MSI, a leading global server provider, is showcasing its latest GPU servers powered by AMD processors at the 2024 NAB Show, Booth #SL9137 in the Las Vegas Convention Center from April 14-17. These servers are designed to meet the evolving needs of modern creative projects in Media and Entertainment industry. "As AI continues to reshape the Media and Entertainment industry, it brings unprecedented speed and performance to tasks such as animation, visual effects, video editing, and rendering," said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI's GPU platforms empower content creators to execute every project with efficiency, speed, and uncompromising quality."

The G4101 is a 4U 4GPU server platform, purpose-built to unleash the full potential of creative professionals in the Media and Entertainment industry. It supports a single AMD EPYC 9004 Series processor equipped with a liquid cooling module, along with twelve DDR5 RDIMM slots. Additionally, it features four PCIe 5.0 x16 slots tailored for triple-slot graphic cards with coolers, ensuring increased airflow and sustained performance. With twelve front 2.5-inch U.2 NVMe/SATA drive bays, it offers high-speed and flexible storage options, catering to the diverse needs of AI workloads. The G4101 combines air flow spacing and liquid closed-loop cooling, making it the optimal thermal management solution for even the most demanding tasks.

Corsair today announced it is entering the DDR5 Workstation market with the introduction of a range of WS DDR5 RDIMM memory kits. Engineered to offer uncompromising performance and reliability, these ECC RDIMM kits redefine the capabilities of the newest workstations, and are compatible with the latest 4th Gen Intel Xeon and AMD Ryzen Threadripper 7000 processors.

This new range of memory kits boasts capacities of up to 256 GB, setting a new standard for memory-intensive tasks such as high-resolution media editing, 3D rendering, and AI training. Rigorously tested and carefully screened, these modules surpass JEDEC specifications with tighter timings and higher frequencies, ensuring optimal performance for the most demanding workloads.

V-COLOR Technology Inc. unveiled its latest breakthrough in memory technology, the Manta XFinity series, now boasting speeds of up to DDR5-8600 with XMP profile. This series is already gaining recognition in the overclocking community by securing the 3rd spot on the Memory Frequency ranking in HWBOT, and is ready to create even larger impacts with its enhanced overclocking capabilities. Tested on the new ASRock Phantom Gaming Z790I Lightning Wi-Fi, and PHANTOM GAMING B760I Lightning Wi-Fi with Intel Core 14th Gen CPUs, this advancement ensures unmatched performance and reliability for enthusiasts and professionals alike.

Montage Technology, a leading data processing and interconnect IC company, today announced that it has taken the lead in the trial production of 1st-generation DDR5 Clock Driver (CKD) chips for next-generation client memory. This new product aims to enhance the speed and stability of memory data access to match the ever-increasing CPU operating speed and performance.

Previously, clock driver functionality was integrated into the Registering Clock Driver (RCD) chips used on server RDIMM or LRDIMM modules, not deployed to the PCs. In the DDR5 era, as data rates climb 6400 MT/s and above, the clock driver has emerged as an indispensable component for client memory.

Following in the wake of an earthquake that struck on April 3rd, TrendForce undertook an in-depth analysis of its effects on the DRAM industry, uncovering a sector that has shown remarkable resilience and faced minimal interruptions. Despite some damage and the necessity for inspections or disposal of wafers among suppliers, the facilities' strong earthquake preparedness of the facilities has kept the overall impact to a minimum.

Leading DRAM producers, including Micron, Nanya, PSMC, and Winbond had all returned to full operational status by April 8th. In particular, Micron's progression to cutting-edge processes—specifically the 1alpha and 1beta nm technologies—is anticipated to significantly alter the landscape of DRAM bit production. In contrast, other Taiwanese DRAM manufacturers are still working with 38 and 25 nm processes, contributing less to total output. TrendForce estimates that the earthquake's effect on DRAM production for the second quarter will be limited to a manageable 1%.

Today at Embedded World, SiFive, Inc., the pioneer and leader of RISC-V computing, unveiled its new state-of-the-art RISC-V development board, the HiFive Premier P550. The board will be available for large-scale deployment through Arrow Electronics so developers around the world can test and develop new RISC-V applications like machine vision, video analysis, AI PC and others, allowing them to use AI and other cutting-edge technologies across many different market segments.

With a quad-core SiFive Performance P550 processor, the HiFive Premier P550 is the highest performance RISC-V development board in the industry, and the latest in the popular HiFive family. Designed to meet the computing needs of modern workloads, the out-of-order P550 core delivers superior compute density and performance in an energy-efficient area footprint. Furthermore, the modular design of the HiFive Premier P550, which includes a replaceable system-on-module (SOM) board, gives developers the flexibility they need to tailor their designs.

ASRock proudly announces its new Z790I Lightning WiFi and B760I Lightning WiFi Mini-ITX motherboards. Equipped with a robust 14+1+1 power phase design and an optimized memory layout, these motherboards fully unleash the powerful performance of Intel Core 14th Gen K-series processors. Offering top-tier memory overclocking capabilities for supporting DDR5 8600+ memory modules, they present an excellent choice for gamers and mini-PC enthusiasts seeking the ultimate overclocking performance. The Z790I Lightning WiFi has achieved four overclocking world records on HWBOT.org with the Intel Core i9-14900KS processor. Additionally, the B760I Lightning WiFi received the "Best Motherboard" award at CES 2024 from Tom's Hardware, emphasizing its exceptional design and overclocking capabilities.

ASRock Z790I Lightning WiFi and B760I Lightning WiFi motherboards feature a 14+1+1 Phase 110 A SPS Dr.MOS VRM, outperforming competing ITX offerings. ASRock has custom-designed a composite cooling solution for these boards, including enlarged aluminium heatsinks, heat-pipe, and a MOS fan, delivering robust cooling performance to enhance overclocking capabilities. This superior cooling ensures the processors perform at their peak.

MSI, an innovative leader in computing technology, is excited to announce the release of its newest All-in-One PCs: the Modern AM242TP 1M and Modern AM272P 1M series. These devices are designed to revolutionize productivity and efficiency in the modern workplace by integrating cutting-edge features that enhance user experience and performance with elegant design. The new series features the latest Intel Core processors, DDR5 memory, and dTPM 2.0 security, and MSI AI Engine.

The new Modern series All-in-One PC with the unique EyesErgo Technology, available in 24-inch and 27-inch sizes, is designed with eye-care and ergonomic technology to meet the high-performance computing needs of business and productivity users. Both models feature a modern and sleek design with a narrow bezel display. The 24-inch Modern AM242TP series has a Full HD (1920x1080) resolution with Anti-flicker, Less Blue Light, and a 10-point touch panel. The 27-inch Modern AM272P, on the other hand, has an HDMI input and output, allowing it to function as a second monitor with MSI Instant Display Technology. The tilt-height adjustable stand provides ergonomic flexibility for the Modern AM242TP and AM272P series, allowing users to adjust the viewing angles for their comfort. Whether running a personal studio, managing a YouTube channel, or brainstorming ideas for a business, the Modern series can bring ideas and imagination to life.

ASUS today announced the official release of ASUS NUC 14 Pro, one of several mini PCs unveiled at CES 2024. ASUS NUC 14 Pro delivers best-in-class performance thanks to its Intel Core Ultra 7 or 5 processor powered by three AI engines—a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), and a Central Processing Unit (CPU). Offering high throughput, low power consumption, and fast response, ASUS NUC 14 Pro delivers robust computing capabilities. It also features WiFi sensing for intelligent energy efficiency, along with exceptional security, manageability and stability enabled by Intel vPro Enterprise.

Featuring a 4 x 4 matte black textured chassis constructed of recycled plastic, a replaceable lid, and a VESA mounting plate, this ultra-small-form-factor (uSFF) desktop PC integrates into any workspace, offering maximum functionality without compromising style. Each device comes individually packaged and includes a three-year limited warranty.

On February 26, 2024, AMD received new research related to an industry-wide DRAM issue documented in "ZENHAMMER: Rowhammering Attacks on AMD Zen-based Platforms" from researchers at ETH Zurich. The research demonstrates performing Rowhammer attacks on DDR4 and DDR5 memory using AMD "Zen" platforms. Given the history around Rowhammer, the researchers do not consider these rowhammering attacks to be a new issue.

Mitigation
AMD continues to assess the researchers' claim of demonstrating Rowhammer bit flips on a DDR5 device for the first time. AMD will provide an update upon completion of its assessment.

Micron representatives showcased new products at last week's NVIDIA GTC event—one eye-catching DIMM is all set for deployment within next-generation servers. Tom's Hardware spent some time at Micron's booth—they found out that the "Tall Form Factor" 256 GB DDR5-8800 Multiplexer Combined Ranks (MCR) DIMM is being prepared for future enterprise processor platforms, including Intel's Xeon Scalable "Granite Rapids" family. A lone "tall" prototype module was exhibited, but company representatives indicated that standard height MCRDIMMs are in development. Tom's Hardware found out that these will compact enough to fit in 1U-sized server systems. According to their in-person experience: "(Micron's) 256 GB MCRDIMMs are based on monolithic 32 Gb DDR5 ICs, but the tall one places 80 DRAM chips on both sides of the module, whereas the standard one uses 2Hi stacked packages, which means that they run slightly hotter due to less space for thermal dissipation. In any case, the tall module consumes around 20 W, which isn't bad as Micron's 128 GB DDR5-8000 RDIMM consumes 10 W at DDR5-4800."

In a recent earnings call, Micron CEO Sanjay Mehrotra, commented on his company's latest technology: "we (have) started sampling our 256 GB MCRDIMM module, which further enhances performance and increases DRAM content per server." Next-gen Intel Xeon platforms are expected to support 12 or 24 memory slots per processor socket. Enabled datacenter machines could be specced with total 3 TB or 6 TB (DDR5-8000) memory capacities. AnandTech has summarized the benefits of Micron's new part: "Multiplexer Combined Ranks (MCR) DIMMs are dual-rank memory modules featuring a specialized buffer that allows both ranks to operate simultaneously. This buffer enables the two physical ranks to operate as though they were separate modules working in parallel, which allows for concurrent retrieval of 128 bytes of data from both ranks per clock cycle—compared to 64 bytes per cycle when it comes to regular memory modules—effectively doubling performance of a single module." The added complexity is offset by significant performance boons—ideal for advanced server-side AI-crunching in the future.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH (Nasdaq: SGH) and a global leader in memory solutions, solid-state drives, and hybrid storage products, introduces its ultra-high reliability memory solution, Zefr ZDIMM memory modules. ZDIMM modules are ideally suited for data centers, hyperscalers, high performance computing (HPC) platforms and other environments that run large memory applications that demand maximum availability of the compute platform. Memory reliability is a critical factor in data centers due to the high costs associated with downtime. ZDIMM modules are offered in both DDR4-3200 and DDR5-5600 form factors and are available in mainstream densities.

ZDIMM modules employ SMART's proprietary Zefr screening process that delivers the highest levels of uptime and reliability, typically performing 90% better than industry standard memory modules. ZDIMM modules undergo a screening process that replicates real-world conditions which ensures the robustness and resilience of ZDIMM modules in the most demanding computing scenarios.

TrendForce's latest report reveals that despite DRAM suppliers' efforts to trim inventories, they have yet to reach healthy ranges. As they continue to improve their lose situations by boosting capacity utilization rates, the overall demand outlook for this year remains tepid. Additionally, significant price increases by suppliers since 4Q23 are expected to further diminish the momentum for inventory restocking. As a result, DRAM contract prices for the second quarter are projected to see a modest increase of 3-8%.

The shift toward DDR5-compatible CPUs is set to drive an increase in PC DRAM demand in the second quarter. As manufacturers move toward more advanced, cost-efficient production processes for DDR5, their profitability is expected to rise significantly. This anticipation of higher DRAM prices in 1H24 has led to suppliers to aim for price increases in Q2, targeting a 3-8% hike in PC DRAM contract prices. Notably, even though DDR5 prices have already seen a notable rise in Q1—exceeding the average increase for other products—the expected emergence of AI PC demand may lead to a slight moderation in DDR5 price increases in Q2.

MemVerge, a leader in AI-first Big Memory Software, has joined forces with Micron to unveil a groundbreaking solution that leverages intelligent tiering of CXL memory, boosting the performance of large language models (LLMs) by offloading from GPU HBM to CXL memory. This innovative collaboration is being showcased in Micron booth #1030 at GTC, where attendees can witness firsthand the transformative impact of tiered memory on AI workloads.

Charles Fan, CEO and Co-founder of MemVerge, emphasized the critical importance of overcoming the bottleneck of HBM capacity. "Scaling LLM performance cost-effectively means keeping the GPUs fed with data," stated Fan. "Our demo at GTC demonstrates that pools of tiered memory not only drive performance higher but also maximize the utilization of precious GPU resources."

MAINGEAR, a leading provider of high-performance custom PC systems, and Phison, a global leader in NAND controllers and storage solutions, today unveiled groundbreaking MAINGEAR PRO AI workstations with Phison's aiDAPTIV+ technology. Specifically engineered to democratize Large Language Model (LLM) development and training for small and medium-sized businesses (SMBs), these ultra-powerful workstations incorporate aiDAPTIV+ technology to deliver supercomputer LLM training capabilities at a fraction of the cost of traditional AI training servers.

As the demand for large-scale generative AI models continues to surge and their complexity increases, the potential for LLMs also expands. However, this rapid advancement in LLM AI technology has led to a notable boost in hardware requirements, making model training cost-prohibitive and inaccessible for many small to medium businesses.

Colorful unveiled the iGame B760M Ultra Z, a Socket LGA1700 motherboard in the Micro-ATX form-factor, with a distinctive white PCB, but that's hardly the story—this is Colorful's first motherboard with backside connectors, for more discretely cabled PC builds. The board doesn't use any marketing buzzwords such as "BTF" or "Project Zero," but has its onboard connectors aligned to support PC cases with motherboard tray cutouts for either of the two standards. The board draws power from a combination of 24-pin ATX and 4-pin ATX connectors (sufficient for Intel Performance Power Delivery profile). The processor is wired to a PCI-Express 5.0 x16 slot, and an M.2-2280 Gen 4 slot. Colorful used the region of the PCB next to the four DDR5 memory slots—where you'd normally have 24-pin and other connectors—to position an additional M.2 slot hidden behind a heatsink. There is yet another M.2 slot between the two PCIe slots.

The backside of the PCB has the board's power connectors, four SATA 6 Gbps ports, the USB- and HD audio headers, fan headers, and the front-panel headers. Networking connectivity include Wi-Fi 6E and 2.5 GbE. USB connectivity includes two 5 Gbps type-A USB 3.2 Gen 1 ports, a 10 Gbps type-C USB 3.2 Gen 2 port, and four USB 2.0 ports. There are two additional 5 Gbps ports via an internal header. HDMI and DisplayPort make up the display connectivity. The motherboard offers the USB BIOS Flashback feature. Available now in the Chinese market, the Colorful iGame B760M Ultra Z is priced at RMB ¥1,199 or (converts to USD $167).

TrendForce reports that significant capital investments have occurred in the memory sector due to the high ASP and profitability of HBM. Senior Vice President Avril Wu notes that by the end of 2024, the DRAM industry is expected to allocate approximately 250K/m (14%) of total capacity to producing HBM TSV, with an estimated annual supply bit growth of around 260%. Additionally, HBM's revenue share within the DRAM industry—around 8.4% in 2023—is projected to increase to 20.1% by the end of 2024.

HBM supply tightens with order volumes rising continuously into 2024
Wu explains that in terms of production differences between HBM and DDR5, the die size of HBM is generally 35-45% larger than DDR5 of the same process and capacity (for example, 24Gb compared to 24Gb). The yield rate (including TSV packaging) for HBM is approximately 20-30% lower than that of DDR5, and the production cycle (including TSV) is 1.5 to 2 months longer than DDR5.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, unveils the brand new A620MS motherboard, designed for business and casual use. The A620MS motherboard is a versatile solution that seamlessly bridges the gap between professional efficiency and home entertainment. It's designed to meet the needs of office users, home enthusiasts, and system integrators, whether it's enhancing productivity in the workplace, enjoying online movies and gaming at home, or managing complex business processes and client data. The A620MS is a benchmark for reliability and adaptability, catering to diverse computing environments.

Built on the advanced Socket AM5, the A620MS motherboard offers comprehensive support for the latest AMD Ryzen 7000 and 8000 series processors, ensuring compatibility with cutting-edge CPU technology. It harnesses the power of AMD's A620 single-chip architecture to provide a stable and efficient computing base. With support for up to 96 GB of DDR5 memory across two DIMM slots, it offers ample capacity and superior speed for demanding applications, making it a powerhouse for both current and future computing tasks. Furthermore, It supports PCIe 4.0 M.2 (64 Gb/s) for advanced, high-speed storage solutions, ensuring a streamlined and efficient computing experience.

ASUS today announced BIOS updates that enable support for up to 256 GB of memory on its Intel 700 and 600 series motherboards that use DDR5 modules. Such models with four DIMM slots can now support up to 256 GB of memory, while such models with two DIMM slots can now support up to 128 GB. These enhancements significantly improve multitasking potential, ensuring smooth and seamless computing. AMD AM5 motherboards from ASUS do not require a BIOS update to enable support for up to 256 GB of DDR5 memory modules.

The BIOS updates can be accessed on the ASUS support pages for the models listed below.

Global memory leader Team Group Inc. today announces that its T-CREATE EXPERT DDR5 desktop memory, under its creator brand, has been honored with the prestigious 2024 German iF Design Award, known as the 'Oscars of the Design World.' Among over 10,000 entries from 72 countries, the product stood out and excelled, once again proving the exceptional research and development capabilities of the Team Groupp team, along with its outstanding design aesthetics. By combining ultimate performance with stunning aesthetics, the product meets the diverse needs of creators, receiving recognition from international professional judges in all aspects.

The German iF DESIGN AWARD, one of the four major design awards in the world, is internationally recognized for its unparalleled and innovative significance. Global professional judges select the best designs based on five criteria: Concept, Appearance, Functionality, Differentiation, and Impact. T-CREATE EXPERT DDR5 memory emerged victoriously from this rigorous selection process, outperforming over 10,000 entries and earning this prestigious honor, showcasing Team Group's dedication to crafting products for creators.

A Crucial "CT12G56C46S5" Non-ECC Small Outline Dual In-line Memory Module (SODIMM) is available to pre-order from Amazon UK—the 12 GB capacity product was spotted by everyone's favorite PC hardware sleuth;—momomo_us. March 31 appears to be the official shipping out date—current pricing is £44.99 ($57.50). Additionally, customers have the option to reserve a related 24 GB Kit (2x 12 GB) kit (CT2K12G56C46S5), priced at £87.99 (~$112.36). According to product descriptions, Crucial's upcoming laptop 5600 MHz RAM "can downclock if system specification only supports 5200 MHz or 4800 MHz."

"Non-binary modules" DDR5 modules hit retail last year—we have witnessed a slow trickle out of 24 GB and 48 GB capacity sticks, granting unusual memory configurations on compatible AMD and Intel platforms. The CT12G56C46S5 and CT2K12G56C46S5 are supported by "Core 13th Gen and Ryzen 6000 Series laptop CPUs and above." Crucial's latest DDR5 SODIMM could be the first 12 GB capacity model to reach retail, unless a rival manufacturer sneaks out an equivalent item prior to March 31.

T-FORCE, the gaming brand under the leading global memory brand Team Group Inc., has launched the highly expected T-FORCE XTREEM ARGB DDR5 Desktop Memory, which not only upgrades both in appearance and performance but also utilizes the exclusive patented IC grading verification technology to create high-speed performance memory modules. The XTREEM ARGB DDR5 allows gamers to enjoy the thrill of gaming while creating an aurora immersive atmosphere with fluid and gentle lighting effects, satisfying consumers' pursuit of robust performance and ultimate aesthetics.

In terms of design, the T-FORCE XTREEM ARGB DDR5 features innovative dual-piece light pipes that emit soft and delicate light movements resembling aurora charm. It also supports various lighting control software [2], creating an extraordinary RGB visual feast and leading players on an unforgettable aurora journey. The product itself features a 2 mm-thick forged aluminium alloy matte black heat spreader, exhibiting both the hardness and durability of basalt and the delicate texture of a black sand beach, perfectly showcasing the ultimate aesthetics of metal craftsmanship and achieving exquisite and unique computer equipment. The XTREEM ARGB DDR5 uses a 10-layer professional anti-interference optimized PCB board and improves the heat dissipation design of the PMIC power management chip to keep performance stable during high-speed data transmission, allowing gamers to enjoy a powerful and high-frame-rate gaming experience.

The world's leading memory module and flash memory brand, ADATA Technology's e-sports brand XPG specializes in high-performance and stylishly designed e-sports products that cater to gamers, tech enthusiasts, and overclockers. High temperatures generated by high-speed overclocked gaming memory affects system stability, performance, and reliability. Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. This new PCB thermal coating technology will be introduced in the second quarter on high-end overclocked DDR5 gaming memory with a clock speed of 8000MT/s or more, to ensure stable and efficient operation in this grade of memory.

Revolutionary heat dissipating coating effectively reduces temperatures by more than 10%
PCB heat dissipation adopts technology that integrates heat conduction, heat radiation, and insulation into an optimized solder mask which not only insulates, but also dissipates and conducts heat to achieve a superior cooling effect. Compared with standard overclocked DDR5 gaming memory heatsinks, this coating's thermal radiation and heat dissipation effects greatly increase dissipation area and efficiency, slowing heat generation at high clock speeds. Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%. Users can enjoy extreme overclocking while maintaining high performance, meeting all challenges without compromise.

TrendForce reports a 29.6% QoQ in DRAM industry revenue for 4Q23, reaching US$17.46 billion, propelled by revitalized stockpiling efforts and strategic production control by leading manufacturers. Looking ahead to 1Q24, the intent to further enhance profitability is evident, with a projected near 20% increase in DRAM contract prices—albeit with a slight decrease in shipment volumes to the traditional off-season.

Samsung led the pack with the highest revenue growth among the top manufacturers in Q4 as it jumped 50% QoQ to hit $7.95 billion, largely due to a surge in 1alpha nm DDR5 shipments, boosting server DRAM shipments by over 60%. SK hynix saw a modest 1-3% rise in shipment volumes but benefited from the pricing advantage of HBM and DDR5, especially from high-density server DRAM modules, leading to a 17-19% increase in ASP and a 20.2% rise in revenue to $5.56 billion. Micron witnessed growth in both volume and price, with a 4-6% increase in each, resulting in a more moderate revenue growth of 8.9%, totaling $3.35 billion for the quarter due to its comparatively lower share of DDR5 and HBM.

V-COLOR today introduced a series of overclocking memory RDIMM kits for workstations powered by AMD Ryzen Threadripper 7000WX processors on the WRX90 platform that features 8-channel DDR5 memory. The kits include 8 RDIMMs, with densities ranging between 16 GB per RDIMM (128 GB per kit), to 96 GB per RDIMM (768 GB per kit); and comes in speeds ranging between DDR5-5600 and DDR5-7200. The best part? These modules feature AMD EXPO profiles, which should make enabling their advertised speeds as easy as a couple of clicks in the motherboard's UEFI setup program.

An EXPO profile not just applies the kit's memory speed, timings, and voltages, but also several sub-timings and settings that are specific to the AMD platform, which are not found on Intel. V-COLOR has tested its overclocking RDIMMs on popular AMD WRX90 chipset motherboards, namely the ASRock WRX90 WS EVO, ASUS PRO WS WRX90E-SAGE SE, and certain unreleased WRX90 workstation motherboards by Supermicro. Although the RDIMMs lack heatspreaders for the DRAM chips, V-COLOR is including what it calls "micro heatsinks" for the PMIC and RCDs. The RCD in particular is crucial to get Threadrippers to operate at speeds such as DDR5-7200. The kits should be available starting today, with all models available from mid-March. The company didn't reveal pricing.