national security law".
They marked up the prices, not lowering them.
AND the consumer side.
Consumer grade Chinese made SSD chips remained in the lower tier bin and did not disrupt the market much.
I would imagine DDR chip market in China should behave the same.
were in a global economic depression again, hopefully things Start moving when reason sets in.