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ASUS Previews Intel's "Lunar Lake" Platform with ExpertBook P5 14-Inch Laptop

ASUS has revealed its upcoming ExpertBook P5 laptop, set to debut alongside Intel's highly anticipated "Lunar Lake" processors. This ultrabook aims to boost AI-capable laptop market, featuring an unspecified Intel Lunar Lake "Core Ultra 200V" CPU at its core. The ExpertBook P5 boasts impressive AI processing capabilities, with over 45 TOPS from its Neural Processing Unit and a combined 100+ TOPS when factoring in the CPU and GPU. The NPU provides efficient processing, with additional power coming from Lunar Lake's GPU with XMX cores, featuring the Xe2 Battlemage architecture. This is more than enough for the Copilot+ certification from Microsoft, making the laptop debut as an "AI PC." The ExpertBook P5 offers up to 32 GB of LPDDR5X memory running at 8333 MT/s, up to 3 TB of PCIe 4.0 SSD storage with two drives, and Wi-Fi 7 support.

The 14-inch anti-glare display features a 2.5K resolution and a smooth 144 Hz refresh rate, ensuring a premium visual experience. Despite its powerful internals, the ExpertBook P5 maintains a solid profile weighing just 1.3 kg. The laptop is housed in an all-metal military-grade aluminium body with a 180-degree lay-flat hinge, making it both portable and versatile. ASUS has also prioritized cooling efficiency with innovative technology that optimizes thermal management, whether the laptop is open or closed. Security hasn't been overlooked either, with the ExpertBook P5 featuring a robust security ecosystem, including Windows 11 secured-core PC framework, NIST-155-ready Commercial-Grade BIOS protection, and biometric login options. While an exact release date hasn't been confirmed, ASUS is preparing ExpertBook P5 and other Lunar Lake-powered laptops to hit the market in the second half of 2024.

AAEON MAXER-2100 Inference Server Integrates Both Intel CPU and NVIDIA GPU Tech

Leading provider of advanced AI solutions AAEON (Stock Code: 6579), has released the inaugural offering of its AI Inference Server product line, the MAXER-2100. The MAXER-2100 is a 2U Rackmount AI inference server powered by the Intel Core i9-13900 Processor, designed to meet high-performance computing needs.
The MAXER-2100 is also able to support both 12th and 13th Generation Intel Core LGA 1700 socket-type CPUs, up to 125 W, and features an integrated NVIDIA GeForce RTX 4080 SUPER GPU. While the product's default comes with the NVIDIA GeForce RTX 4080 SUPER, it is also compatible with and an NVIDIA-Certified Edge System for both the NVIDIA L4 Tensor Core and NVIDIA RTX 6000 Ada GPUs.

Given the MAXER-2100 is equipped with both a high-performance CPU and industry-leading GPU, a key feature highlighted by AAEON upon the product's launch is its capacity to execute complex AI algorithms and datasets, process multiple high-definition video streams simultaneously, and utilize machine learning to refine large language models (LLMs) and inferencing models.

AMD Ryzen 9 9900X Benchmarked in Geekbench 6, Beats Intel's Best in Single-Core Score

As AMD prepares to roll out its next-generation Ryzen 9000 series of CPUs based on Zen 5 architecture, we are starting to see some systems being tested by third-party OEMs and system integrators. Today, we have Geekbench 6 scores of the Ryzen 9 9900X CPU, and the 12-core, 24-thread processor that has demonstrated impressive performance gains. Boasting a base clock of 4.4 GHz and a boost clock of up to 5.6 GHz, the CPU features only 120 W TDP, a significant reduction from the previous 170 W of the previous generation. In Geekbench 6 tests, the Ryzen 9 9900X achieved a single-core score of 3,401 and a multicore score of 19,756.

These results place it ahead of Intel's current flagship Core i9-14900KS, which scored 3,189 points in single-core performance. Regarding multicore tasks, the i9-14900K scored 21,890 points, still higher than AMD's upcoming 12-core SKU. The benchmark of AMD's CPU was conducted on an ASUS ROG Crosshair X670E Gene motherboard with 32 GB of DDR5 memory. As anticipation builds for the official release, these early benchmarks suggest that AMD will deliver a compelling product that balances high performance with improved energy efficiency. The top tier models will still carry a 170 W TDP, while some high-end and middle-end SKUs get a TDP reduction like the Ryzen 7 9700X and Ryzen 5 9600X dial down to 65 W, decreased from 105 W in their previous iterations.

ASUS Republic of Gamers Launches First ROG NUC

ASUS Republic of Gamers today announced the launch of the ROG NUC gaming PC. The first-ever ROG NUC PC is packed with cutting-edge technology and performance for AAA gaming and more.

Gaming, redefined
Featuring Intel Core Ultra 9 or Intel Core Ultra 7 processors and NVIDIA GeForce RTX 4070 or 4060 discrete graphics, the ROG NUC PC is a compact powerhouse that delivers unmatched gaming experiences. The high-performance hybrid architecture of Intel Core Ultra processors provides gamers with the power needed to stream, edit, record and play without skipping a beat. The 2.5-liter chassis is designed for quick system access to make upgrades and cleaning easy. Plus, the compatible ROG Raikiri Pro controller can be used to deliver a console-like experience for gamers seeking uncompromised performance and flexibility in a compact form factor.

Lenovo Announces ThinkCenter Neo Ultra Compact Desktop, its Mac Studio Competitor

Lenovo announced the ThinkCenter Neo Ultra, a compact high-performance desktop meant for power users and creative professionals. This desktop is larger than what would qualify as a mini-PC, with its 3.6 L volume, but is significantly smaller than a tower. Despite its compact size, it comes with a full-featured I/O. The desktop is powered by Intel's 14th Gen Core vPro "Raptor Lake Refresh" platform, and uses a custom form-factor desktop motherboard based on Intel Q670 chipset that supports various commercial desktop features under vPro. The processor and memory are socketed and hence user upgradeable.

Processor options range from the Core i5-14500 (6P+8E), going all the way up to the Core i9-14900 (8P+16E), including vPro and regular SKUs; and energy-efficient "T" SKUs. Memory options range from 16 GB (1x 16 GB) up to 64 GB (2x 32 GB) DDR5-4800. The sole graphics option is an NVIDIA GeForce RTX 4060 desktop GPU, all four of its display connectors are directly wired out on the rear I/O. There are two M.2-2280 Gen 4 slots, storage options range from 1x 256 GB Gen 4, to 2x 1 TB Gen 4. Networking connectivity include 2.5 GbE and Wi-Fi 6E. USB ports include a 20 Gbps USB 3.2 Gen2x2 type-C on the front-panel, two 10 Gbps USB 3.2 Gen 2, and four additional USB 3.2 type-A ports at the back. The case measures 195 mm x 191 mm x 108 mm, and depending on the configuration, can weigh around 3.5 kg.

DDR5-6400 Confirmed as Sweetspot Speed of Ryzen 9000 "Zen 5" Desktop Processors

AMD's upcoming Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture will see a slight improvement in memory overclocking capabilities. A chiplet-based processor, just like the Ryzen 7000 "Raphael," "Granite Ridge" combines one or two "Zen 5" CCDs, each built on the TSMC 4 nm process, with a client I/O die (cIOD) built on the 6 nm node. The cIOD of "Granite Ridge" appears to be almost identical to that of "Raphael." This is the chiplet that contains the processor's DDR5 memory controllers.

As part of the update, Ryzen 9000 "Granite Ridge" should be able to run DDR5-6400 with a 1:1 ratio between the MCLK and FCLK domains. This is a slight increase from the DDR5-6000 sweetspot speed of Ryzen 7000 "Raphael" processors. AMD is reportedly making it possible for motherboard manufacturers and prebuilt OEMs to enable a 1:2 ratio, making it possible to run high memory speeds such as DDR5-8000, although performance returns with memory speeds would begin to diminish beyond the DDR5-6400 @ 1:1 setting. Memory manufacturers should launch a new wave of DDR5 memory kits with AMD EXPO profiles for DDR5-6400.

DRAM Prices Expected to Increase by 8-13% in Q3

TrendForce reports that a recovery in demand for general servers—coupled with an increased production share of HBM by DRAM suppliers—has led suppliers to maintain their stance on hiking prices. As a result, the ASP of DRAM in the third quarter is expected to continue rising, with an anticipated increase of 8-13%. The price of conventional DRAM is expected to rise by 5-10%, showing a slight contraction compared to the increase in the second quarter.

TrendForce notes that buyers were more conservative about restocking in the second, and inventory levels on both the supplier and buyer sides did not show significant changes. Looking ahead to the third quarter, there is still room for inventory replenishment for smartphones and CSPs, and the peak season for production is soon to commence. Consequently, it is expected that smartphones and servers will drive an increase in memory shipments in the third quarter.

Essencore KLEVV Announces the FIT V Line of DDR5 Memory

KLEVV, the premier consumer memory and storage brand introduced by Essencore, is excited to unveil the brand-new FIT V DDR5 gaming memory with a sleek, ultra-low-profile design. KLEVV's FIT V DDR5 gaming memory modules are available in 16 GB (16 GB x1) and 32 GB (16 GB x2) kits, with diverse clock speeds of 5600MT/s, 6000 MT/s, and 6400 MT/s. Meticulously crafted for gamers, content creators, and casual users on a budget, these modules offer cutting-edge features and top-tier performance at an attractive price. They boast a streamlined, ultra-low-profile 33 mm form factor, made possible by an innovative aluminium heat spreader with a contemporary minimalist aesthetic, finished in an eye-catching white hue. This design significantly boosts performance and enhances the visual appeal of any build.

The FIT V DDR5 gaming memory modules offer cutting-edge features at an attractive price. Superior KLEVV memory technology, including a built-in PMIC, ensures consistent performance with efficient power delivery and dependability. KLEVV's signature multilayer PCB design improves signal strength and robustness. The FIT V DDR5 modules also incorporate a precision thermal sensor for optimal performance calibration and on-die ECC for effective error correction, ensuring peak functionality and reliability. The FIT V DDR5 gaming memory readily supports Intel XMP 3.0 and AMD EXPO technology to extract maximum performance.

Kingston Intros FURY Renegade RGB Limited Edition DDR5 Memory

Kingston today formally launched the FURY Renegade RGB Limited Edition DDR5 memory kits. These were shown at the company's Computex 2024 booth earlier this month. The module's design involves a two-tone die-cast metal shroud over the aluminium heat-spreaders, which are crowned by silicone diffusers for the RGB LEDs. The modules have a 19-preset lighting controller. You control the lighting using the first-party FURY CTRL software. Kingston says that the design of these modules are inspired by race cars.

The Kingston FURY Renegade RGB Limited Edition is available in only one density—48 GB (2x 24 GB kit), and in only one speed variant, DDR5-8000, with timings of CL36-48-48, and DRAM voltage of 1.45 V. The module also includes profiles for DDR5-7200 and DDR5-6400, with tighter timings. The modules pack an Intel XMP 3.0 SPD profile that enables the advertised speeds on Intel platforms. Kingston has extensively tested the modules on the latest Intel platforms, such as the 14th Gen Core "Raptor Lake Refresh" for compatibility with the advertised XMP speeds. The company didn't reveal pricing.

SK hynix Showcases Its New AI Memory Solutions at HPE Discover 2024

SK hynix has returned to Las Vegas to showcase its leading AI memory solutions at HPE Discover 2024, Hewlett Packard Enterprise's (HPE) annual technology conference. Held from June 17-20, HPE Discover 2024 features a packed schedule with more than 150 live demonstrations, as well as technical sessions, exhibitions, and more. This year, attendees can also benefit from three new curated programs on edge computing and networking, hybrid cloud technology, and AI. Under the slogan "Memory, The Power of AI," SK hynix is displaying its latest memory solutions at the event including those supplied to HPE. The company is also taking advantage of the numerous networking opportunities to strengthen its relationship with the host company and its other partners.

The World's Leading Memory Solutions Driving AI
SK hynix's booth at HPE Discover 2024 consists of three product sections and a demonstration zone which showcase the unprecedented capabilities of its AI memory solutions. The first section features the company's groundbreaking memory solutions for AI, including HBM solutions. In particular, the industry-leading HBM3E has emerged as a core product to meet the growing demands of AI systems due to its exceptional processing speed, capacity, and heat dissipation. A key solution from the company's CXL lineup, CXL Memory Module-DDR5 (CMM-DDR5), is also on display in this section. In the AI era where high performance and capacity are vital, CMM-DDR5 has gained attention for its ability to expand system bandwidth by up to 50% and capacity by up to 100% compared to systems only equipped with DDR5 DRAM.

MAINGEAR Drops New ML-16 Gaming Laptops Packed with Desktop-Like Gaming Performance

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, today unveiled its all-new 16-inch ML-16 series of gaming laptops designed to deliver next-level productivity and gaming performance at home and on the go. Collaboratively engineered for impressive speed, seamless multitasking, and long-lasting battery life, ML-16 laptops from MAINGEAR are equipped with the all-new and highly efficient Intel Core Ultra 7 (155H) processor and NVIDIA GeForce RTX 4060 or 4070 Mobile GPUs.

The ML-16 series is built for gamers who demand peak performance and mobility without compromising on either. Equipped with the latest, premium mobile 28-watt processors from Intel and a powerful cooling system, ML-16 laptops ensure optimal reliability even with intense CPU loads, allowing gamers to push them hard without reaching their limits. With a large 80-Wh battery, the ML-16 offers hours of uninterrupted productivity. At the same time, a dedicated turbo mode allows users to select between three power modes, providing enhanced flexibility for different use scenarios.

MSI Announces New MAG Infinite E1 Gaming Destkop

MSI, the leading brand in gaming products, is proud to announce the launch of the MAG Infinite E1. Equipped with processors up to 14th Gen Intel processor and NVIDIA GeForce RTX 40 Series graphics card, the MAG Infinite E1 is designed to be the ultimate gaming companion, delivering unmatched functionality. Built with the iconic MAG spirit of durability and robust construction, the MAG Infinite E1 showcases a design that conveys a stable and endurance, appealing to gamers seeking both power and reliability.

The MAG Infinite E1 is powered by up to an Intel Core i7 processor, offering significant performance enhancements over its predecessor. When combined with the NVIDIA RTX 40 Series graphics card, the MAG Infinite E1 not only leaps in performance but also in AI-enhanced graphics capabilities. Gamers can immerse themselves in lifelike virtual environments with advanced ray tracing and enjoy ultra-high frame rates with minimal latency. Furthermore, the MAG Infinite E1 is equipped with state-of-the-art transmission capabilities including DDR5 memory and M.2 PCI-e SSD slots, ensuring peak performance and making it the ideal choice for gamers who demand the very best.

G.SKILL OC World Cup 2024 Grand Final: CENS Wins OC Champion Title

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is pleased to announce that CENS from Germany won the title of OC Champion in the 8th Annual OC World Cup 2024 overclocking competition. After a grueling day of extreme overclocking with liquid nitrogen cooling, using the latest Intel Core i9-14900KF processor and ASUS ROG Maximus Z790 Apex Encore motherboard, CENS is walking away with the grand cash prize of $10,000 USD!

After the first 3 days of exhausting extreme overclocking in the Live Qualifier Stage of the OC World Cup 2024, biso biso, CENS, and Seby qualified for the Grand Final Stage on June 7. The Grand Final round is comprised of a maximum memory frequency challenge and 3 benchmarks with CPU speed fixed at a maximum of 7 GHz, demonstrating the incredible capability of the latest 14th Gen Intel Core processors and the extraordinary overclock skills of each OC World Cup 2024 Grand Final contestant.

Thermaltake's Booth at Computex 2024 is Packed with New Products

We don't believe we're mistaken in saying that the Thermaltake booth at this year's Computex was among the largest and most crowded, both in terms of products and visitors. Among the products that left a strong impression, we'd like to highlight The Tower 600, 250 Mini, TR-100 Mini-ITX case series, and the extensive range of coolers and accessories. It's difficult to determine the most successful Thermaltake product from Computex 2024, but surely each of us can find at least one that resonates with our preferences.

We conclude our visit to Thermaltake's Computex booth by presenting other novelties from the Thermaltake stand, cases, AIO coolers and air coolers, DDR5 memories and various accessories.

SK hynix Showcases Its Next-Gen Solutions at Computex 2024

SK hynix presented its leading AI memory solutions at COMPUTEX Taipei 2024 from June 4-7. As one of Asia's premier IT shows, COMPUTEX Taipei 2024 welcomed around 1,500 global participants including tech companies, venture capitalists, and accelerators under the theme "Connecting AI". Making its debut at the event, SK hynix underlined its position as a first mover and leading AI memory provider through its lineup of next-generation products.

"Connecting AI" With the Industry's Finest AI Memory Solutions
Themed "Memory, The Power of AI," SK hynix's booth featured its advanced AI server solutions, groundbreaking technologies for on-device AI PCs, and outstanding consumer SSD products. HBM3E, the fifth generation of HBM1, was among the AI server solutions on display. Offering industry-leading data processing speeds of 1.18 terabytes (TB) per second, vast capacity, and advanced heat dissipation capability, HBM3E is optimized to meet the requirements of AI servers and other applications. Another technology which has become crucial for AI servers is CXL as it can increase system bandwidth and processing capacity. SK hynix highlighted the strength of its CXL portfolio by presenting its CXL Memory Module-DDR5 (CMM-DDR5), which significantly expands system bandwidth and capacity compared to systems only equipped with DDR5. Other AI server solutions on display included the server DRAM products DDR5 RDIMM and MCR DIMM. In particular, SK hynix showcased its tall 128-gigabyte (GB) MCR DIMM for the first time at an exhibition.

Neo Forza Shows LPCAMM2 Modules and 14 GB/s SSD at Computex 2024

At Computex 2024, Neo Forza showcased its latest innovations in memory and storage products. One of the standout products unveiled was the CUDIMM, a DDR5 memory module tailored for advanced computing applications. With capacity options ranging from 8 GB to 48 GB and a data rate of 6400 MT/s, the CUDIMM promises to deliver high bandwidth and low latency, making it an ideal choice for gaming rigs, servers, and workstations.

Another highlight was the Thoth 5 Series, a state-of-the-art solid-state drive (SSD) lineup that prioritizes exceptional performance. Available in various form factors and capacities up to 7.68 TB, these SSDs boast read/write bandwidths of up to 14,000/8,800 MB/s, along with impressive random read and write IOPS. Designed for data centers and enterprise environments, the Thoth 5 Series combines speed, reliability, and endurance.

Maxsun Puts the PCIe x16 Slot on the Back of its Latest B760 Mini-ITX Motherboard

We've seen a lot of motherboards with the power, SATA and USB connectors on the rear at Computex this year, but Chinese Maxsun decided to put the PCIe x16 slot on the back of its Mini-ITX MS-Terminator B760BKB D5 motherboard. This might seem like a crazy move, but with the right chassis, this means that the graphics card won't need a PCIe extension cable, while fitting in a compact chassis. It's also become increasingly hard to retain signal integrity over ribbon cables and with PCIe 5.0, it might be impossible. Another added benefit of this design is that the board also has a PCIe 3.0 x4 slot available for something like a 10 Gbps network card or just about anything else you'd want to plug into a compact PC.

The overall board specs don't really stick out from the crowd, as the Intel B760 chips is a somewhat limiting factor as well. In addition to the PCIe 5.0 x16 slot and the PCIe 3.0 x4 slot, the board also has a pair of PCIe 4.0 M.2 NVMe slots—one on each side of the PCB—and a slim SAS connector using an SFF-8654 connector. In addition to this, the board also has two DDR5 DIMM slots, four SATA ports, a 2.5 Gbps Ethernet port, a DP 1.2, an HDMI 2.0 port, a USB Type-C port of unknown speed and WiFi 6 and Bluetooth 5.2. The power design consists of a fairly basic 8+1+1 phase setup. We'd like to see this board design to become a standard, as it makes a lot of sense for the SFF market to allow for a better placement of the PCI x16 slot to allow for a more compact chassis without having to compromise on the choice of graphics card.

Mnemonic Electronic Debuts at COMPUTEX 2024, Embracing the Era of High-Capacity SSDs

On June 4th, COMPUTEX 2024 was successfully held at the Taipei Nangang Exhibition Center. Mnemonic Electronic Co., Ltd., the Taiwanese subsidiary of Longsys, showcased industry-leading high-capacity SSDs under the theme "Embracing the Era of High-Capacity SSDs." The products on display included the Mnemonic MS90 8TB SATA SSD, FORESEE ORCA 4836 series enterprise NVMe SSDs, FORESEE XP2300 PCIe Gen 4 SSDs, and rich product lines comprising embedded storage, memory modules, memory cards, and more. The company offers reliable industrial-grade, automotive-grade, and enterprise-grade storage products, providing high-capacity solutions for global users.

High-Capacity SSDs
For SSDs, Mnemonic Electronic presented products in various form factors and interfaces, including PCIe M.2, PCIe BGA, SATA M.2, and SATA 2.5-inch. The Mnemonic MS90 8 TB SATA SSD supports the SATA interface with a speed of up to 6 Gb/s (Gen 3) and is backward compatible with Gen 1 and Gen 2. It also supports various SATA low-power states (Partial/Sleep/Device Sleep) and can be used for nearline HDD replacement, surveillance, and high-speed rail systems.

Team Group T-Force Xtreem DDR5 Memory Now in Pink

Team Group at the 2024 Computex showcased its flagship gaming and overclocking memory kit, the T-Force Xtreem DDR5 series. The cooling solution features a heavy aluminium heat-spreader, with a diamond-cut T-Force logo. Besides the usual black and white colors, at Computex Team Group unveiled a pink version of its T-Force Xtreme. This DDR5 memory kit comes in capacities of 1x 16 GB, 2x 16 GB, 2x 24 GB, 2x 32 GB, and 2x 48 GB; and speeds ranging between DDR5-6400 to DDR5-7600.

Patriot Shows 14 GB/s PCIe 5.0 NVMe SSD and 11,500 MT/s DDR5 Memory at Computex 2024

At Computex 2024, we paid a visit to the Patriot booth and found a few new product announcements from the company. From record-shattering DDR5 memory speeds to next-generation Gen 5 SSDs, the company has prepared it all. Headlining the showcase is the Viper Xtreme 5 DDR5 memory series, achieving regular speeds of up to 8,200 MT/s and an astonishing 11,500 MT/s when overclocked. Patriot is also launching something for professional workstations with its overclockable ECC RDIMM modules, offering error correction, larger capacities, and the ability to exceed industry specifications through overclocking.

Next-Gen Computing: MiTAC and TYAN Launch Intel Xeon 6 Processor-Based Servers for AI, HPC, Cloud, and Enterprise Workloads at COMPUTEX 2024

The subsidiary of MiTAC Holdings Corp, MiTAC Computing Technology and its server brand TYAN, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today's AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel Xeon 6 processor and 4th and 5th Gen Intel Xeon Scalable processors, these solutions deliver cutting-edge performance.

"For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel's latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership," said Rick Hwang, President of MiTAC Computing Technology Corporation.

ADATA XPG Showcase its Advanced Cooling Solutions for DRAM and SSDs

Project XPG NeonStorm PCIe Gen 5 SSD, which won an award at Computex, has a dual active cooling system with an aluminium air duct, liquid cooling, and dual fans. This increases the Gen 5 SSD's cooling efficiency by 10%. The Legend 970 Pro PCIe Gen 5 SSD has read/write speeds up to 14,000/12,000 MB/s, using an aluminium heatsink and a micro fan for better heat dissipation.

The XPG Lancer Neon RGB DDR5 memory module uses a heat dissipating coating on the PCB, a heatsink made of 50% recycled materials, and an eco-friendly manufacturing process. It's the first eco-friendly RGB memory module, performing up to 8,000 MT/s with 16 GB and 24 GB capacities.

Biwin Brings New PC Memory and Flash Storage Lineup Under its Own Brand to Computex

Biwin is a licensee of SSDs, PC memory, and flash storage products for some for the biggest PC brands out there, including Acer and HP. This year, the company decided to launch a whole product stack under its own brand, so it could sell to the retail channel directly. We also spotted several licensed products under the coveted Acer Predator brand. Let's start our tour with them: the company showed us an Acer Predator Hera memory kit with 48 GB (2x 24 GB), which does an impressive DDR5-8000, at 40-48-48-128, and 1.35 V. The kit includes a DDR5-8000 @ 1.35 V XMP. The module features a mirror-finish metal heat spreader, and an RGB illuminated top. There are also 32 GB (2x 16 GB) kits in the series that go up to DDR5-8200.

Biwin's own first-party brand isn't too far behind the Predator Hera, the company showed us the Biwin (Editor's note: Wookong is local for Asia and will not be part of international branding) DW100 RGB, a high-end memory series, with kit capacities ranging from 32 GB (2x 16 GB) to 64 GB (2x 32 GB), speeds ranging from DDR5-6000 to DDR5-8200, and vDIMM going up to 1.45 V on the top-spec kit. There's also the DX100, which trades a little bit of performance for a more elaborate RGB LED setup. It comes in capacities up to 64 GB (2x 32 GB), and speeds of up to DDR5-8000. The HX100 is the mid-range kit, it lacks any lighting, capacities range up to 64 GB, and speeds of up to DDR5-7200. The timings aren't as tight as the ones on the DX100. Biwin also has a DDR5 LPCAMM2, with capacities of up to 64 GB, and speeds of up to 9600 MT/s. Most of Biwin's DRAM products launch in July 2024.

GeIL Presents a Wide Range of Memories at Computex: CAMM2 / LPCAMM2, Alongside Many DDR5s

GeIL booth was packed with all kinds of memories, anyone could find something for their taste, but our eyes gazed in hope at a few (yet) CAMM2 / LPCAMM2 memory samples. GeIL says that those are capable of supporting data transfer rates up to 8533 MT/s with up to 128 GB capacity. Just next to those a myriad of DDR5 with up to 8400 MT/s and RGB features were trying to catch attention. TUF Gaming Alliance, Orion V RGB (with integrated power management on the DIMM), the EVO V series with active dual fan cooling system, or Polaris family to which GeIL feels the need to mention that it fits most CPU coolers without mechanical interference.
More pictures follow.

GIGABYTE Debuts "AI TOP" Line of Motherboards and GPUs Designed for Local AI Development

During Computex 2024, GIGABYTE unveiled its new "AI TOP" series designed to empower users to develop and run AI applications locally on their systems. The AI TOP lineup includes AI-optimized motherboards, graphics cards, and complete system solutions. The flagship motherboard is called TRX50 AI TOP, which boasts support for AMD's Ryzen Threadripper 7000 PRO and a regular series of CPUs. The flagship TRX50 AI TOP motherboard features a special VRM design with beefy heatsinks, four PCIe 5.0 x16 slots for quad-GPU setup, eight-channel DDR5 memory with room for eight DIMMs, and a few M.2 PCIe Gen 5 slots. Next in the AI TOP line is the GIGABYTE GeForce RTX 4070 Ti SUPER AI TOP edition. Formed as a blower-style cooler, the RTX 4070 Ti SUPER AI TOP is envisioned for tight spaces and parallel installation with other GPUs to accelerate local AI development and inference.

Supposedly, there will be more AI TOP motherboards and GPUs than what is showcased. GIGABYTE may have an AI TOP makeover for Intel's upcoming Z890 AORUS Xtreme, and there could be more GPUs in the future with the blower-style AI TOP design. The goal of AI TOP series is optimization for AI workloads, which require lots of GPUs and lots of memory, like the TRX50 AI TOP motherboard shows.
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