Acer today announced the expansion of its mainstream Nitro gaming line with the launch of the new Acer Nitro AI laptops and the Nitro 20 desktop. The Nitro range brings a full-package gaming experience and great value for gamers and content creators, combining robust processing power, essential computing features, and more without breaking the bank. The addition of slim laptops and a compact Windows PC option also support users with limited space for their gaming set-ups.

The Nitro AI laptops are Copilot+ PCs, powered by AMD Ryzen AI 300 Series processors and equipped with the game-changing NVIDIA GeForce RTX 50 Series Laptop GPUs to make more powerful AI rendering capabilities more accessible. The Nitro 20 desktop also utilizes AI processors and up to an NVIDIA GeForce RTX 5060 GPU, focusing on better energy efficiency with a smaller footprint.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory, is thrilled to announce that renowned overclocker, Seby, has broken the overclocking world record for DDR5 memory frequency speed at a blistering DDR5-12772. This incredible frequency record was achieved with G.SKILL Trident Z5 DDR5 memory, built with high-performance SK hynix DDR5 ICs, running on the ASUS ROG Maximus Z890 Apex motherboard and Intel Core Ultra 9 285K desktop processor under extreme liquid nitrogen (LN2) cooling.

Reaching a New Height of DDR5 Memory Overclock Speed
This new milestone follows a long-standing legacy of record-breaking performance of G.SKILL Trident Z5 DDR5 memory, achieved by a single module from the F5-8000J3848F24GX2-TZ5K model, and highlights the exceptional overclocking capability of both the ASUS ROG Maximus Z890 APEX motherboard and the Intel Core Ultra 9 285K desktop processor. The overclock record has been submitted to and validated by HWBOT and CPU-Z; refer to the following links and screenshot to see the record submission:

The long-promised gaming performance uplift for "Arrow Lake" processors is here, but for now, it is only available in China. Called Intel Performance Optimizations (IPO), this feature aims at system integrators rather than end users and offers a balanced approach between stock settings and full manual overclocking, all while preserving warranty coverage. IPO works by applying optimized profiles that adjust a range of CPU and memory parameters. On the CPU side, it fine‑tunes P‑core and E‑core frequencies, ring‑bus speeds, the UPI interconnect, D2D links between tiles, and both PL1 and PL2 power limits. For RAM, IPO raises transfer rates and tightens timings, pushing modules beyond their factory XMP or EXPO profiles. Early results from Chinese OEM Maxsun show that IPO can boost core clocks by about 200 MHz and elevate DDR5‑8000 kits to DDR5‑8400. In gaming tests provided by Maxsun, this translated to roughly a 10 percent uplift in frame rates, an encouraging figure given Arrow Lake's mild launch performance in gaming.

At debut, some Arrow Lake SKUs trailed their "Raptor Lake" predecessors because the chiplet‑based memory controller introduced extra latency and ring‑bus clocks ran slower. Supply‑chain constraints and tariffs have limited IPO's rollout to China so far, where pre‑built systems from vendors like Maxsun are shipping with the feature enabled. Warranty handling stays with the OEM, so users can enjoy the extra headroom without risking hardware support. Behind the scenes, Intel has been issuing firmware and microcode patches since December, most recently microcode 0x114 paired with CSME firmware 19.0.0.1854v2.2, to improve Arrow Lake's efficiency. IPO represents the next step in that effort and could become a model for global "opt‑in" BIOS presets if the pilot proves successful. For now, China is serving as the testing ground for Intel's latest attempt to squeeze more performance out of Arrow Lake. We have to wait and see if Western markets follow soon.

Team Group Inc. today announced the launch of its latest gaming memory modules, the T-FORCE XTREEM CKD ARGB DDR5 and T-FORCE DELTA CKD RGB DDR5, featuring cutting-edge technology and innovative design. With an upgraded Client Clock Driver (CKD) technology, these modules break performance limits to reach an impressive 8400 MHz overclocking frequency to maximize performance and stability. CKD DDR5 memory modules are fully compatible with Intel Core Ultra and Intel 800 series platforms, ensuring system stability during high-load operations. The latest generation of memory technology provides a seamless user experience and offers gamers and enthusiasts a new level of overclocking performance.

The T-FORCE XTREEM CKD ARGB DDR5 features a 2 mm premium aluminium alloy heat sink, crafted through aluminium extrusion, CNC machining, and a sandblasted black finish. This aesthetic is characterized by a basalt-like strength and durability, complemented by a smooth texture reminiscent of fine black sand. Its innovative two-piece light pipe with translucent multilayered optical design produces an aurora-like ARGB lighting effect, perfectly creating an immersive and visually stunning ambiance for gamers. In contrast, the T-FORCE DELTA CKD RGB DDR5 draws inspiration from stealth fighter jets, featuring an ultra-wide 120° angle RGB lighting design paired with sleek geometric contours, delivering a bold, eye-catching look to elevate gaming setup with unparalleled performance. Both memory modules allow gamers to customize and enhance their PC builds with stunning aesthetics. They also support Intel XMP 3.0 one-click overclocking technology, enabling users to unlock peak performance without complex configurations.

ASUS has launched its B850M AYW GAMING WiFi motherboard worldwide giving users a small but mighty option for AMD Ryzen desktop systems. This board comes in a narrow microATX form factor measuring 24.4 cm x 22.1 cm. It sports a six-layer black PCB and silver-white heatsinks keeping a tidy look while sticking to the ASUS AYW series style. The board uses an 8+2+1 phase setup with discrete MOSFETs and has one 8-pin EPS CPU power plug. For a compact board, it offers plenty of storage choices. You'll find one PCIe 5.0 M.2 slot that can handle speeds up to 128 Gbps and another PCIe 4.0 M.2 slot with speeds up to 64 Gbps. To add extra cards, the motherboard provides one PCIe 5.0 x16 slot running at full speed plus one PCIe 4.0 x16 slot that works at x8/x4 speed.

The B850M AYW GAMING WiFi has two DIMM slots for DDR5 memory in a dual-channel setup with AEMP support (up to 8400+ MS/s OC). It comes with Wi-Fi 6 wireless networking, 2.5 Gigabit Ethernet, various USB ports, including Type-C, and Realtek 7.1 channel audio CODEC. You'll find a pre-mounted shield on the rear I/O panel. This panel includes one HDMI 2.1 port, several USB ports at different speeds (10 Gbps, 5 Gbps, and 480 Mbps), one 2.5 GbE RJ45 network port, two Wi-Fi antenna connections, and three audio jacks. For those looking to customize, the board offers three Addressable RGB Gen 2 headers. Exact pricing is yet to be revealed.

Framework Laptop 12 pre-orders are now open, with first shipments in June! We're pricing Framework Laptop 12 as low as we can to bring the Framework mission to as many people as possible. DIY Edition starts at €569/£499/$719 CAD and is available in five colorways: Black, Gray, Lavender, Bubblegum, and Sage. If you prefer not to assemble your laptop, we also have pre-built options in Black in some keyboard languages, starting at €849/£749/$1,079 CAD. Pre-orders are open today in all countries we ship to, with the temporary exception of the US. We shared a blog post earlier today detailing how we're handling the impact of tariffs for US customers.

Framework Laptop 12 is a 12.2", 13th Gen Intel Core-powered notebook that is designed to last. We have robust compatibility with both Linux and Windows 11, i3 and i5 Intel Core processor options, support for up to 48 GB of DDR5 and 2 TB of storage, Wi-Fi 6E, an excellent full-size keyboard, a 50Wh battery, a bright 1920x1200 touchscreen, a 1080p webcam, and USB 3.2, DisplayPort, and power input on all four Expansion Card slots. You can check out the full specs on our website. Even though this product is small and fun, it's also a real computer!

Colorful recently teased its new CVN motherboards series based on the AMD X870 chipset, and now the first model, CVN X870 ARK FROZEN V14, has been listed on the Colorful website. This motherboard marks the debut of Colorful's first-generation graphics card quick-release mechanism, featuring an "ON or OFF" switch placed just below the memory slots. Colorful advertises this proprietary design as being "really safe". The CVN X870 ARK FROZEN V14 motherboard features a standard ATX form factor with a striking white PCB and frost-themed heat dissipation armor. It boasts a 14+2+1 phase power supply design with 80 A DrMOS components and dual 8-pin EPS connectors for CPU power. In terms of memory, it has four DDR5 memory slots supporting up to 192 GB (single slot up to 48 GB) and allows up to 8000 MHz overclocked memory modules.

The PCIe configuration includes a PCIe 5.0 x16 slot directly connected to the CPU with metal reinforcement and quick-release support, a full-length PCIe 4.0 x4 slot (which shares lanes with the third M.2 slot), and a PCIe 4.0 x1 slot. For storage, users get two PCIe 5.0 x4 M.2 slots directly connected to the CPU and one PCIe 4.0 x4 M.2 slot via the chipset, which is mutually exclusive with the second PCIe slot. Additionally, the board includes four SATA III 6 Gbps ports. Networking options include a Realtek RTL8126-CG chip offering 5GbE wired connectivity and a MediaTek MT7925 module supporting Wi-Fi 7 and Bluetooth 5.4. The Realtek ALC1220 CODEC powers audio. The rear I/O provides HDMI 2.0, DisplayPort 1.2, multiple USB-A ports, a USB-C port with 40 Gbps bandwidth and DP Alt Mode support, a 5GbE RJ45 port, dual Wi-Fi antenna connectors, an S/PDIF out, and five standard audio jacks. According to ITHome, Colorful previously announced that the CVN X870 ARK FROZEN V14 will begin shipping around mid-April, pricing is yet to be revealed.

ASUS today announced its participation in the NAB Show 2025. Visitors to the ASUS booth will have the opportunity to experience the future of content creation with live demonstrations of the latest ASUS ProArt offerings. The showcase includes the debut of the ProArt Cinema PQ09 monitor, featuring the largest-ever ASUS microLED display. The ProArt Display 6K PA32QCV and the ProArt CaliContrO MCA02 three-in-one calibrator will also be showcased. Also on show will be the 16-inch ProArt P16, a creative powerhouse laptop equipped with a 50 TOPS NPU, AMD Ryzen AI 9 HX 370 processor, and up to an NVIDIA GeForce RTX 5070 Laptop GPU. In addition, the NAB Show 2025 will feature the latest installment of the ProArt Masters' Talks series, with renowned creatives sharing their perspectives on current trends.

The ProArt Cinema PQ09 is the latest addition to the ProArt Cinema microLED display lineup. This 162-inch 4K HDR monitor features advanced panel technologies, ultrasmall 0.93 mm pixel pitch, 1200nits peak brightness, high 1,000,000:1 contrast ratio, and 97% DCI-P3 color gamut. Compared to conventional microLED displays with a 1.2 or 1.5 mm pixel pitch, ProArt Cinema PQ09 delivers smoother and more vibrant visuals, making it the perfect large-screen display for home cinema, broadcasting or other uses.

Following the successful launch of our AMD-powered AI-PC NA10H7, Shuttle is proud to announce the release of two new additions to our compact XPC nano family: NT10H5 and NT10H9. Designed in the same ultra-compact 1-liter chassis, both newcomers offer powerful AI-acceleration and multitasking capabilities - now based on Intel's cutting-edge Core Ultra processors.

Compact Yet Powerful: The New NT10H Series
The NT10H5 and NT10H9 mini-PCs carry the same DNA as the NA10H7, delivering high-performance computing in a nano-sized footprint (132 x 143 x 55 mm). They are equipped with Intel Core Ultra 5-125H and Intel Core Ultra 9-185H processors respectively, featuring integrated Intel Arc graphics and the dedicated Intel AI Boost NPU. These systems reach up to 34 TOPS of AI performance, making them ideal for machine learning, content creation, and real-time data processing in modern business or creative environments.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce a new high-speed memory overclock DDR5 specification with an ultra-high kit capacity - DDR5-8000 CL44 with 128 GB (64 GB x2) kit capacity. This is the world's first DDR5 memory kit with 64 GB high-capacity modules to reach the extreme overclock level of DDR5-8000, setting a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

New Era of Overclocking High-Capacity DDR5 64 GB Modules
Engineered for high-capacity overclocked performance, the DDR5-8000 128 GB (64 GB x2) combines ultra-high memory speed with massive memory kit capacity, surpassing the previous module capacity maximum at 48 GB per module. At last, power users and content creators who seek overclock performance memory for capacity-hungry applications will have the ideal DDR5 memory solution. Refer to the validation screenshot below to see DDR5-8000 CL44-58-58 128 GB (64 GB x2) tested on the ASUS ROG CROSSHAIR X870E APEX motherboard with the AMD Ryzen 9 9950X desktop processor.

Earlier today, industry moles in South Korea have heard whispers about Samsung Electronics planning a new pricing strategy for NAND and DRAM product lines. According to an MK news articles, local sources believe that company leadership will: "raise memory chip prices—by 3-5% from the current level—for major global customers. It is reported that some customers have already begun contract negotiations that reflect the increase conditions." Regional watchdogs posit that the megacorporation is reacting to very current geopolitical tensions (i.e. tariffs). Earlier this week, a main rival—Micron—informed customers about forthcoming memory price increases. Naturally, the North American memory chip giant is not "fully" affected by recent seismic shifts. A "significant growth demand" has caused jacked up charges—effective across DRAM, NAND flash, and HBM portfolios—projected throughout 2025 and 2026.

Returning to South Korean shores and Samsung, one unnamed semiconductor insider opined to MK: "oversupply continued throughout last year, but supply has recently decreased as major companies have begun to reduce production...In addition, artificial intelligence (AI) devices are appearing one after another in China, and demand for semiconductors is gradually increasing due to industrial automation." DRAMeXchange—an appropriately named market research organization—has kept track relevant trends. As disclosed by the MK news piece—as of last month, general-purpose DRAM DDR4 prices: "remained flat for the fourth month in a row." Looking at conditions for DDR5 (used in high-performance PCs and enterprise equipment), prices soared by 12%. DRAMeXchange observed NAND costs rising by 9.6%: "continuing an upward trend for the third consecutive month."

XPG, a gaming brand of ADATA Technology, a global leader in memory modules and flash memory, is proud to announce its successful collaboration with GIGABYTE Technology. Leveraging the XPG LANCER RGB DDR5 memory and LN2 (Liquid Nitrogen) cooling technology, achieved an astonishing 12,762 MT/s overclocking speed, breaking the DDR5 memory overclocking world record. This remarkable achievement has been verified by the renowned international overclocking scoring platform, HWBOT, reinforcing XPG's leadership in extreme overclocking memory.

A Legendary Overclocking Record By Two Industry Titans
This record-breaking overclocking effort was spearheaded by GIGABYTE's renowned overclocker and engineer, HiCookie. The setup featured the Z890 AORUS TACHYON ICE motherboard, meticulously designed for overclocking, paired with the XPG LANCER RGB DDR5 memory and an Intel Core Ultra 9 285K processor. The XPG LANCER's optimized PCB design, IC tuning capabilities, and integrated circuit technology ensured stable operation even under the extreme LN2 environment, laying a crucial foundation for this world record. The Z890 AORUS TACHYON ICE motherboard, boasting an array of overclocking-centric features, including an OC button and an LN2_SW liquid nitrogen mode switch, further facilitated the CPU's ability to achieve its peak performance under extreme conditions.

V-Color Technology Inc., a global leader in advanced, high-performance memory solutions, proudly announces the groundbreaking launch of the industry's first-ever 64 GB (32 GB x2) DDR5 O CUDIMM memory kit, featuring unprecedented speeds up to 9000 MT/s. Specifically tailored for Intel Core Ultra processors and the latest Z890 motherboards, this cutting-edge product expands V-Color memory solutions. This new kit will also be part of the acclaimed SCC lineup (Speed Booster, Colorful Makeover, Cost-effective), delivering unmatched capacity, speed, and reliability to empower systems for AI training, gamers, creators, and professional users worldwide.

In line with V-Color's tradition of continuously pushing the envelope, the introduction of this groundbreaking 64 GB (32 GB x2) DDR5 OC memory kit represents a significant milestone in the memory industry. This new kit combines ultra-high memory capacity with setting frequencies, ensuring exceptional performance and responsiveness for intensive workloads, gaming, and creative applications.

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

KLEVV, the leading consumer memory and storage brand introduced by Essencore, today announces exciting updates to its DDR5 Gaming/OC memory lineup. The new releases include stylish color options for the FIT V and BOLT V series, enhanced performance with lower latency SKUs, and "Optimized for AMD" variants across its DDR5 OC models. This update boosts overall system efficiency and expands platform compatibility, offering gamers, creators, and professionals even more choices to elevate their systems.

KLEVV introduces two fresh color variations to its FIT V and BOLT V memory series, complementing a broader range of system designs. The FIT V series now features an elegant Jet Black edition, delivering a minimalist and understated aesthetic tailored for creators and professionals. Meanwhile, the BOLT V series now features an all new pure White edition, combining a bold, modern aesthetic alongside high-speed performance tailored for gamers.

MSI IPC, a global leader in industrial computing solutions, proudly unveils the MS-CF05, V2.0, a high-performance ATX motherboard engineered for industrial automation, edge computing, and embedded applications. Designed to support 14th, 13th, and 12th Gen Intel Core, Pentium, and Celeron processors, the MS-CF05, V2.0 delivers exceptional computing power, scalability, and I/O flexibility, including a PCI slot for legacy support, making it ideal for modern industrial needs.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the release of three new DDR5 memory specifications with AMD EXPO OC profiles for AMD platforms, including an extreme speed with low-latency at DDR5-8000 CL36-48-48 48 GB (24 GB x2), large-capacity & low-latency DDR5-6000 CL28-36-36 192 GB (48 GB x4), and a new DDR5-6000 CL26-39-39 with 48 GB (24 GB x2) kit capacity. Designed for PC enthusiasts, gamers, content creators, and AI applications, these cutting-edge DDR5 memory kits push the boundaries of speed, latency, and capacity on AMD AM5 platforms.

Pushing the Limits with Extreme DDR5-8000 CL36 24 GB x2
For users seeking top-tier performance, the new DDR5-8000 CL36-48-48 24 GB x2 memory kit with AMD EXPO OC profile is engineered for ultra-high memory speed at low CL36 latency timings. This extreme-speed and low-latency combination is ideal for exceptional system responsiveness and multitasking performance. See below for the Memtest validation screenshot showcasing its stability on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

AMD today launched the EPYC Embedded 9005 line of server processors in the embedded form-factor. These are non-socketed variants of the EPYC 9005 "Turin" server processors. The chips are intended for servers and other enterprise applications where processor replacements or upgradability are not a consideration. The EPYC Embedded 9005 "Turin" are otherwise every bit similar to the regular socketed EPYC 9005 series. These chips are based on a BGA version of the "Turin" chiplet-based processor, and powered by the "Zen 5" microarchitecture. Besides the BGA package, the EPYC Embedded 9005 series comes with a few features relevant to its form-factor and target use-cases.

To begin with, the EPYC Embedded 9005 "Turin" series comes with NTB (non-transparent bridging), a technology that enables high-performance data transfer between two processor packages across different memory domains. NTB doesn't use Infinity Fabric or even CXL, but a regular PCI-Express 5.0 x16 connection. It isn't intended to provide cache coherence, but to absorb faults across various memory domains. Next up, the series supports DRAM flush for enhanced power-loss mitigation. Upon detecting a power loss, the processor immediately dumps memory onto NVMe storage, before the machine turns off. On restart, the BIOS copies this memory dump from the NVMe SSD back to DRAM. Thirdly, the processors in the series support dual SPI flash interfaces, which enables system architects to embed lightweight operating systems directly onto a 64 MB SPI flash ROM, besides the primary SPI flash that stores the system BIOS. This lightweight OS can act like a bootloader for operating systems in other local storage devices.

Biwin, a world-renowned innovator in cutting-edge memory and storage solutions, proudly introduces the Biwin Black Opal OC Lab Gold Edition DW100 RGB DDR5 192 GB Memory Kit (48 GB x 4), available in DDR5-6400 CL30-39-39-108 1.4 V and DDR5-6000 CL28-36-36-102 1.4 V specifications. Breaking the capacity limits of traditional consumer memory, this ultra-large 192 GB kit offers the performance boost needed for AI computing, large-scale data processing, and next-gen computing.

Push Memory Performance with Revolutionary 192 GB Memory Kit
Biwin Black Opal DW100, delivering an ultra-high-capacity 192 GB (48 GB x4) configuration, redefines what's possible with desktop memory and exceptional memory bandwidth, stability, and efficiency. This breakthrough enables users to take full advantage of DDR5's enhanced data throughput to power fast, out-of-the-box speeds for AI computing, large language models (LLMs), generative AI, and edge computing, and other data-rich workloads.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC solutions, today introduced the new B850MT2-E DJ motherboard. Built on AMD's B850 chip architecture, B850MT2-E DJ is tailor-made for casual home and office use.

Engineered to support the latest AMD Ryzen 9000, 8000, and 7000 series processors, the B850MT2-E DJ ensures seamless multitasking and efficient power management, making it an ideal choice for modern computing needs. Supporting up to 128 GB of DDR5 across two DIMM slots, the B850MT2-E DJ offers more bandwidth than DDR4, delivering faster data access and smoother performance. Additionally, PCIe 4.0 M.2 support provides lower latency and lightning-fast speeds of up to 64 Gb/s, doubling the bandwidth of PCIe 3.0 M.2 for quick data transfers and minimal load times, ensuring a smooth and efficient user experience.

Team Group Inc. announced today that it will participate in Embedded World 2025, a premier global event for embedded technology. The company will unveil its latest industrial-grade solutions, spanning three key product lines designed to meet the evolving demands of AI, high-performance computing, and data security. These innovations demonstrate Team Group's commitment to advancing efficiency and stability in industrial applications while laying a solid foundation for future technological progress.

Highlighting its leadership in embedded applications and groundbreaking technology, Team Group's D500R WORM Memory Card has been recognized with the prestigious Embedded Award. Join Team Group from March 11-13, 2025, at NürnbergMesse Convention Center in Nuremberg, Germany (Hall 5 / 5-239) to explore the latest breakthroughs and optimal solutions in industrial solutions.

At MWC 2025, Lenovo unveils its latest portfolio of AI-powered business devices, featuring next-generation ThinkPad and ThinkBook laptops, expanded software and recent ThinkShield security solutions, and showcases visionary proof-of-concept innovations. Designed to enhance productivity, personalization, and business protection, these new devices integrate AI-driven computing, flexible form factors, and enterprise security solutions to meet the evolving demands of professionals and hybrid workers.

"AI is fundamentally transforming how businesses operate, and at Lenovo, we are committed to delivering smarter, more secure, and more adaptable solutions that empower professionals in today's fast-evolving workplace. Our latest ThinkPad and ThinkBook innovations leverage AI to enhance productivity, streamline IT management, and provide more secure and seamless hybrid work experiences," said Eric Yu, SVP of SMB and Commercial Product Center, Lenovo Intelligent Devices Group. "The ThinkBook codename Flip AI PC Concept exemplifies our vision for the future—where AI-powered devices drive efficiency, personalization, and collaboration like never before. With our expanding portfolio of AI-integrated business devices and intelligent IT solutions, Lenovo is helping organizations to harness the power of AI in an ever-changing world."

TrendForce's latest research reveals that global DRAM industry revenue surpassed US$28 billion in 4Q24, marking a 9.9% QoQ increase. This growth was primarily driven by rising contract prices for server DDR5 and concentrated shipments of HBM, leading to continued revenue expansion for the top three DRAM suppliers.

Most contract prices across applications were seen to have reversed downward. However, increased procurement of high-capacity server DDR5 by major American CSPs helped sustain price momentum for server DRAM.

AAEON's UP brand this week confirmed the release of the UP Squared 7100 Edge, its fourth generation of Mini PC based on the compact UP Squared (85.6 mm × 90 mm) developer board. The UP Squared 7100 Edge comes equipped with either the Intel Processor N97 or Intel Processor N100 as its default CPU, a substantial upgrade on the Elkhart Lake platform offered by the PC range's previous generation. Further upgrades can be seen in its 16 GB of soldered LPDDR5 system memory, which delivers up to 50% higher data rates with greater power-efficiency.

Equipped with a solid I/O primarily geared towards industrial automation and communication tasks—such as dual Gigabit LAN and three USB Type-A ports—the UP Squared 7100 Edge sees AAEON add a second DB-9 port. This upgrade grants systems integrators with two COM ports, both supporting RS-232/422/485 signals.
The UP Squared 7100 Edge's design makes it a very suitable option for upgrading existing industrial automation setups that require communication with legacy equipment. However, with CPU-native functions such as Enhanced Intel SpeedStep Technology and AVX2 Instruction sets, the UP Squared 7100 Edge can execute more demanding edge computing workloads while remaining power-efficient, making it an equally good choice for new, more advanced projects.

Biwin, a leading innovator in storage and memory technology, in cooperation with the OC Lab, launches the new OC Lab Gold Edition DW100 RGB DDR5 at DDR5-8000 CL34 & CL36 32 GB (2×16 GB) along with a second DDR5-6400 CL28 EXPO profile.

Both DDR5-8000 options, with their ultra-high speeds and optimized timings, are tailored for overclocking and extreme performance scenarios that push the system to the limit. These profiles excel in scenarios where every ounce of speed is needed, such as high-end gaming, benchmarking, or other performance-demanding tasks. The DDR5-6400 option strikes a more balanced approach, prioritizing lower latencies while still delivering a strong performance. With its lower latency, the DDR5-6400 provides smooth gaming, faster application load times, and overall system responsiveness.