SK hynix presented its leading AI memory solutions at COMPUTEX Taipei 2024 from June 4-7. As one of Asia's premier IT shows, COMPUTEX Taipei 2024 welcomed around 1,500 global participants including tech companies, venture capitalists, and accelerators under the theme "Connecting AI". Making its debut at the event, SK hynix underlined its position as a first mover and leading AI memory provider through its lineup of next-generation products.

"Connecting AI" With the Industry's Finest AI Memory Solutions
Themed "Memory, The Power of AI," SK hynix's booth featured its advanced AI server solutions, groundbreaking technologies for on-device AI PCs, and outstanding consumer SSD products. HBM3E, the fifth generation of HBM1, was among the AI server solutions on display. Offering industry-leading data processing speeds of 1.18 terabytes (TB) per second, vast capacity, and advanced heat dissipation capability, HBM3E is optimized to meet the requirements of AI servers and other applications. Another technology which has become crucial for AI servers is CXL as it can increase system bandwidth and processing capacity. SK hynix highlighted the strength of its CXL portfolio by presenting its CXL Memory Module-DDR5 (CMM-DDR5), which significantly expands system bandwidth and capacity compared to systems only equipped with DDR5. Other AI server solutions on display included the server DRAM products DDR5 RDIMM and MCR DIMM. In particular, SK hynix showcased its tall 128-gigabyte (GB) MCR DIMM for the first time at an exhibition.

At Computex 2024, Neo Forza showcased its latest innovations in memory and storage products. One of the standout products unveiled was the CUDIMM, a DDR5 memory module tailored for advanced computing applications. With capacity options ranging from 8 GB to 48 GB and a data rate of 6400 MT/s, the CUDIMM promises to deliver high bandwidth and low latency, making it an ideal choice for gaming rigs, servers, and workstations.

Another highlight was the Thoth 5 Series, a state-of-the-art solid-state drive (SSD) lineup that prioritizes exceptional performance. Available in various form factors and capacities up to 7.68 TB, these SSDs boast read/write bandwidths of up to 14,000/8,800 MB/s, along with impressive random read and write IOPS. Designed for data centers and enterprise environments, the Thoth 5 Series combines speed, reliability, and endurance.

We've seen a lot of motherboards with the power, SATA and USB connectors on the rear at Computex this year, but Chinese Maxsun decided to put the PCIe x16 slot on the back of its Mini-ITX MS-Terminator B760BKB D5 motherboard. This might seem like a crazy move, but with the right chassis, this means that the graphics card won't need a PCIe extension cable, while fitting in a compact chassis. It's also become increasingly hard to retain signal integrity over ribbon cables and with PCIe 5.0, it might be impossible. Another added benefit of this design is that the board also has a PCIe 3.0 x4 slot available for something like a 10 Gbps network card or just about anything else you'd want to plug into a compact PC.

The overall board specs don't really stick out from the crowd, as the Intel B760 chips is a somewhat limiting factor as well. In addition to the PCIe 5.0 x16 slot and the PCIe 3.0 x4 slot, the board also has a pair of PCIe 4.0 M.2 NVMe slots—one on each side of the PCB—and a slim SAS connector using an SFF-8654 connector. In addition to this, the board also has two DDR5 DIMM slots, four SATA ports, a 2.5 Gbps Ethernet port, a DP 1.2, an HDMI 2.0 port, a USB Type-C port of unknown speed and WiFi 6 and Bluetooth 5.2. The power design consists of a fairly basic 8+1+1 phase setup. We'd like to see this board design to become a standard, as it makes a lot of sense for the SFF market to allow for a better placement of the PCI x16 slot to allow for a more compact chassis without having to compromise on the choice of graphics card.

On June 4th, COMPUTEX 2024 was successfully held at the Taipei Nangang Exhibition Center. Mnemonic Electronic Co., Ltd., the Taiwanese subsidiary of Longsys, showcased industry-leading high-capacity SSDs under the theme "Embracing the Era of High-Capacity SSDs." The products on display included the Mnemonic MS90 8TB SATA SSD, FORESEE ORCA 4836 series enterprise NVMe SSDs, FORESEE XP2300 PCIe Gen 4 SSDs, and rich product lines comprising embedded storage, memory modules, memory cards, and more. The company offers reliable industrial-grade, automotive-grade, and enterprise-grade storage products, providing high-capacity solutions for global users.

High-Capacity SSDs
For SSDs, Mnemonic Electronic presented products in various form factors and interfaces, including PCIe M.2, PCIe BGA, SATA M.2, and SATA 2.5-inch. The Mnemonic MS90 8 TB SATA SSD supports the SATA interface with a speed of up to 6 Gb/s (Gen 3) and is backward compatible with Gen 1 and Gen 2. It also supports various SATA low-power states (Partial/Sleep/Device Sleep) and can be used for nearline HDD replacement, surveillance, and high-speed rail systems.

Team Group at the 2024 Computex showcased its flagship gaming and overclocking memory kit, the T-Force Xtreem DDR5 series. The cooling solution features a heavy aluminium heat-spreader, with a diamond-cut T-Force logo. Besides the usual black and white colors, at Computex Team Group unveiled a pink version of its T-Force Xtreme. This DDR5 memory kit comes in capacities of 1x 16 GB, 2x 16 GB, 2x 24 GB, 2x 32 GB, and 2x 48 GB; and speeds ranging between DDR5-6400 to DDR5-7600.

At Computex 2024, we paid a visit to the Patriot booth and found a few new product announcements from the company. From record-shattering DDR5 memory speeds to next-generation Gen 5 SSDs, the company has prepared it all. Headlining the showcase is the Viper Xtreme 5 DDR5 memory series, achieving regular speeds of up to 8,200 MT/s and an astonishing 11,500 MT/s when overclocked. Patriot is also launching something for professional workstations with its overclockable ECC RDIMM modules, offering error correction, larger capacities, and the ability to exceed industry specifications through overclocking.

The subsidiary of MiTAC Holdings Corp, MiTAC Computing Technology and its server brand TYAN, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today's AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel Xeon 6 processor and 4th and 5th Gen Intel Xeon Scalable processors, these solutions deliver cutting-edge performance.

"For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel's latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership," said Rick Hwang, President of MiTAC Computing Technology Corporation.

Project XPG NeonStorm PCIe Gen 5 SSD, which won an award at Computex, has a dual active cooling system with an aluminium air duct, liquid cooling, and dual fans. This increases the Gen 5 SSD's cooling efficiency by 10%. The Legend 970 Pro PCIe Gen 5 SSD has read/write speeds up to 14,000/12,000 MB/s, using an aluminium heatsink and a micro fan for better heat dissipation.

The XPG Lancer Neon RGB DDR5 memory module uses a heat dissipating coating on the PCB, a heatsink made of 50% recycled materials, and an eco-friendly manufacturing process. It's the first eco-friendly RGB memory module, performing up to 8,000 MT/s with 16 GB and 24 GB capacities.

Biwin is a licensee of SSDs, PC memory, and flash storage products for some for the biggest PC brands out there, including Acer and HP. This year, the company decided to launch a whole product stack under its own brand, so it could sell to the retail channel directly. We also spotted several licensed products under the coveted Acer Predator brand. Let's start our tour with them: the company showed us an Acer Predator Hera memory kit with 48 GB (2x 24 GB), which does an impressive DDR5-8000, at 40-48-48-128, and 1.35 V. The kit includes a DDR5-8000 @ 1.35 V XMP. The module features a mirror-finish metal heat spreader, and an RGB illuminated top. There are also 32 GB (2x 16 GB) kits in the series that go up to DDR5-8200.

Biwin's own first-party brand isn't too far behind the Predator Hera, the company showed us the Biwin (Editor's note: Wookong is local for Asia and will not be part of international branding) DW100 RGB, a high-end memory series, with kit capacities ranging from 32 GB (2x 16 GB) to 64 GB (2x 32 GB), speeds ranging from DDR5-6000 to DDR5-8200, and vDIMM going up to 1.45 V on the top-spec kit. There's also the DX100, which trades a little bit of performance for a more elaborate RGB LED setup. It comes in capacities up to 64 GB (2x 32 GB), and speeds of up to DDR5-8000. The HX100 is the mid-range kit, it lacks any lighting, capacities range up to 64 GB, and speeds of up to DDR5-7200. The timings aren't as tight as the ones on the DX100. Biwin also has a DDR5 LPCAMM2, with capacities of up to 64 GB, and speeds of up to 9600 MT/s. Most of Biwin's DRAM products launch in July 2024.

GeIL booth was packed with all kinds of memories, anyone could find something for their taste, but our eyes gazed in hope at a few (yet) CAMM2 / LPCAMM2 memory samples. GeIL says that those are capable of supporting data transfer rates up to 8533 MT/s with up to 128 GB capacity. Just next to those a myriad of DDR5 with up to 8400 MT/s and RGB features were trying to catch attention. TUF Gaming Alliance, Orion V RGB (with integrated power management on the DIMM), the EVO V series with active dual fan cooling system, or Polaris family to which GeIL feels the need to mention that it fits most CPU coolers without mechanical interference.More pictures follow.

During Computex 2024, GIGABYTE unveiled its new "AI TOP" series designed to empower users to develop and run AI applications locally on their systems. The AI TOP lineup includes AI-optimized motherboards, graphics cards, and complete system solutions. The flagship motherboard is called TRX50 AI TOP, which boasts support for AMD's Ryzen Threadripper 7000 PRO and a regular series of CPUs. The flagship TRX50 AI TOP motherboard features a special VRM design with beefy heatsinks, four PCIe 5.0 x16 slots for quad-GPU setup, eight-channel DDR5 memory with room for eight DIMMs, and a few M.2 PCIe Gen 5 slots. Next in the AI TOP line is the GIGABYTE GeForce RTX 4070 Ti SUPER AI TOP edition. Formed as a blower-style cooler, the RTX 4070 Ti SUPER AI TOP is envisioned for tight spaces and parallel installation with other GPUs to accelerate local AI development and inference.

Supposedly, there will be more AI TOP motherboards and GPUs than what is showcased. GIGABYTE may have an AI TOP makeover for Intel's upcoming Z890 AORUS Xtreme, and there could be more GPUs in the future with the blower-style AI TOP design. The goal of AI TOP series is optimization for AI workloads, which require lots of GPUs and lots of memory, like the TRX50 AI TOP motherboard shows.

GIGABYTE in its Computex 2027 booth showcased a huge lineup of next-generation Socket LGA1851 motherboards based on the top Intel Z890 chipset, which are ready for Intel's Core Ultra "Arrow Lake-S" desktop processors. GIGABYTE has taped out the motherboard model names, so all mentions of Z890 in this article are based on our assumption that it's the name of the next-gen Intel chipset. These chips are expected to bring generational IPC increases from their "Lion Cove" P-cores, "Skymont" E-cores, a more complete PCIe Gen 5 I/O (including for the CPU-attached NVMe slots), and other innovations. If the socket looks similar to the LGA1700, it's because it's identical in physical dimensions, and you can use your LGA1700 cooler on the LGA1851, but the processors are not inter-compatible. The company also showcased a few AMD Socket AM5 motherboards based on the new AMD X870E chipset.

The first motherboard to catch our eye is the Z890 AORUS Tachyon. This board is geared for record-seeking CPU overclocking. The processor is wired to just two DDR5 memory slots (1 DIMM per channel, the best configuration for memory OC); and the CPU-attached NVMe slots being close to the socket, with a combined heatsink. The only expansion slots are a PCI-Express 5.0 x16, and what could be a Gen 4 x8. There are plenty of overclocker-friendly controls, voltage measurement points, diagnostic LEDs, and status displays, scattered all over the board.

GeIL will feature at Computex 2024 the EVO V series and TUF GAMING ALLIANCE MEMORY with an Active Dual Fan Cooling System, ensuring optimal stability and performance. GeIL enhances memory stability and reliability with CKD (Client Clock Driver) chips in CUDIMM and CSODIMM products. The CAMM2 and LPCAMM2 modules offer faster speeds and larger capacities for next-gen compact devices, ideal for AI PCs and server applications requiring high capacity and quick access.

GeIL TUF GAMING ALLIANCE MEMORY
In addition to the well-known EVO V series, GeIL TUF GAMING ALLIANCE MEMORY includes the Active Dual Fan Cooling System design, which greatly helps heat dissipation. The enhanced cooling efficiency ensures optimal stability and performance under the most demanding conditions. To provide users with a variety of product options, GeIL TUF GAMING ALLIANCE MEMORY also offers an RGB SKU without fans. Both models will be demonstrated at GeIL's booth at Computex 2024.

GeIL - Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers, today announces a new specification: DDR5-9000 CL40-54-54-112 32 GB (2 x 16 GB) optimized for AMD Ryzen 8000G series processors, providing the ultimate system performance for AMD enthusiasts.

Blazing Speed at DDR5-9000 CL40 1.45 V
With the blazing speed of DDR5 9000 MT/s, users can expect more responsive performance in the most demanding applications and games. The impressive specification of DDR5-9000 16 GB x 2 CL40-54-54-112 at 1.45 V is validated with AMD Ryzen 8000G series processors and the ASUS ROG CROSSHAIR X670E GENE motherboard, as shown in the screenshots below.

ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation at InfoComm 2024, Las Vegas Convention Center, NV. Exhibits June 12-14, 2024, at Booth #C8942. ECSIPC will be showcasing the latest LIVA mini PCs and fanless box PC for vertical market applications including digital signage, and a new motherboard for industrial and commercial use. ECSIPC is demonstrating its new LIVA X3A ARM-based digital signage player integrated with ContentSync exclusive software for flexible digital signage including for retail stores, shopping malls, restaurants, banks, hotels, and airports.

The LIVA X3A features the Rockchip RK3588 processor, 8 GB LPDDR5 memory and 64 GB eMMC storage plus four HDMI ports to provide three video outputs up to 4K UHD and one HD video output simultaneously. ContentSync provides users with intuitive operations including splicing mode to merge screens for captivating dynamic displays and customized scheduling.

ASUS today introduced the NUC 14 Performance, which as its name suggests, is geared for performance. This is essentially a twin of the ROG NUC, but without the flashy ROG styling, and a broader range of hardware options. The top-spec NUC 14 Performance combines an Intel Core Ultra 9 185H "Meteor Lake" processor, and NVIDIA GeForce RTX 4070 desktop GPU, however other processor and graphics options include the Core Ultra 7 155H processor, and RTX 4060 desktop GPU. You can't opt out of a discrete GPU, for that you'll need to opt for the NUC 14 Pro+, which only packs a Core Ultra 185H, and presents its Arc iGPU, but the I/O of that NUC will be significantly different.

Back to the ASUS NUC 14 Performance, and the box measures 270 mm X 180 mm X 50 mm (WxDxH), weighing just 800 g. You're supposed to add your own memory and storage, the NUC features two DDR5 SO-DIMM slots supporting up to 64 GB of DDR5 memory; and an M.2-2280 slot with PCIe Gen 4 x4 wiring. Network connectivity includes Wi-Fi 6E + Bluetooth 5.3; 2.5 GbE wired LAN. The main high-bandwidth I/O connection is Thunderbolt 4 (40 Gbps), which doubles up as USB4 40 Gbps, with a USB-C port that also supports DisplayPort 1.4 passthrough from the discrete GPU; a couple of 10 Gbps USB 3.2 Gen 2 ports, USB 2.0 ports for input devices, additional DP 1.4 ports from the GPU, and an HDMI 2.1. The NUC 14 Performance comes with a 330 W power brick. The company didn't reveal pricing, but pricing is expected in the USD $2,200 to $2,500 range.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the highly anticipated Trident Z5 Royal series of high-performance overclock DDR5 memory. Featuring a mirrored-finish heat spreader in gold or silver color and a full-length crystalline light bar, the Trident Z5 Royal is the embodiment of high-class luxury of the flagship Trident Z5 product family.

Trident Z5 Royal marks the return of the popular luxury-class design to the new generation of DDR5 memory under the Trident Z5 design, inheriting from its DDR4 predecessor the lustrous mirrored-finish heat spreader in gold or silver color and a crystalline light bar design for a magnificent display of RGB lighting. Each heat spreader is CNC-cut from aluminium and electroplated for a stunning design befitting its Royal name.

TerraMaster, a professional brand focused on providing innovative storage products for homes and businesses, recently introduced the F2-424, a new upgrade of F2-423. The brand-new F2-424 adopts the Intel Celeron N95 4-core 4-thread processor, 8GB DDR5 memory, two 2.5GB network ports, two M.2 NVMe sockets, and adds a USB Type-C host interface and a USB Type A interface, achieving a 40% improvement in overall performance compared to the previous generation.

The F2-424 will come with the new generation TOS 5.1 operating system and can be smoothly upgraded to the TerraMaster TOS 6 operating system in the nearly future. With its robust features and state-of-the-art technology, the F2-424 NAS redefines data storage and management for both personal and business users.

Yesterday we reported on DDR6 memory hitting new heights of performance and it looks like LPDDR6 will follow suit, at least based on details in a JEDEC presentation. LPDDR6 will just like LPDDR5 be available as solder down memory, but it will also be available in a new LPCAMM2 module. The bus speed of LPDDR5 on LPCAMM2 modules is expected to peak at 9.2 GT/s based on JEDEC specifications, but LPDDR6 will extend this to 14.4 GT/s or roughly a 50 percent increase. However, today the fastest and only LPCAMM2 modules on the retail market which are using LPDDR5X, comes in at 7.5 GT/s, which suggests that launch speeds of LPDDR6 will end up being quite far from the peak speeds.

There will be some other interesting changes to LPDDR6 CAMM2 modules as there will be a move from 128-bit per module to 192-bit per module and each channel will go from 32-bits to 48-bits. Part of the reason for this is that LPDDR6 is moving to a 24-bit channel width, consisting of two 12-bit sub channels, as mentioned in yesterday's news post. This might seem odd at first, but in reality is fairly simple, LPDDR6 will have native ECC (Error Correction Code) or EDC (Error Detection Code) support, but it's currently not entirely clear how this will be implemented on a system level. JEDEC is also looking at developing a screwless solution for the CAMM2 and LPCAMM2 memory modules, but at the moment there's no clear solution in sight. We might also get to see LPDDR6 via LPCAMM2 modules on the desktop, although the presentation only mentions CAMM2 for the desktop, something we've already seen that MSI is working on.

The CAMM2 and LPCAMM2 form-factors were originally designed for thin-and-light notebooks, to provide them with memory replacements/upgrades without compromising on the Z-Height tolerances of the device's design. It looks like MSI sees a future for the CAMM2 form-factor on desktops, specifically the ones without cables sticking out. The company's next round of motherboards under its Project Zero banner will replace the conventional DDR5 DIMM slots with DDR5 CAMM2 slots. The company is joining forces with Kingston Technology for the effort.

Kingston is readying a new line of performance-segment CAMM2 modules under its FURY Impact brand that it originally uses for performance SO-DIMMs meant for gaming notebooks. MSI's next-gen Project Zero motherboard features contact points for a DDR5 CAMM2 module. A single CAMM2 module utilizes the entire 160-bit memory bus width of the Socket LGA1700 processor (that's both channels and their sub-channels). Kingston may release CAMM2 modules for most common memory sizes (such as 32 GB, 48 GB, 64 GB, and 96 GB), and most common DDR5 OC speeds for the platform (ranging between DDR5-6000 and DDR5-8000).

G.Skill is giving finishing touches to its new line of flagship overclocking PC DDR5 memory series, the Trident Z5 Royal. The series first broke cover in Computex 2023, but the company never got around to launching actual products. It's last Royal-branded memory series that made it to mass-production was the Trident Z Royal Elite DDR4 series from 2021. The company was probably dragging its feet with the Trident Z5 Royal series because by mid-2023, memory speeds in excess of 8000 MT/s weren't as popular as they are today, among the enthusiast crowd. The G.Skill Trident Z5 Royal series memory module comes in two trims, gold and silver. Both have the same geometric design, and are crowned by an acrylic lighting diffuser that resembles a cluster of gemstones. The series will probably consist of memory kits that are both high-capacity (48 GB, 64 GB, 96 GB); and high speed (DDR5-8000 and upward). The company will probably launch these next month. We'll be sure to swing by the G.Skill booth to show you more.The company's teaser video follows.

AMD today introduced the EPYC 4004 line of server processors in the Socket AM5 package. These chips come with up to 16 "Zen 4" CPU cores, a 2-channel DDR5 memory interface, and a 28-lane PCIe Gen 5 I/O, and are meant to power small-business servers, as well as cater to the dedicated web-server hosting business that generally attracts client-segment processors. This is the exact segment of market that Intel addresses with its Xeon E-2400 series processors in the LGA1700 package. The EPYC 4004 series offers a superior support and warranty regime compared to client-segment processors, besides ECC memory support, and AMD Secure Processor, and all of the security features you get with Ryzen PRO 7000 series processors for commercial desktops.

AMD's offer over the Xeon E-2400 series is its CPU core count of up to 16, which lets you fully utilize the 16-core limit of the Windows 2022 Server base license. The EPYC 4004 series is functionally the same processor as the Ryzen 7000 "Raphael" except for its ECC memory support. This chip features up to two 5 nm "Zen 4" CCDs with up to 8 cores, each; and an I/O die that puts out two DDR5 memory channels, and 28 PCIe Gen 5 lanes. Besides today's processor launch, several server motherboard vendors are announcing Socket AM5 server boards that are rackmount-friendly, and with server-relevant features.

TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year. It is expected that wafer input for 1alpha nm and above processes will account for approximately 40% of total DRAM wafer input by the end of the year.

HBM production will be prioritized due to its profitability and increasing demand. However, limited yields of around 50-60% and a wafer area 60% larger than DRAM products mean a higher proportion of wafer input is required. Based on the TSV capacity of each company, HBM is expected to account for 35% of advanced process wafer input by the end of this year, with the remaining wafer capacity used for LPDDR5(X) and DDR5 products.

Shuttle, a leading developer of Mini-PC solutions, today announces the launch of the DL30N. With its advanced technical specifications and robust design, this new fanless Mini-PC is aimed at professional users in a wide range of applications. Equipped with an Intel processor N100 and compatible with up to 16 GB of DDR5 SO-DIMM memory, the DL30N provides a solid foundation for applications that require high data processing speeds. Its two 2.5 Gbit/s network ports improve network performance even in complex network environments. With eight USB 3.2 Gen 1 ports and two COM ports, this machine offers exceptional connectivity for a wide range of applications.

Tom Seiffert, Head of Marketing & PR Europe at Shuttle, explains: "With the DL30N, we are specifically addressing the needs of companies looking for a reliable, powerful and noiseless solution. This PC is particularly suitable for use in areas such as digital signage, kiosk systems or even as a compact office PC."

ORIGIN PC, a leader in custom high-performance systems, today launched their latest laptops - the EON16-SX, NSX-16, NSL-14, and NSL-16. For gamers, the EON16-SX offers powerful 40-Series performance and the latest in processing efficiency with an Intel Core Ultra processor. Professionals have a much broader selection of workstation laptops moving forward with the introduction of the brand new NSX-16, NSL-14, and NSL-16 laptops. Designed for the Generation of AI, the new Intel Core Ultra processors also feature a built-in NPU and Intel AI Boost. Experience improved productivity, efficiency, and performance with AI-acceleration that can be used for video editing, multi-tasking, and more. All four of the new laptops meet MIL-STD-810H-SPEC standards, meaning they have passed extensive stress tests including extreme temperatures, humidity, shock, and more. Durable and powerful, yet completely portable, ORIGIN PC is proud to announce the newest editions to their world-class lineup of custom PCs.

The brand new EON16-SX and NSX-16 laptops are a fusion of high-performance and fully portable design. While only 4.29 lbs light and 0.77 inches thin, they offer high-performance via quality hardware like an Intel Core Ultra 7 155H, NVIDIA GeForce RTX 4070, DDR5 memory, and a spacious amount of high-speed SSD storage. Both laptops are also designed with a 16" 240 Hz 2560x1600 display, providing an expansive view of games, videos, and software. The two new laptops also take advantage of NVIDIA Optimus which automatically switches between the high performance dedicated GPU and power-efficient integrated GPU to maximize power efficiency. Packed with the latest technology, they boast a generous battery lifespan of 4 hours and 40 minutes. Customize the EON16-SX or NSX-16 with up to 64 GB of DDR5 memory and 16 TB of SSD storage, while also accessing a wide array of connectivity options.