Senao Networks Inc., a global leader in advanced networking and computing solutions, proudly announces the launch of its AI PC, AC121, an ultra-compact intelligent PC that combines next-generation performance, AI-driven intelligence, and a sleek, space-saving design. Tailored for modern professionals, enterprises, and technology enthusiasts, the AC121 establishes a new standard in compact computing.

Unparalleled Performance
At the heart of the AC121 is the Intel Arrow Lake-S processor, offering 65 W/35 W TDP and integrated NPU to power AI-enhanced workloads. This makes the AIPC ideal for multitasking, content creation, and AI-enhanced applications.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce the introduction of an enhanced revision of DDR5 R-DIMM memory to the market. Based on the newly released JEDEC revision standards for DDR5 R-DIMM, the new G.SKILL R-DIMM memory features a 16-layer PCB for improved signal integrity, as well as adding two transient voltage suppression (TVS) diodes and a fuse for voltage protection. Designed for enterprise servers and professional workstations, the new DDR5 R-DIMM memory brings cutting-edge advancements to performance and protection.

Improved Signal Integrity with 16-Layer PCB
These new DDR5 R-DIMM memory modules feature an advanced 16-layer PCB, a significant upgrade from previous 8- or 10-layer designs. The increase in the PCB layer count improves signal integrity for better reliability and stability in data transmission, even under high-performance or overclocked workloads - making it an ideal DDR5 R-DIMM memory choice for high-performance computing applications on servers or workstations.

GIGABYTE, a global leader in computing innovation and technology, will showcase its full-spectrum AI computing solutions that bridge development to deployment at MWC 2025, taking place from March 3-6.

"AI+" and "Enterprise-Reinvented" are two of the themes for MWC. As enterprises accelerate their digital transformation and intelligent upgrades, the transition of AI applications from experimental development to democratized commercial deployment has become a critical turning point in the industry. Continuing its "ACCEVOLUTION" initiative, GIGABYTE provides the comprehensive infrastructure products and solutions spanning cloud-based supercomputing centers to edge computing terminals, aiming to accelerate the next evolution and empower industries to scale AI applications efficiently.
⁠

Loongson Technology has announced its next-generation 3B6600 processor—according to recent Chinese press reports, early details were disclosed in "investor relations activity" documentation. Their eight-core design is still in development, with the fabless company (allegedly) setting some lofty performance goals. According to a MyDrivers report (citing Fast Technology), the 3B6600 processor's single-core and multi-core "high level" performance is touted to match that of Core i5 and i7 offerings from Intel's 12th and 13th Generation portfolios. In the past, Loongson has compared its older products to Western equivalents. Last year, their 3A6000 chip design was mentioned in the same sentence as "AMD Zen 4 and Intel Raptor Lake" processor families. Around November 2023, reports had it approximating Team Blue Core i3-10100 "Comet Lake" CPU performance.

The next-gen 3B6600 CPU is supposedly using its predecessor (3A6000) as a springboard; MyDrivers believes that the same in-house LoongArch ISA design (fabricated on 12 nm/14 nm) will be revisited. The publication highlighted a significant area of optimization: "single-core performance of 3B6600 is expected to be in the world's leading ranks...Loongson 3B6600 will continue to use mature technology, and the architecture core will be upgraded to the new LA864. The same frequency performance is greatly improved by about 30%, compared with the Loongson 3A6000's LA664 architecture." Loongson engineers are reportedly targeting a maximum turboboost frequency of 3.0 GHz, but under normal operation the 3B6600 chip is predicted to offer a main frequency of 2.5 GHz. The new design will integrate a new "LG200 GPGPU" graphics computing core—additionally, supported standards include: DDR5 memory, PCIe 4.0 bus, and HDMI 2.1.

AMD is readying two important client segment processors powered by the next-generation "Zen 6" microarchitecture, according to a sensational new report by Moore's Law is Dead. These are the "Medusa Point" mobile processor, and the "Olympic Ridge" desktop. The former is a BGA roughly the size and Z-Height of the current "Strix Point," but the latter is being designed for the existing Socket AM5, making it the third (and probably final) microarchitecture to do so. If you recall, Socket AM4 served three generations of Zen, not counting the refreshed "Zen+." At the heart of the effort is a new CPU complex die (CCD) that AMD plans to use across its client and server lineup.

The "Zen 6" performance CCD is being designed for a 3 nm-class node, likely the TSMC N3E. This node promises a significant increase in transistor density, power, and clock speed improvements over the current TSMC N4P node being used to build the "Zen 5" CCD. Here's where it gets interesting. The CCD contains twelve full-sized "Zen 6" cores, marking the first increase in core-counts of AMD's performance cores since its very first "Zen" CCD. All 12 of these cores are part of a single CPU core complex (CCX), and share a common L3 cache. There could be a proportionate increase in cache size to 48 MB. AMD is also expected to improve the way the CCDs communicate with the I/O die and among each other.

Maxsun has just launched its MS-iCraft B860M CROSS "Aiga" Micro-ATX motherboard series for Intel CPUs, which includes both a standard and a Pro version. While both models share similarities—such as an all-white design—they also have key differences. The Pro version of the MS-iCraft B860M CROSS "Aiga" motherboard features a 3.4-inch display on the upper-left I/O armor, capable of showing real-time system information as well as custom graphics. In contrast, the standard version has a smaller screen that displays Aiga animations. Another distinction is that the Pro version is equipped with an Intel BE200 wireless network card, whereas the standard version uses the Intel AX211.

Aside from these differences, both motherboards have similar specifications. They support up to 192 GB of DDR5 RAM across four DIMM slots, with overclocking speeds reaching up to 9066 MT/s. Power delivery is handled by a 16+1+1 phase power supply design with 50 A DrMOS. Additionally, both models include a PCIe 5.0 x16 slot for high-performance graphics cards, and one PCIe 4.0 x4 slot.

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

V-COLOR Technology Inc. proudly introduces the groundbreaking CKD SCC (Speed Booster, Colorful Makeover and Cost effective) O CUDIMM RGB Filler Kit 2+2 (2 DRAM Modules + 2 Filler Modules) additions to its DDR5 memory lineup, redefining high-performance and customization. With the launch of the new SCC O CUDIMM RGB Filler Kit now compatible with Intel Core Ultra CPUs Motherboards 800 series up to 8800 MT/s and not only that, the already existent SCC UDIMM kit just got a massive upgrade now reaching 8000 MT/s with dual profiles for Intel XMP 3.0 and AMD EXPO. This new SCC line will be under the family of the already amazing XFinity series that continues to push the boundaries of memory innovation.

The latest CKD SCC O CUDIMM is optimized for Intel Core Ultra CPUs and Z890 series motherboards, offering unmatched performance and stability. With speeds reaching 8000 MT/s ~ 8200 MT/s for 32 GB (2x 16 GB) configurations and 7000 MT/s ~ 8800 MT/s for 48 GB (2x 24 GB) configurations. The latest lineup of SCC technology doesn't just revolutionize the new O CUDIMM memory modules; it also pushes the boundaries of already existing UDIMMs to unprecedented levels. Speeds now reach an impressive 7200 MT/s up to 8000 MT/s, while the addition of dual profiles ensures seamless compatibility and performance optimization for both AMD EXPO and Intel XMP 3.0 systems. This development bridges accessibility across platforms, offering next-level performance for enthusiasts and professionals alike.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the 9th Annual OC World Cup 2025 extreme overclocking competition, starting with the Online Qualifier Stage, which will run from February 15, 2025 until March 19, 2025 on HWBOT.org. A total of 9 finalists from the Online Qualifier stage will be invited to compete live on the Live Qualifier stage at Computex from May 20 through May 23, 2025, which will be held in Taipei, for a share of the total prize pool of $40,000 USD. The OC Champion of the OC World Cup 2025 competition will be taking home $10,000 USD.

Consisting of three stages, beginning with the Online Qualifier, and ending with the Live Qualifier and Grand Final stages, which will be held in Taipei at Computex 2025, the G.SKILL OC World Cup is considered one of the most challenging overclocking competitions. The top 9 overclockers of the Online Qualifier stage will be invited to compete against each other live during the week of Computex 2025 at the G.SKILL booth in Nangang Exhibition Hall, and the top 3 overclockers from the Live Qualifier stage will go on competing for the title of OC Champion in the Grand Final stage.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, has expanded its diverse portfolio of short-depth NAS products designed for edge storage. The new 1U short-depth rackmount 4-bay 2.5GbE NAS TS-h765eU features a shorter chassis depth and is perfect for small media cabinets and wall-mounted network racks in space-constrained office environments or industrial settings. The TS-h765eU is a long-term supply model till 2031, making it a reliable NAS choice for organizations planning long-term projects or multi-site deployments.

The TS-h765eU combines robust performance, multitasking capabilities, and great I/O expandability to meet diverse application requirements. It features the latest Intel Atom x7000C Series processor, supports built-in 8 GB DDR5 RAM, upgradable to 16 GB (In-Band ECC), has dual 2.5GbE ports, and provides four 3.5-inch SATA drive bays and three E1.S/M.2 PCIe NVMe slots for installing E1.S/M.2 2280 SSDs to enhance read/write performance or upgrading to 10GbE using E1.S interface network modules. Running the ZFS-based QuTS hero operating system, the TS-h765eU prioritizes data integrity, immutability with WORM protection, and powerful data reduction.

G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing the release of high-speed, low-latency DDR5-6800 CL32 memory specification with large kit capacity of up to 96 GB (2x 48 GB), as well as DDR5-6400 CL28 32 GB (2x 16 GB) high-performance memory specification. These new memory specifications will be available under the G.SKILL Trident Z5 Royal, Trident Z5 RGB, and Ripjaws M5 RGB series, with Intel XMP 3.0 memory overclock profile support.

As G.SKILL continues to push memory performance to higher limits, an ideal memory solution for overclocking enthusiasts who are looking for both large capacity and high performance is born at DDR5-6800 CL32-42-42 at up to 96 GB (2x 48 GB). This new specification has been validated on both Intel Z790 and Z890 platforms. Please refer to the screenshots below for Memtest validation on the ASUS ROG Maximus Z890 Hero motherboard with the Intel Core Ultra 7 265K desktop processor, and the ASUS ROG Maximus Z790 Dark Hero motherboard with the Intel Core i9-14900K desktop processor.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

ChangXin Memory Technology (CXMT) is playing catch up with competitors based in neighboring nations—as reported earlier today, this Chinese memory module manufacturer is making advancements in the field of commercial DDR5 products. Reports from the region suggest that a well-known motherboard manufacturer has embraced some of ChangXin new portfolio. According to a recent ITHome article, MSI has implemented a multitude of optimizations for new-ish Intel "Arrow Lake" Core Ultra Series 2 CPU-oriented motherboards—notably the MAG B860 TOMAHAWK WIFI, MAG B860M MORTAR WIFI, and PRO B860M-A WIFI models.

The publication provided evidence of MSI enabling transfer rates of 6800 MT/s across four engaged modules—a welcome step up from the usual twin-stick setup. ITHome also points out that the motherboard specialist has prepared a new BIOS version for B860 chipset mainboards: "specially optimized for the recently popular DDR5 domestic memory particles of ChangXin Storage, which undoubtedly gives the gaming community (in China) more choices." MSI appears to be the first major international vendor to enable support for CXMT's DDR5 modules—thus, representing a significant achievement for the Chinese memory industry.

TechInsights has identified CXMT's new 16 nm DRAM chips in Gloway DDR-6000 UDIMM modules, confirming advancement in the Chinese memory industry. The CXMT 16 Gb DDR5 chip measures 67 square millimeters with a density of 0.239 Gb per square millimeter. The G4 DRAM cells are 20 percent smaller than CXMT's previous G3 generation. This follows the company's progression from 23 nm (G1) and 18 nm (G2) nodes. Despite this advancement, CXMT remains approximately three years behind Samsung, SK Hynix, and Micron in manufacturing capabilities. The Hefei-based company achieved this production milestone under US sanctions restricting access to certain manufacturing equipment and materials, setting it back years in gaining production of advanced memory nodes.

TechInsights found these chips in commercially available memory modules, confirming CXMT's entry into DDR5 production. DDR5 technology is projected to be the primary DRAM standard through 2027. The three major DRAM manufacturers have been producing DDR5 through multiple generations, with DDR5 now reaching 10,000 MT/s speeds. This represents CXMT's first DDR5 DRAM product to reach the consumer market. The chips meet basic compatibility requirements for current DDR5 specifications, meaning that the Chinese memory manufacturing has achieved "1z" memory manufacturing on its soil. This marks the second major news for the Chinese semiconductor industry, right after TechInsights also confirmed that YMTC has started shipping 292-layer NAND Flash. With domestic demand for memory and storage projected to remain strong, we wonder if the supply will exceed demand and allow some left-over chips for worldwide usage.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces the remarkable overclocking achievement by Z890 AORUS TACHYON ICE motherboard with the latest Intel Core Ultra (Series 2) processor. Featuring the exclusive LN2 SWITCH function, which is key to breaking through in this overclocking attempt, and V-COLOR Manta Xfinity RGB, esteemed overclocker HiCookie has once again pushed the limits and set an astonishing record of DDR5-12726. This achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

Besides the astonishing memory frequency, Z890 AORUS TACHYON ICE also break another three world records of 3DMARK CPU Profile 1T/2T/8T.

Montage Technology today announced that it has successfully sampled its Gen 2 Multiplexed Rank Registering Clock Driver (MRCD) and Multiplexed Rank Data Buffer (MDB) chipset to leading global memory manufacturers. Designed for DDR5 Multiplexed Rank DIMM (MRDIMM), this new chipset supports data rates up to 12800 MT/s, delivering exceptional memory performance for next-generation computing platforms.

The release comes at a crucial time, as AI and big data analytics drive increasing demands for memory bandwidth in data centers. MRDIMM technology has emerged as a key solution to address this challenge, particularly as server processors continue to increase in core count.

As a leader in innovative technology, Acemagic is excited to announce the upcoming pre-sale launch of the F3A AI 370 MINI PC by the end of January 2025. Powered by AMD's latest Ryzen AI 9 HX 370 processor, this high-performance mini PC combines outstanding computational power with cutting-edge cooling technology, designed to meet the needs of professionals, content creators, and high-end users.

The F3A AI 370 MINI PC features an advanced 12-core, 24-thread processor, built on AMD's Zen 5 and Zen 5c architecture. With a base clock speed of 2.0 GHz and a turboboost up to 5.1 GHz, it delivers exceptional multithreaded performance and processing power. Additionally, the F3A is equipped with the third-generation Ryzen AI NPU (Neural Processing Unit) based on the XDNA2 architecture, offering up to 50 TOPS of AI computing performance. With seamless collaboration between the GPU and CPU, the F3A achieves an impressive total performance of up to 80 TOPS, making it ideal for high-demand applications like deep learning and AI inference.

We have witnessed quite a few affordable laptops hit shelves in the past few weeks, including offerings from Acer and ASUS. For those who are more interested in tablets but prefer a full-fledged Desktop OS will likely find the newly launched Lenovo S130 2-in-1 quite enticing, but there exists a major hurdle - the Lenovo S130 is China-only, for now at least. However, an international launch is not entirely out of the question.

At its core, the Lenovo S130 is powered by the Intel N100 processor. With four cores, four threads, and a maximum boost clock of 3.4 GHz, the 6-watt N100 is far from a powerhouse chip. That said, it should likely be enough for casual web-browsing and media consumption, but expecting anything more from the chip would be futile. The S130 does feature an impressive 13.3-inch display, with a resolution of 3000 x 2000 with a maximum brightness of 420 nits, making the S130 quite ideal for content consumption indeed.

Transcend Information Inc. (Transcend), a global leader in storage solutions, is proud to announce its new DDR5 6400 CUDIMM DRAM modules. Designed specifically for gamers, content creators, DIY PC enthusiasts, and demanding professionals, these modules offer enhanced performance and stability to meet varying speed and capacity requirements. Optimized from standard DIMMs, CUDIMMs include a Client Clock Driver (CKD) for stable and efficient operation, making them ideal for high-performance desktop systems that require greater bandwidth and reliability.

With data transfer rates of up to 6400 MT/s, Transcend's DDR5 6400 DRAM modules significantly boost gaming performance, video editing smoothness, and large file processing speeds. Whether you are tackling the latest AAA gaming titles, editing high-resolution videos, or multitasking across multiple applications, these modules keep your system running smoothly even under extreme load and deliver an exceptional user experience. Plus, built-in on-die Error Correction Code (ECC) technology ensures data integrity, safeguarding important files, game progress, and creative content.

Shipping manifests at NBD.ltd have revealed the presence of Intel's "Nova Lake" test chips, providing insight into the development timeline of the company's 2026 processor platform. The discovery comes as Intel prepares for the launch of its "Panther Lake" CPUs on the 18A process node in late 2025. Nova Lake is positioned to replace both Panther Lake for mobile devices and "Arrow Lake" for desktop systems. The manufacturing process remains unconfirmed, with Intel potentially using either its in-house 14A node or TSMC's 2 nm technology. Following recent practices, Intel may split production between its own facilities and TSMC for different components. Rumored specifications show that Nova Lake will use Coyote Cove performance cores and Arctic Wolf efficiency cores.

Unlike Lunar Lake, it will not incorporate on-package memory, maintaining a more conventional design approach. The test chip's appearance suggests Intel is adhering to its development schedule. This timing aligns with the company's plans for Panther Lake's mass production in the second half of 2025, a structured transition between generations. Documents point to "Razor Lake" as Nova Lake's eventual successor, though detailed specifications are not yet available. Panther Lake, the immediate predecessor to Nova Lake, will focus primarily on mobile computing, with desktop variants limited to Mini PC implementations. This approach mirrors the Meteor Lake generation, which saw limited desktop release through the "PS" series for Edge platforms. The Nova Lake platform is expected to support DDR5 memory and may introduce PCIe Gen 6.0 compatibility, with final specifications unconfirmed.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents our lineup of Intel B860 Series motherboards in the ULTRA, CVN GAMING FROZEN, and BATTLE-AX models.

The Intel B860 chipset is aimed at the mid-range level price segment for the Intel Core Ultra 200 series desktop processors. The COLORFUL B860 motherboards features DDR5 memory support, support for up to PCIe Gen 5 SSDs, high-speed 40 Gbps USB4 ports, fast Wi-Fi 7 wireless networking, and more.

AMD is rumored to be building its next-generation CCD (core complex die) that implements the "Zen 6" microarchitecture, on the 3 nm TSMC N3E foundry node. This is part of a set of rumors from ChipHell forum, which got past rumors on AMD right. Apparently, AMD will also refresh the I/O dies for its next generation process, building them on the 4 nm foundry node, likely the TSMC N4C. The TSMC N3E node offers a 20% speed improvement, over 30% power savings, and approximately 60% logic density increase over TSMC N5, whereas the TSMC N4P node that the company uses for its current "Zen 5" chiplets only clock minor increases in logic density and power over N5. The N3E node relies on EUV double-patterning to achieve its logic density increases.

Perhaps the most interesting piece of news is the new-generation I/O dies. AMD is building these on the 4 nm node, which is a significant step up from the 6 nm node its current I/O dies are built on. On the client side of things, 4 nm will enable AMD to give the new cIOD an updated iGPU, probably based on a newer graphics architecture, such as RDNA 3.5. It will also give AMD the opportunity to integrate an NPU. The company might also update its key I/O components, such as the DDR5 memory controllers, to support higher memory speeds unlocked by CUDIMMs. We don't predict any updates on the PCIe front, since AMD is expected to carry on with Socket AM5, which determines that the cIOD puts out 28 PCIe Gen 5 lanes. At best, the USB interface put out from the processor could be updated to USB4 through an on-die host controller. Over on the server side, the new-generation sIOD will bring much needed increases to the DDR5 memory speeds enabled by clock drivers.

GEEKOM, the Green Mini PC Global Leader, is going to release a new model named the A6 on January 17th, 2025. This mini PC is already available for pre-order on GEEKOM's official website. Priced at $449, it may just be the new best mini PC under $500.

According to the official information, the GEEKOM A6 mini PC employs a well-ventilated aluminium chassis which measures only 0.47 liter, but it packs enormous power under the hood, thanks to the perfect combination of a beefy processor, high-bandwidth DDR5 RAM, and a fast PCIe Gen 4 SSD.

Exciting things are happening in the world of memory right now. Many of the headlines are being claimed by a new variety of DIMM, called Clock Unbuffered DIMM (CUDIMM). Featuring an integrated clock driver on the memory stick itself for improved reliability and stability, CUDIMM kits are already shattering speed records. But perhaps you're more concerned with memory capacity than with raw speed. We have some good news for you. The trusted memory professionals at Kingston have cooked up a 64 GB memory module that you'll be able to purchase soon: the Kingston Value RAM DDR5 6400 MT/s 64 GB CUDIMM.

64 GB of DDR5 RAM on a single stick opens intriguing new possibilities. A 128 GB one-DIMM-per-channel (1DPC) configuration is rather tempting. We suspect that many enthusiasts will be tempted by the prospect of installing four of these modules, a move that puts a stunningly large 256 GB (4 x 64 GB) pool of memory at their disposal—without having to venture into quad-channel workstation hardware.

Thermaltake, a leading PC DIY brand for premium hardware solutions, proudly launches today at CES 2025 the TOUGHRAM XG RGB D5 7200 MT/s 32 GB (16 GB x2), now equipped with the latest CKD (Client Clock Driver) technology. This new addition to Thermaltake's high-performance DDR5 memory lineup integrates advanced technology with a sleek design, offering an exceptional solution for PC enthusiasts and professionals. With CKD technology, the TOUGHRAM XG RGB D5 Memory ensures superior signal integrity, improved power efficiency, and enhanced overclocking stability, delivering consistent performance under the most demanding workloads. Ideal for gaming, creative projects, and AI-driven applications, this memory module is engineered to exceed the expectations of modern high-performance computing.

"Thermaltake is committed to redefining the limits of DRAM memory technology to meet the evolving needs of gamers and professionals," said Kenny Lin, CEO of Thermaltake. "The TOUGHRAM XG RGB D5 with CKD technology exemplifies our dedication to delivering cutting-edge solutions that offer superior speed, stability, and customization; whether for serious gamers, creators, or even AI development, this memory sets a new benchmark in high-performance computing."