YEYIAN GAMING, a leader in innovative pre-built gaming PCs, peripherals, and computer components, is thrilled to announce the market launch of eight new gaming desktop PCs powered by the latest INTEL Core i9/i7/i5 14th Gen unlocked CPUs. Four of the eight new models are available exclusively for purchase on Newegg. These newly launched models are meticulously crafted to redefine the gaming experience, catering to both professional gamers and avid enthusiasts alike.

The highlight of this remarkable launch is the fusion of INTEL 14th gen processors with NVIDIA RTX 4000 series graphics cards, culminating in an unparalleled gaming extravaganza that redefines the boundaries of what's possible in the gaming world.

Thanks to the information from Windows Report, we have received numerous details regarding Qualcomm's upcoming Snapdragon Elite X chip for laptops. The Snapdragon Elite X SoC is built on top of Nuvia-derived Oryon cores, which Qualcomm put 12 off in the SoC. While we don't know their base frequencies, the all-core boost reaches 3.8 GHz. The SoC can reach up to 4.3 GHz on single and dual-core boosting. However, the slide notes that this is all pure "big" core configuration of the SoC, so no big.LITTLE design is done. The GPU part of Snapdragon Elite X is still based on Qualcomm's Adreno IP; however, the performance figures are up significantly to reach 4.6 TeraFLOPS of supposedly FP32 single-precision power. Accompanying the CPU and GPU, there are dedicated AI and image processing accelerators, like Hexagon Neural Processing Unit (NPU), which can process 45 trillion operations per second (TOPS). For the camera, the Spectra Image Sensor Processor (ISP) is there to support up to 4K HDR video capture on a dual 36 MP or a single 64 MP camera setup.

The SoC supports LPDDR5X memory running at 8533 MT/s and a maximum capacity of 64 GB. Apparently, the memory controller is an 8-channel one with a 16-bit width and a maximum bandwidth of 136 GB/s. Snapdragon Elite X has PCIe 4.0 and supports UFS 4.0 for outside connection. All of this is packed on a die manufactured by TSMC on a 4 nm node. In addition to marketing excellent performance compared to x86 solutions, Qualcomm also advertises the SoC as power efficient. The slide notes that it uses 1/3 of the power at the same peak PC performance of x86 offerings. It is also interesting to note that the package will support WiFi7 and Bluetooth 5.4. Officially coming in 2024, the Snapdragon Elite X will have to compete with Intel's Meteor Lake and/or Arrow Lake, in addition to AMD Strix Point.

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications—including the cloud, edge devices and automotive vehicles.

Attended by about 600 customers, partners and industry experts, the event served as a platform for Samsung executives to expand on the company's vision for "Memory Reimagined," covering long-term plans to continue its memory technology leadership, outlook on market trends and sustainability goals. The company also presented new product innovations such as the HBM3E Shinebolt, LPDDR5X CAMM2 and Detachable AutoSSD.

SK hynix showcased its next-generation memory semiconductor technologies and solutions at the OCP Global Summit 2023 held in San Jose, California from October 17-19. The OCP Global Summit is an annual event hosted by the world's largest data center technology community, the Open Compute Project (OCP), where industry experts gather to share various technologies and visions. This year, SK hynix and its subsidiary Solidigm showcased advanced semiconductor memory products that will lead the AI era under the slogan "United Through Technology".

SK hynix presented a broad range of its solutions at the summit, including its leading HBM(HBM3/3E), CXL, and AiM products for generative AI. The company also unveiled some of the latest additions to its product portfolio including its DDR5 RDIMM, MCR DIMM, enterprise SSD (eSSD), and LPDDR CAMM devices. Visitors to the HBM exhibit could see HBM3, which is utilized in NVIDIA's H100, a high-performance GPU for AI, and also check out the next-generation HBM3E. Due to their low-power consumption and ultra-high-performance, these HBM solutions are more eco-friendly and are particularly suitable for power-hungry AI server systems.

Today, AMD announced the much-anticipated AMD Ryzen Threadripper PRO 7000 WX-Series processors and reintroduced the Threadripper processor lineup to the high-end desktop space with the Ryzen Threadripper 7000 Series processors, setting a new standard for computing performance and innovation in the industry.

AMD is introducing the Ryzen Threadripper PRO 7000 WX-Series processors, which will be available later this year to DIY customers, SI partners, and through OEM partners, including Dell Technologies, HP, and Lenovo. Designed for professionals and businesses that demand top-tier performance, reliability, expandability, and security, these processors provide the unparalleled multi-core performance of "Zen 4" Threadripper 7000 Series processors. Additionally, they are bolstered by AMD PRO technologies and offer the enterprise-level security and management features modern businesses require, and feature up to 96 cores and 192 processing threads of incredible performance for the workstation market.

Gigabyte has revealed its first TRX50 motherboard today for AMD's Ryzen Threadripper 7000 Pro and Threadripper 7000 CPUs and to call this board feature packed, would almost be an understatement. The product page is still scant on details, but there's enough there to give us a good idea of what's on offer. The board is a full size ATX board which appears to be somewhere between a high-end consumer board and a workstation board. The heatsink layout isn't as refined as some of Gigabyte's current consumer board, which spoils the overall looks somewhat. With no less than three PCIe 5.0 NVMe M.2 slots and one PCIe 4.0, one has to wonder if the heatsinks covering the SSDs will be enough, considering how hot PCIe 5.0 drives can get.

The board has a further two PCIe 5.0 x16 slots and one PCIe 4.0 x16, so there won't be any need to worry about lack of PCIe lanes per slot here. Somewhat disappointingly, the board only has four DDR5 memory slots, although quad channel support is offered, as well as support for registered DIMMs. The 12 layer PCB also houses a 16+8+4 power phase design, which might be needed based on the expected core count on some of the Threadripper 7000 series CPUs. This is also one of the first boards with onboard USB4 support, with one of the ports offering DisplayPort output, although a DP to DP connection from the graphics card to a DP input on the motherboard is still required. The board also sports a 10 Gbps and a 2.5 Gbps Ethernet port, WiFi 7, a front header for a 20 Gbps USB 3.2 Gen 2x2 port and apparently two audio chips, although the list of specs and the board feature image seem to disagree on what's on offer here. The board is likely to be available at the same time as AMD's new Threadripper CPUs.

Intel's upcoming Meteor Lake processor family will see the light of the day in mobile version only, with a big re-brand of the Intel Core i naming structure. Slated for a December 14th launch, we are eager to see the official performance figures. However, we are in for a treat today as we have some early performance figures thanks to Geekbench. According to the GB5 run found by BenchLeaks, Intel's Core Ultra 9 185H CPU has appeared to show its configuration, early performance, and boost frequency that is reaching beyond the 5.0 GHz mark.

As the GB5 run suggests, Core Ultra 9 185H is a 16-core CPU with 22 threads, running at 2.5 GHz base frequency. There are six P-cores, eight E-cores, and two SoC-cores on the package of this SKU. During boost, the CPU can reach up to 5.1 GHz and was paired with 64 GB of DDR5 memory. Interestingly, the CPU scored 1849 points in single-threaded tests and 9832 points in multi-threaded tests, which currently doesn't beat top-end Intel mobile HX SKU like i9-13980HX. However, we estimate this was an early engineering sample, and the final product will be more performant.

ADATA, the world's leading brand for memory modules and flash memory and Intel recommended partner, in conjunction with its e-sports brand XPG (Xtreme Performance Gear), announces that XPG's complete range of DDR5 memory modules and ADATA Gen 5 SSDs fully support the latest Intel Core processor (14th gen) platform. The recent launch of this latest 14th Gen desktop processor platform emphasized its placing as the fastest processor in the world. Not only does this processor multi-task gaming and heavy workloads, but it also delivers amazing across-the-board performance, in line with the brand appeal fostered by ADATA and XPG. Together, we are committed to providing e-sports enthusiasts and creators with the fastest and most reliable experience available.

XPG DDR5 memory and ADATA PCIe 5.0 SSDs fully support Intel's latest desktop platform
ADATA has partnered with Intel and the world's foremost motherboard brands to conduct compatibility testing on XPG DDR5 memory modules and ADATA PCIe 5.0 SSDs in preparation for Intel Core processors (14th gen). Although the most common clock speed in the DDR5 market is currently 5600MT/s, XPG LANCER DDR5 memory modules successfully achieved an ultra-high clock speed of 8,000MT/s during testing and also support Intel XMP Ready to successfully overclock from 8,400MT/s to 9,900MT/s. The ADATA LEGEND 970 PCIe 5.0 SSD was tested at up to an ultra-high 10,000 MB/s sequential read and write speed with 4K random write speed reaching up to 1,400K, delivering a smooth and ultra-efficient desktop experience to gamers and creators alike.

ORIGIN PC, a leader in custom high-performance systems, today announced the availability of the latest 14th Gen Intel Core Processors across its lineup of custom desktop PCs. Whether you are looking for a compact powerhouse in the form of the CHRONOS, timeless elegance in the NEURON, or supercharged gaming in the liquid-cooled GENESIS, all these machines can now draw on the power of Intel's latest 14th Gen processors. These custom-built PCs are available with a selection of the best hardware to choose from, including CORSAIR VENGEANCE DDR5 memory, iCUE LINK Smart Component Technology, and Hydro X Series liquid cooling. The expert system builders at ORIGIN PC are primed to craft a masterpiece that's ready to game without compromise.

The brand new Intel Core i9-14900K boasts clock speeds up to 6.0 GHz, taking advantage of its 24 cores (8 Performance cores and 16 Efficient cores) and 32 threads to redefine high-end performance. It also features Intel Thermal Velocity Boost, Intel Turbo Boost Max Technology 3.0 Frequency, as well as support for PCIe 5.0/4.0 and DDR5/DDR4. Enthusiast gamers and serious creators can now access the high performance necessary to make the most from their craft.

Intel has officially pulled back the curtain on its 14th Gen Core CPUs, giving gamers, creators, enthusiasts, and everyday users a new tier of processors that elevate everything they do. We've already teased several of our Z790 motherboards purpose-built for the latest Intel Core CPUs, but now we're ready to share all the details. In total, we're releasing seven new Z790 motherboards for your consideration as you hunt for the best motherboard for your 14th Gen Intel CPU. Our cutting-edge ROG Maximus motherboard family is expanding with the ROG Maximus Z790 Dark Hero, the ROG Maximus Z790 Apex Encore, and the ROG Maximus Z790 Formula. For gamers everywhere, we're expanding our ROG Strix lineup with three new models, and fans of our TUF Gaming series will be pleased to see the TUF Gaming Z790-Pro WiFi make its debut. These new motherboards join our existing Z790 and Z690 motherboards, which also support Intel's latest and greatest chips through a simple firmware update.

There's a lot to go over with the new additions to our Z790 motherboard family: they mark the debut of our first WiFi 7 motherboards, for one, and we're increasing the number of models with onboard PCIe 5.0 M.2 slots. They offer our latest game-changing innovations like DIMM Flex, and they make the process of building a PC easier than ever with their DIY-friendly features.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its range-wide compatibility and readiness for Intel's new 14th Generation Intel Core processors. With a enormous range of tested and validated components such as DDR5 memory, all-in-one liquid CPU coolers, innovative and reliable power supplies, and blazing fast M.2 SSDs, you can be confident that CORSAIR components will pair exceptionally with the latest in Intel processors to help your PC reach its full potential.

The latest Core processors utilize Intel's new Performance Hybrid Architecture, featuring more efficiency-cores for the best gaming experience—even while streaming and encoding video. Other features, such as Intel Thread Director to keep background tasks from slowing down games and Smart Cache for smoother gameplay and faster load times, make 14th Gen Core processors a great choice for PC gaming. But it's not enough to just have the CPU; you need to complete your system with components that can keep up and tap into its full potential, and that's where CORSAIR comes in.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, is ready to usher in the era of Intel Core 14th gen processors with a complete lineup of Z790/Z690 series motherboards. Especially, From the flagship Z790 AORUS XTREME X to the versatile Z790 AORUS ELITE X, the X Gen series is engineered to optimize the performance of Intel Core 14th gen processors and drive DDR5 memory faster than ever.

The AORUS Z790 X Gen motherboards, equipped with cutting-edge technologies, deliver best-in-class DDR5 compatibility and leading performance, supporting up to DDR5 XMP-8266 and beyond. The most crucial technology for DDR5's leading performance is the newly introduced Back Drilling Technology, which enhances signal integrity, resulting in improved system performance and heightened reliability.

Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

TrendForce reports indicate a universal price increase for both DRAM and NAND Flash starting in the fourth quarter. DRAM prices, for instance, are projected to see a quarterly surge of about 3-8%. Whether this upward momentum can be sustained will hinge on the suppliers' steadfastness in maintaining production cuts and the degree of resurgence in actual demand, with the general-purpose server market being a critical determinant.

PC DRAM: DDR5 prices, having already surged in the third quarter, are expected to maintain their upward trajectory, fueled by the stocking of new CPU models. This forthcoming price hike cycle for both DDR4 and DDR5 is incentivizing PC OEMs to proceed with purchases. Although manufacturers still have substantial inventory and there's no imminent shortage, Samsung has been nudged to further slash its production. However, facing negative gross margins on DRAM products, most manufacturers are resistant to further price reductions, instead pushing for aggressive increases. This stance sets the stage for an anticipated rise in DDR4 prices by 0-5% and DDR5 prices by around 3-8% in the fourth quarter. Overall, as DDR5 adoption accelerates, an approximate 3-8% quarterly increase is projected for PC DRAM contract prices during this period.

Ever since the creation of A64FX for the Fugaku supercomputer, Fujitsu has been plotting the development of next-generation CPU design for accelerating AI and general-purpose HPC workloads in the data center. Codenamed Monaka, the CPU is the latest creation for TSMC's 2 nm semiconductor manufacturing node. Based on Armv9-A ISA, the CPU will feature up to 150 cores with Scalable Vector Extensions 2 (SVE2), so it can process a wide variety of vector data sets in parallel. Using a 3D chiplet design, the 150 cores will be split into different dies and placed alongside SRAM and I/O controller. The current width of the SVE2 implementation is unknown.

The CPU is designed to support DDR5 memory and PCIe 6.0 connection for attaching storage and other accelerators. To bring cache coherency among application-specific accelerators, CXL 3.0 is present as well. Interestingly, Monaka is planned to arrive in FY2027, which starts in 2026 on January 1st. The CPU will supposedly use air cooling, meaning the design aims for power efficiency. Additionally, it is essential to note that Monaka is not a processor that will power the post-Fugaku supercomputer. The post-Fugaku supercomputer will use post-Monaka design, likely iterating on the design principles that Monaka uses and refining them for the launch of the post-Fugaku supercomputer scheduled for 2030. Below are the slides from Fujitsu's presentation, in Japenese, which highlight the design goals of the CPU.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products:

Micron Technology, Inc., today announced it has extended its industry-leading 1β (1-beta) process node technology with the introduction of 16Gb DDR5 memory. With demonstrated in-system functionality at speeds up to 7,200 MT/s, Micron's 1β DDR5 DRAM is now shipping to all data center and PC customers. Micron's 1β-based DDR5 memory with advanced high-k CMOS device technology, 4-phase clocking and clock-sync provides up to a 50% performance uplift and 33% improvement in performance per watt over the previous generation.

As CPU core counts increase to meet the demands of data center workloads, the need for higher memory bandwidth and capacities grows significantly to overcome the 'memory wall' challenge while optimizing the total cost of ownership for customers. Micron's 1β DDR5 DRAM allows computational capabilities to scale with higher performance enabling applications like artificial intelligence (AI) training and inference, generative AI, data analytics, and in-memory databases (IMDB) across data center and client platforms. The new 1β DDR5 DRAM product line offers current module densities in speeds ranging from 4,800 MT/s up to 7,200 MT/s for use in data center and client applications.

v-color Technology Inc, is thrilled to introduce a memory kit that redefines extreme performance. This release unveils an unparalleled DDR5 memory specification designed to push the boundaries of low-latency performance, with module capacity of 16GBx2 and 32GBx2 CL of 26 and speeds ranging from 5600 MHz up to 5800 MHz. These new kits will open a new era of gaming and overclocking, delivering speed and stability to the most demanding users

v-color announced its latest achievement in the form of an Ultra-Low-Timing XSky series DDR5 memory kit. This module operates at 32 GB (2x16GB) DDR5 5600 MHz CL26-36-36-76 1.4 V, 32 GB (2x 16 GB) DDR5 5800 MHz CL26-36-36-76 1.4 V and 64 GB (2x32GB) DDR5 5600 MHz CL26-36-36-76 1.4 V.

Leading memory provider, Team Group, has tapped into T-FORCE Lab's superb R&D capabilities to create the latest iteration of the T-FORCE XTREEM DDR5 memory. By utilizing a patented IC classification test and verification technology, the upper limits of the DDR5 frequency have been raised to create a high-clock rate memory module designed specifically for gamers. Decorated with the glorious T-FORCE logo badge, the XTREEM's design exudes both confidence and style, befitting the newest king of overclocking memory modules.

T-FORCE XTREEM DDR5 memory demonstrates incredible overclocking performance to satisfy overclocking enthusiasts around the world. Not only using 2 mm-thick aluminium alloy fin heatsinks to enhance its thermal capacity, but also uses special heat-conducting silicone to tightly adhere the heatsinks with the memory to achieve the most optimal cooling effect. The surface is also treated with an anodized surface that is resistant to acid, corrosion, rust and is non-electrically conductive, providing gamers with greater peace of mind. The T-FORCE XTREEM DDR5's two-piece heat spreader is made of thick metal and underwent sandblasted surface treatment to give it the appearance of hard basalt and the matte black texture reminiscent of a black sand beach. Users can enjoy the excellent overclocking capabilities of the XTREEM DDR5 while admiring its elegant design.

Today Acer has unveiled the Nitro V 15 gaming laptop—combining 13th Gen Intel Core processors, NVIDIA GeForce RTX 40 Series GPUs, up to 32 GB of DDR5 RAM, and support for up to 2 TB PCIe M.2 SSDs for smooth, worry-free gaming. Digital worlds seamlessly unfold when playing on the Acer Nitro V 15's vibrant Full HD display with a lightning-fast refresh rate of up to 165 Hz and paired with DTS X: Ultra's pinpoint sound accuracy. Thanks to the 15-inch gaming laptop's dual fan and exhaust system, the battle-ready internals are kept cool and let players dive deep into any gaming dimension without breaking a sweat.

Optimal Performance for Adrenaline-charged Gaming
The Acer Nitro V 15 is shipped with up to 13th Gen Intel Core i7 processors, designed with the latest hybrid architecture to deliver premium gaming, creating, video editing, and multi-tasking, even when on the go. Equipped with up to NVIDIA GeForce RTX 4050 Laptop GPUs, gamers are treated to lifelike virtual scenes as the device's GPU delivers power-efficient and AI-powered rendering capabilities with DLSS 3 and ray tracing.

Lenovo has unveiled the ThinkCentre M90a Pro Gen 4, setting a new standard for all-in-one (AIO) business desktop computers. Designed to address the needs of modern workplaces and content creators, this powerhouse Windows 11 PC wows with a massive 27-inch QHD display and is equipped with smart features that enhance connectivity, privacy, and usability.

"Modern businesses require more than just a high-performing PC, they need solutions that are smart and intuitive, reliable and efficient, and empowers them to create a multi-device ecosystem seamlessly," said Sanjeev Menon, vice president and general manager, Worldwide Desktop Business in Intelligent Devices Group, Lenovo. "In this evolving hybrid environment, employees use an average of 2.5 devices for work and would like to be provided with both desktops and laptops to allow them to be more productive. Lenovo's ThinkCentre M90a Pro Gen 4 is the answer for businesses looking for synergy and to make workspaces more flexible, streamlined, and productive."

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today launched the much anticipated latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with a stunning design and blazing performance.

Sporting an elegant, fresh new aesthetic and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to unveil the brand-new H610MS and H610MHD D5 motherboards designed to supplement the needs of modern day professionals and home users seamlessly. Built based on Intel H610 single-chip architecture, ready for 12th and 13th Gen Intel Core Processors, these motherboards are ideal for the working professional, making tasks such as web browsing, emailing, and document management a breeze. For the home user, it delivers an unparalleled experience whether watching movies on Netflix, listening to music, gaming, or even for HTPC uses like streaming, live TV recording, and more.

The H610MS motherboard supports the robust DDR4 memory modules. Users can utilize 2 DIMM slots with a capacity of up to 64 GB. Meanwhile, the H610MHD D5 motherboard is designed to handle the latest DDR5 memory modules across a similar 2-DIMM configuration of up to 96 GB of Memory, ensuring users have a breadth of choices for their distinct build preferences. These motherboards are brimming with cutting-edge features tailored to modern computing demands. Each board seamlessly supports USB 3.2 Gen 1, ensuring rapid data transfers and connectivity. Additionally, they are primed for the future with support for both PCIe 4.0 and PCIe 3.0 interfaces, offering enhanced versatility for expansions. Furthermore, they are equipped to accommodate the blazing speeds of PCIe 3.0 M.2 drives with a bandwidth of 32 Gb/s, catering to users who seek swift storage solutions.

SK hynix announced on September 22 that it showcased its latest memory technologies and products at Intel Innovation 2023 held September 19-20 in the western U.S. city of San Jose, California. Hosted by Intel since 2019, Intel Innovation is an annual IT exhibition which brings together the technology company's customers and partners to share the latest developments in the industry. At this year's event held at the San Jose McEnery Convention Center, SK hynix showcased its advanced semiconductor memory products which are essential in the generative AI era under the slogan "Pioneer Tomorrow With the Best."

Products that garnered the most interest were HBM3, which supports the high-speed performance of AI accelerators, and DDR5 RDIMM, a DRAM module for servers with 1bnm process technology. As one of SK hynix's core technologies, HBM3 has established the company as a trailblazer in AI memory. SK hynix plans to further strengthen its position in the market by mass-producing HBM3E (Extended) from 2024. Meanwhile, DDR5 RDIMM with 1bnm, or the 5th generation of the 10 nm process technology, also offers outstanding performance. In addition to supporting unprecedented transfer speeds of more than 6,400 megabits per second (Mbps), this low-power product helps customers simultaneously reduce costs and improve ESG performance.

T-CREATE, the creator sub-brand of the global memory provider Team Group, today launched the T-CREATE MASTER DDR5 OC R-DIMM, an overclocking DDR5 ECC Registered DIMM memory. T-CREATE's MASTER series is designed specifically for workstations and servers. With its high specifications and large capacity, it fully satisfies the needs of professionals in handling large-scale projects, analyzing large data sets, and running multiple specialized applications concurrently. The T-CREATE MASTER DDR5 OC R-DIMM features a one-piece heat spreader with ventilation holes and thermally conductive silicone for quick heat dissipation. It also has on-die ECC, which allows systems to run more stably and provide excellent performance.

The T-CREATE MASTER memory module is an overclocking ECC Registered DIMM memory available in frequencies of 6000 MHz, 6400 MHz, and 6800 MHz. When the module is paired with workstation motherboards, memory capacity can reach up to a massive 384 GB, allowing professional creators to quickly complete all types of work and enjoy the creative flexibility that comes with large capacities. In addition to the on-die ECC that corrects bit errors within the DRAM chip, the MASTER memory also supports an ECC feature that corrects errors outside the chip and fixes data corruption, allowing for stable operation and greater peace of mind when creating. The MASTER R-DIMM is compatible with W790 series workstation motherboards and is made for creative professionals, developers, and engineers. When combined with the powerful computing of the latest Intel Xeon processors, the T-CREATE MASTER DDR5 OC R-DIMM memory delivers incredible performance and stability for content creation, graphic rendering, and the demanding applications of high-end workstations.