We have witnessed quite a few affordable laptops hit shelves in the past few weeks, including offerings from Acer and ASUS. For those who are more interested in tablets but prefer a full-fledged Desktop OS will likely find the newly launched Lenovo S130 2-in-1 quite enticing, but there exists a major hurdle - the Lenovo S130 is China-only, for now at least. However, an international launch is not entirely out of the question.

At its core, the Lenovo S130 is powered by the Intel N100 processor. With four cores, four threads, and a maximum boost clock of 3.4 GHz, the 6-watt N100 is far from a powerhouse chip. That said, it should likely be enough for casual web-browsing and media consumption, but expecting anything more from the chip would be futile. The S130 does feature an impressive 13.3-inch display, with a resolution of 3000 x 2000 with a maximum brightness of 420 nits, making the S130 quite ideal for content consumption indeed.

Transcend Information Inc. (Transcend), a global leader in storage solutions, is proud to announce its new DDR5 6400 CUDIMM DRAM modules. Designed specifically for gamers, content creators, DIY PC enthusiasts, and demanding professionals, these modules offer enhanced performance and stability to meet varying speed and capacity requirements. Optimized from standard DIMMs, CUDIMMs include a Client Clock Driver (CKD) for stable and efficient operation, making them ideal for high-performance desktop systems that require greater bandwidth and reliability.

With data transfer rates of up to 6400 MT/s, Transcend's DDR5 6400 DRAM modules significantly boost gaming performance, video editing smoothness, and large file processing speeds. Whether you are tackling the latest AAA gaming titles, editing high-resolution videos, or multitasking across multiple applications, these modules keep your system running smoothly even under extreme load and deliver an exceptional user experience. Plus, built-in on-die Error Correction Code (ECC) technology ensures data integrity, safeguarding important files, game progress, and creative content.

Shipping manifests at NBD.ltd have revealed the presence of Intel's "Nova Lake" test chips, providing insight into the development timeline of the company's 2026 processor platform. The discovery comes as Intel prepares for the launch of its "Panther Lake" CPUs on the 18A process node in late 2025. Nova Lake is positioned to replace both Panther Lake for mobile devices and "Arrow Lake" for desktop systems. The manufacturing process remains unconfirmed, with Intel potentially using either its in-house 14A node or TSMC's 2 nm technology. Following recent practices, Intel may split production between its own facilities and TSMC for different components. Rumored specifications show that Nova Lake will use Coyote Cove performance cores and Arctic Wolf efficiency cores.

Unlike Lunar Lake, it will not incorporate on-package memory, maintaining a more conventional design approach. The test chip's appearance suggests Intel is adhering to its development schedule. This timing aligns with the company's plans for Panther Lake's mass production in the second half of 2025, a structured transition between generations. Documents point to "Razor Lake" as Nova Lake's eventual successor, though detailed specifications are not yet available. Panther Lake, the immediate predecessor to Nova Lake, will focus primarily on mobile computing, with desktop variants limited to Mini PC implementations. This approach mirrors the Meteor Lake generation, which saw limited desktop release through the "PS" series for Edge platforms. The Nova Lake platform is expected to support DDR5 memory and may introduce PCIe Gen 6.0 compatibility, with final specifications unconfirmed.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents our lineup of Intel B860 Series motherboards in the ULTRA, CVN GAMING FROZEN, and BATTLE-AX models.

The Intel B860 chipset is aimed at the mid-range level price segment for the Intel Core Ultra 200 series desktop processors. The COLORFUL B860 motherboards features DDR5 memory support, support for up to PCIe Gen 5 SSDs, high-speed 40 Gbps USB4 ports, fast Wi-Fi 7 wireless networking, and more.

AMD is rumored to be building its next-generation CCD (core complex die) that implements the "Zen 6" microarchitecture, on the 3 nm TSMC N3E foundry node. This is part of a set of rumors from ChipHell forum, which got past rumors on AMD right. Apparently, AMD will also refresh the I/O dies for its next generation process, building them on the 4 nm foundry node, likely the TSMC N4C. The TSMC N3E node offers a 20% speed improvement, over 30% power savings, and approximately 60% logic density increase over TSMC N5, whereas the TSMC N4P node that the company uses for its current "Zen 5" chiplets only clock minor increases in logic density and power over N5. The N3E node relies on EUV double-patterning to achieve its logic density increases.

Perhaps the most interesting piece of news is the new-generation I/O dies. AMD is building these on the 4 nm node, which is a significant step up from the 6 nm node its current I/O dies are built on. On the client side of things, 4 nm will enable AMD to give the new cIOD an updated iGPU, probably based on a newer graphics architecture, such as RDNA 3.5. It will also give AMD the opportunity to integrate an NPU. The company might also update its key I/O components, such as the DDR5 memory controllers, to support higher memory speeds unlocked by CUDIMMs. We don't predict any updates on the PCIe front, since AMD is expected to carry on with Socket AM5, which determines that the cIOD puts out 28 PCIe Gen 5 lanes. At best, the USB interface put out from the processor could be updated to USB4 through an on-die host controller. Over on the server side, the new-generation sIOD will bring much needed increases to the DDR5 memory speeds enabled by clock drivers.

GEEKOM, the Green Mini PC Global Leader, is going to release a new model named the A6 on January 17th, 2025. This mini PC is already available for pre-order on GEEKOM's official website. Priced at $449, it may just be the new best mini PC under $500.

According to the official information, the GEEKOM A6 mini PC employs a well-ventilated aluminium chassis which measures only 0.47 liter, but it packs enormous power under the hood, thanks to the perfect combination of a beefy processor, high-bandwidth DDR5 RAM, and a fast PCIe Gen 4 SSD.

Exciting things are happening in the world of memory right now. Many of the headlines are being claimed by a new variety of DIMM, called Clock Unbuffered DIMM (CUDIMM). Featuring an integrated clock driver on the memory stick itself for improved reliability and stability, CUDIMM kits are already shattering speed records. But perhaps you're more concerned with memory capacity than with raw speed. We have some good news for you. The trusted memory professionals at Kingston have cooked up a 64 GB memory module that you'll be able to purchase soon: the Kingston Value RAM DDR5 6400 MT/s 64 GB CUDIMM.

64 GB of DDR5 RAM on a single stick opens intriguing new possibilities. A 128 GB one-DIMM-per-channel (1DPC) configuration is rather tempting. We suspect that many enthusiasts will be tempted by the prospect of installing four of these modules, a move that puts a stunningly large 256 GB (4 x 64 GB) pool of memory at their disposal—without having to venture into quad-channel workstation hardware.

Thermaltake, a leading PC DIY brand for premium hardware solutions, proudly launches today at CES 2025 the TOUGHRAM XG RGB D5 7200 MT/s 32 GB (16 GB x2), now equipped with the latest CKD (Client Clock Driver) technology. This new addition to Thermaltake's high-performance DDR5 memory lineup integrates advanced technology with a sleek design, offering an exceptional solution for PC enthusiasts and professionals. With CKD technology, the TOUGHRAM XG RGB D5 Memory ensures superior signal integrity, improved power efficiency, and enhanced overclocking stability, delivering consistent performance under the most demanding workloads. Ideal for gaming, creative projects, and AI-driven applications, this memory module is engineered to exceed the expectations of modern high-performance computing.

"Thermaltake is committed to redefining the limits of DRAM memory technology to meet the evolving needs of gamers and professionals," said Kenny Lin, CEO of Thermaltake. "The TOUGHRAM XG RGB D5 with CKD technology exemplifies our dedication to delivering cutting-edge solutions that offer superior speed, stability, and customization; whether for serious gamers, creators, or even AI development, this memory sets a new benchmark in high-performance computing."

Corsair at the 2025 International CES brought a couple of new products from its memory and storage lines. This company used to be called "Corsair Memory" before it became Corsair Gaming, so they know a thing or two about enthusiast-segment memory and storage products, going back decades. We begin our tour with the new EX400U, a portable SSD with a 40 Gbps USB4 interface. The drive comes in 1 TB, 2 TB, and 4 TB capacities, and offers sequential transfer speeds of up to 4000 MB/s reads, with up to 3600 MB/s writes. The company hasn't made any claims on minimum write performance, so we don't know if the drive can be used for 4K or 8K RAW cinematography. More than PC, Corsair wants you to be enthused about its mobile chops. It can connect to an iPhone 15 or later as a mass-storage device, and supports MagSafe. Corsair plans to formally launch this on January 23.

Corsair has been agile in the PC overclocking memory space, responding to new trends with product launches, without having to wait for platforms such as trade shows, so there are no new products as such (You can feast your eyes on a DDR5-10000 Vengeance kit which uses CKD), but the company made two new accessory announcements for its Vengeance and Dominator product lines. For Vengeance, Corsair's mainstream and performance-segment memory line, the company announced Corsair Custom Lab, a service that allows you to customize die-cast designs onto the module's heat spreaders. We've seen a few examples at CES, but we're sure there will be more. The Custom Lab Vengeance RGB modules should be available in Q1 2025.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, demonstrates high-speed DDR5 CSO-DIMM memory operating at DDR5-8133 with 48 GB (2x24GB) kit capacity on the newly announced ASRock DeskMini B860 system. CSO-DIMM is a relatively new form factor that adds a clock driver (CKD) onto the compact SO-DIMM design, and is supported by the latest platform generation with Intel Core Ultra 200 series processors.

DDR5-8133 48 GB (2x24GB) Extreme Speed with CSO-DIMM Modules
Thanks to the ASRock DeskMini B860 system that implements DDR5 CSO-DIMM support and provides outstanding memory overclock performance, G.SKILL is able to unleash the ultimate overclock potential of the new high-speed CSO-DIMM memory kits. The screenshot below shows the G.SKILL CSO-DIMM memory kit with 48 GB (2x24GB) running at DDR5-8133 CL46-52-52-130 with the ASRock B860M-STX motherboard and the Intel Core Ultra 9 285 desktop processor.

Advantech, a leader in embedded IoT computing solutions, is excited to introduce their AI-integrated desktop platform series: the Mini-ITX AIMB-2710 and Micro-ATX AIMB-589. These platforms are powered by Intel Core Ultra Processors (Series 2) S-Series, featuring the first desktop processor with an integrated NPU, delivering up to 36 TOPS for superior AI acceleration. Designed for data visualization and image analysis, both models offer PCIe Gen 5 support for high-performance GPU cards and feature 6400 MHz DDR5 memory, USB4 Type-C, multiple USB 3.2 Gen 2 and 2.5GbE LAN ports for fast and accurate data transmission in real time.

The AIMB-2710 and AIMB-589 excel in high-speed computing and AI-driven performance, making them ideal for applications such as medical imaging, automated optical inspection, and semiconductor testing. Backed by comprehensive software support, these platforms are engineered for the next wave of AI innovation.

PNY today announced the specifications and availability of its high-performance DDR5 notebook memory, offered in 64 GB (2x32GB) and 32 GB (2x16GB) kits. Designed for tech enthusiasts, creators, and gamers who demand unrivaled performance, premium quality, and blazing-fast speeds, this new memory module harnesses the power of DDR5, runs at 5600 MHz, and features a CAS latency of 46.

Next Generation Technology
PNY Performance DDR5 is built to support the growing lineup of motherboards compatible with the new DDR5 memory standard. This cutting-edge technology introduces a host of new features previously unavailable or limited in earlier generations of notebook memory. DDR5 enables higher-density modules, with capacities up to four times greater per module than DDR4 and supports faster standard frequencies. PNY's Performance DDR5 memory offers speeds of 5600 MHz for outstanding performance and is available in 64 GB (2x32GB) and 32 GB (2x16GB) kits.

Micron at the 2025 International CES showed us product that hint at the company planning a strong comeback to the client and PC-DIY market segments. The company's Crucial brand is already a high-volume player in the client segment, but the company never really approached the enthusiast segment. Products like the company's new T705 Pro and P510 NVMe SSDs, and DDR5 Pro Overclocking memory, seek to change this. We begin our tour with PC memory, and the DDR5 Pro OC CUDIMMs. Crucial has jumped onto the CKD bandwagon, introducing memory modules and kits that come with DDR5-6400 out of the box, but which are geared for manual overclocking to take advantage of the 1β DRAM chips underneath (hence the name).

The company also showed us their first DDR5 CSODIMM suitable for the next generation of notebooks with HX-segment processors. This module comes with a CKD and a DDR5-6400 JEDEC-standard SPD profile out of the box. Lastly, there's the Micron-branded LPCAMM2, which comes in speeds of up to LPDDR5X-8533, and is suitable for the next generation of ultraportables.

Biwin, a PC memory, SSD, and flash storage product licensee for top-tier PC brands, launched its consumer brand in December 2024. Here at CES 2025, the TechPowerUp team headed over to Biwin's booth to check out up close the entire lineup of products ranging from SSDs in all shapes and sizes, and DRAM modules to memory cards, and card readers. The products on display were available on Amazon Japan in December 2024, followed by Amazon UK this January, and at the start of 2025, they will be available in Taiwan, APAC, Mexico, Latin America, and the Indian market.

Biwin showcased Black Opal premium SSDs and DRAM modules such as the Biwin Black Opal X570 PRO PCIe Gen 5x 4 NVMe 2.0 SSD capable of reaching read speeds of up to 14,000 MB/s. The Black Opal DW100 RGB DDR5 CUDIMM series stands out with 9200 MT/s and a CAS latency of CL42, a product tailored for professionals and enthusiasts. For mainstream users, Biwin presented SSDs, DRR5 memory modules, memory cards, card readers, and USB flash drives.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

Today marks the launch of the new ASUS Vivobook Pro 15 (N6506CU), the latest version of this high-performance 15.6-inch laptop designed for pro creators and pro gamers.

ASUS Vivobook Pro 15 offers seamless creativity and gaming with cutting-edge components: up to the latest Intel Core Ultra 9 processor (Series 2) with a built-in 13 TOPS NPU, NVIDIA GeForce RTX 4050 GPU with a low-latency MUX switch, 24 GB DDR5 RAM, and a 2 TB PCIe SSD. It boasts advanced ASUS IceCool Pro cooling technology that enables up to a 125-watt combined thermal design power (TDP).

ASUS today announced the 2025 TUF Gaming laptop lineup, including the first 18-inch member of the family. Featuring the latest processors from AMD, Intel, and NVIDIA, the TUF Gaming A16, F16, and A18 aim to deliver incredible performance without breaking the bank.

The first TUF Gaming 18-inch laptop
The TUF Gaming Alliance is proud to introduce the A18, the first 18-inch laptop in the TUF Gaming lineup. Equipped with up to an AMD Ryzen 7 260 processor and an NVIDIA GeForce RTX 5070 Laptop GPU, the TUF Gaming A18 can easily handle the latest games. Also featuring up to 32 GB of DDR5 5600 MHz memory and up to 2 TB of PCIe Gen 4 storage, gamers can easily game, stream, and store their entire library. The A18 also boasts a gorgeous 2.5K resolution 240 Hz display, with an extra-tall 16:10 aspect ratio, 500 nits of peak brightness, and 100% coverage of the DCI-P3 colors space for incredibly immersive gameplay.

Micron Technology, Inc., today announced expansions across its Crucial consumer memory and storage portfolio, including unveiling the high-speed Crucial P510 SSD, and expanding density and form factor options across its existing DRAM portfolio to enable broader choice and flexibility for consumers. The P510 features read and write speeds of up to 11,000/9,550 megabytes per second (MB/s), bringing blazing fast Gen 5 performance to the masses.

"With the exciting memory and storage offerings we're debuting today, Crucial's portfolio is now broader and stronger than ever before," said Dinesh Bahal, corporate vice president and general manager of Micron's Commercial Products Group. "These updates - from making fast Gen 5 SSDs available to the mainstream to launching high-density memory options - illustrate our commitment to driving innovation, performance and value for every consumer from casual gamers to creatives and students to hardcore enthusiasts."

Corsair today announced a bounty of new hardware for PC builders and content creators, ranging from new power supplies and cases to new storage and memory offerings. In addition to all-new hardware such as the XENEON EDGE 14.5" Touchscreen, EX400U USB4 External SSD, DOMINATOR TITANIUM Wave Accessory Kit, and Corsair Custom Lab memory, there are also updates to the distinguished RMe and HXi power supplies featuring boosted capabilities for next-gen GPUs. Finally, the revamped 5000T Series of mid-tower cases introduces support for reverse-connector motherboards, making them the perfect showcase for super-clean builds.

New hardware announcements:

• XENEON EDGE 14.5" LCD Touchscreen
• RMe Series (2025) Power Supplies
• 5000T Series Mid-Tower Cases
• HXi Series (2025) Power Supplies
• EX400U USB4 External SSD
• Corsair Custom Lab DRAM
• DOMINATOR TITANIUM Wave Accessory Kit

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.

Lenovo announced the latest additions to its Lenovo Legion ecosystem of gaming devices, accessories, and software today at CES 2025, delivering a deep bench of devices across a wide range of form-factors that give gamers of all levels powerful options to game their way in pursuit of 'reaching their impossible'. These new devices include:

• The Lenovo Legion Go S (8", 1) and Lenovo Legion Go S (8", 1) - Powered by SteamOS, gaming handheld devices featuring an 8-inch screen with VRR support, a chassis sporting fused TrueStrike controllers with adjustable trigger switches and hall-effect joysticks, and the world's first officially licensed handheld powered by SteamOS.
• The Lenovo Legion Go (8.8", 2), a gaming handheld prototype device planned to feature a native landscape OLED display, up to double the RAM compared to previous generation, and a bigger battery.
• The redesigned Lenovo Legion Pro 7i (16", 10), Lenovo Legion Pro 5i (16", 10) and Lenovo Legion Pro 5 (16", 10) laptops, with new aggressive design language, more performance, and new Lenovo PureSight OLED display options.
• A fully redesigned Legion Space gaming software solution that unifies all Lenovo Legion device settings, syncs with all Lenovo Legion ecosystem devices, provides access to all games in one library, and features a suite of new AI-powered features that help gamers up their game, their streams, and their enjoyment.
• The Lenovo Legion Pro 34WD-10 monitor, a PureSight OLED display with gaming-specific features to give competitive gamers an edge on the map.
• Lenovo also announced other new additions to its Legion and LOQ laptops and desktops, the latest Legion Tab, and a selection of Legion accessories to complement the gaming devices.

ASRock Industrial is proud to announce the launch of its highly anticipated NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series built to revolutionize AI-driven computing. Powered by Intel Core Ultra 200H processors (Arrow Lake-H), the series delivers up to 99 TOPS of AI inferencing power, offering cutting-edge performance in a compact form factor. Designed to meet the growing needs of industries such as AI-enhanced business operations, immersive content creation, and high-performance gaming, the NUC(S) Ultra 200 BOX Series is engineered to provide next-level computing power with Intel's latest performance hybrid architecture, Intel Arc GPU, and NPU.

These compact systems are built for users who demand powerful multitasking capabilities, from AI inferencing to media-rich applications and data processing. With its space-saving design and exceptional versatility, the NUC(S) Ultra 200 BOX Series ensures efficient, high-speed performance across a range of applications—redefining what's possible in modern computing.

ASRock Industrial unveils the 4X4 BOX AI300 Series, a compact powerhouse designed to redefine AI computing with AMD Ryzen AI 300 Series processors. Featuring the Ryzen AI 7 350 and Ryzen AI 5 340 processors, this series delivers up to 50 TOPS of NPU performance, supporting Copilot+ PC experiences and AI-enhanced multitasking. With up to 96 GB dual-channel DDR5 5600 MHz memory, quad display up to 8K, and versatile connectivity, including dual LAN ports, Wi-Fi 6E, five USB ports with two USB4, it combines exceptional AI performance with scalability and efficiency.

Equipped with Ryzen AI as its dedicated AI engine, the 4X4 BOX AI300 Series ensures responsive AI processing paving the way for next generation productivity. Living up to its slogan, "Tiny Box AI Rocks," the 4X4 BOX AI300 Series is engineered for AI PCs, gaming, content creation, tech enthusiasts, prosumers, and AIoT applications.

ASRock Industrial proudly unveils its newest range of industrial motherboards, powered by Intel Core Ultra 200S Processors (Arrow Lake-S) with Intel 800 series chipsets. Featuring an advanced hybrid architecture with up to 24 cores and an upgraded NPU, these motherboards empower exceptional edge performance, energy-efficiency, and enhanced AI acceleration for complex AI driven workloads. The new range of motherboards support up to DDR5 6400 MHz memory, offering versatile I/O, expansion options, quad display capabilities. Featuring PCIe Gen 5, and USB4/ Thunderbolt 4 for ultra-fast connectivity, select models offer 10G LAN to meet the demands of high-speed networking. With flexible form factors including Mini-ITX, Micro-ATX, and ATX, these motherboards cater to versatile edge AI applications across industrial automation, robotics, AI agents, kiosks, retail, gaming and beyond.

Mini-ITX Models (High Rise I/O): IMB-1246 and IMB-1247
Leveraging Intel Core Ultra 200S Processors, the IMB-1246 utilizes the H810 Chipset, while the IMB-1247 features the Q870 Chipset, offering enhanced scalability. Both models support up to 96 GB DDR5 memory via two CSO-DIMM (DDR5 6400 MHz) or SO-DIMM (DDR5 5600 MHz) slots. Offering various expansion capabilities and I/O tailored for diverse applications, including one PCIe x16 (Gen 5) and one USB4/ Thunderbolt 4. The IMB-1246 provides two USB 3.2 Gen 2, one USB 3.2 Gen 1, four USB 2.0, one M.2 Key E, one M.2 Key M, four COM ports, and two SATA 3 ports, while the IMB-1247 enhances connectivity with five USB 3.2 Gen 2, two USB 3.2 Gen 1, two USB 2.0, one M.2 Key B, one M.2 Key E, two M.2 Key M, four COM ports, and three SATA 3 ports. Networking feature offers one 2.5G LAN and one 1G LAN. Display support includes triple display output on the IMB-1246 with two HDMI 2.1 TMDS, one DP 2.1 (via Type-C), and one LVDS/eDP while the IMB-1247 supports quad display output, adding one DP 1.4a for greater flexibility.

At CES 2025, GIGABYTE unveiled an impressive lineup of motherboards designed for Intel and AMD platforms for gaming, content creation, and professional use, with support for the latest processors, PCIe 5.0, and Wi-Fi 7. GIGABYTE introduced several Z890 chipset motherboards for Intel's "Arrow Lake" Core Ultra 200S series. The flagship Z890 AORUS Master offers features like DDR5 memory overclocking, tool-free PCIe and M.2 installation, and Wi-Fi 7 connectivity. The compact Z890I AORUS Ultra targets Mini-ITX builds with its efficient 8+1+2 VRM solution and AI-enhanced BIOS profiles. Despite its small form factor, it delivers robust performance and thermal management. For those looking for aesthetics and reliability, the Z890 AORUS Elite WiFi 7 ICE impresses with a sleek white design, digital VRM capabilities, and simplified Wi-Fi EZ-Plug installation for improved connectivity. For more budget-friendly options, GIGABYTE showed B860M AORUS Elite WiFi6E ICE motherboard, too.