Wednesday, March 6th 2024
ADATA Leads the Industry in Introducing DDR5 Cooling Technology
The world's leading memory module and flash memory brand, ADATA Technology's e-sports brand XPG specializes in high-performance and stylishly designed e-sports products that cater to gamers, tech enthusiasts, and overclockers. High temperatures generated by high-speed overclocked gaming memory affects system stability, performance, and reliability. Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. This new PCB thermal coating technology will be introduced in the second quarter on high-end overclocked DDR5 gaming memory with a clock speed of 8000MT/s or more, to ensure stable and efficient operation in this grade of memory.
Revolutionary heat dissipating coating effectively reduces temperatures by more than 10%
PCB heat dissipation adopts technology that integrates heat conduction, heat radiation, and insulation into an optimized solder mask which not only insulates, but also dissipates and conducts heat to achieve a superior cooling effect. Compared with standard overclocked DDR5 gaming memory heatsinks, this coating's thermal radiation and heat dissipation effects greatly increase dissipation area and efficiency, slowing heat generation at high clock speeds. Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%. Users can enjoy extreme overclocking while maintaining high performance, meeting all challenges without compromise.
Heat dissipating coating applied to memory modules running at 8,000MT/s or more
As a leading memory brand, ADATA Technology continues to pursue innovation and breakthroughs. In response to the dawn of AI computing, speed has become a common objective for the market and, consequently, temperature issues born of high performance has also become a common issue for everyone. XPG has prioritized the application of the latest thermal coating technology to overclocked DDR5 gaming memory running at 8000MT/s or more including the new LANCER NEON RGB and popular LANCER RGB series memory modules expected to be launched in the second quarter and officially unveiled at Computex 2024. For more detailed product information, please visit the XPG website.
Source:
XPG
Revolutionary heat dissipating coating effectively reduces temperatures by more than 10%
PCB heat dissipation adopts technology that integrates heat conduction, heat radiation, and insulation into an optimized solder mask which not only insulates, but also dissipates and conducts heat to achieve a superior cooling effect. Compared with standard overclocked DDR5 gaming memory heatsinks, this coating's thermal radiation and heat dissipation effects greatly increase dissipation area and efficiency, slowing heat generation at high clock speeds. Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%. Users can enjoy extreme overclocking while maintaining high performance, meeting all challenges without compromise.
As a leading memory brand, ADATA Technology continues to pursue innovation and breakthroughs. In response to the dawn of AI computing, speed has become a common objective for the market and, consequently, temperature issues born of high performance has also become a common issue for everyone. XPG has prioritized the application of the latest thermal coating technology to overclocked DDR5 gaming memory running at 8000MT/s or more including the new LANCER NEON RGB and popular LANCER RGB series memory modules expected to be launched in the second quarter and officially unveiled at Computex 2024. For more detailed product information, please visit the XPG website.
14 Comments on ADATA Leads the Industry in Introducing DDR5 Cooling Technology
Ah, I see we are doing that thing again with percentage improvements in temps that Steve from GN was ranting about at marketing execs about couple of years ago.
Why couldnt they just say "We put a heatsink on it" and just end the press release right there?? Short. Sweet and to the point. The most incredibly based advert in the tech market.
That's not how entropy works. Heatsinks and air in your case aren't made of water, and even if they used Kelvin, that's still not how you calculate temperature change because the comparison points should be the differences in deltaT of the heatsinks vs case ambient temperature, not the freezing point of water!
GRRRR! :D
As The Iron Sheik would say - Exaktly. PRECISELY.
FAK HAHOGAN.Seriously, these clowns don’t even indicate what they are even measuring. Is this over ambient? Is this the temperature of the chips themselves? Is this what the sensor on the PCB indicates? No, fake shots of a thermal cam don’t count. And I heavily doubt that any respectable RAM stick with any sort of heatsink in a case with at least some airflow will reach nearly 80C.
Whilst it might lower the PCB temperature slightly, that energy has to go somewhere, and the only logical possibility is that it would make the heatsink hotter, confirming that the IR images are some photoshopped lies, or else they're irrelevant and (intentionally?) misleading as they show the IR camera results of RAM with no heatsink, which isn't how DDR5-8000 kits will ever be sold.
Honestly, heatspreaders on RAM and stupid because they widen the RAM so much that there's zero gap between DIMMS in a fully-populated board. One hot heatspreader practically makes direct contact with its neighbour, dissipating zero heat and simultaneously blocking ALL airflow.
For configurations where there's an empty slot between RAM (quite common), the height of the heatsinks usually obstructs the airflow which is always perpendicular to the gap between RAM sticks.
It's truly a facepalm situation however you try to look at it.