Ventiva, the leader in thermal solutions, today announced that its Ventiva ICE9 thermal management suite is being featured in a fan-less proof-of-concept laptop design, powered by Intel Lunar Lake processors at CES. By collaborating with Dell Technologies and Intel on the PC design, this concept introduces a new level of silent productivity for sub-12 mm laptops.

"Ventiva ICE technology offers a revolutionary approach to help achieve thin, light, and silent laptop designs that offer great performance," said Josh Newman, Vice President, Client Computing Group, and General Manager, Product Marketing & Management, Intel. "Intel is excited about the result of the close co-engineering collaboration with Ventiva and Dell Technologies to help ready their technology for future Intel Core Ultra devices."

GameMax, an emerging brand of PC gaming components including gaming cases and power supply units, is thrilled to announce the Dragon Knight 2 full-tower gaming PC chassis. Designed for high-end gaming PC and workstation configurations, the GameMax Dragon Knight 2 features a massive interior with extensive hardware support.

The Dragon Knight 2 full-tower chassis supports up to an E-ATX motherboard, up to 8x HDDs, and has 8 PCIE slots for add-in-cards and expansions other than graphics cards. It has a built-in HDD hotswap bay on the top panel that's easily accessible. The Dragon Knight 2 comes with 5 pre-installed ARGB fans out of the box providing excellent cooling and good value for builders. The ARGB fans are fully customizable and can be synchronized with the rest of the system via the motherboard. With its cutting-edge features and sophisticated aesthetics, the Dragon Knight 2 is poised to captivate gamers and PC enthusiasts worldwide.

CES 2025 marked the worldwide debut of XYZ brand, a company that is not really a newcomer to the field. Actually, it was founded in 2007 by engineers and hardware experts, and in 2021 they conceived the XYZ brand with a focus on "enhancing the PC user experience to exceptional levels." The TechPowerUp team made their way towards XYZ's booth at CES where a plethora of products were on display. From PC chassis series like Atom, Quantum, Tesseract, Airwave, Trifecta, Aurorax, Airone, and Qubex, to the Thermax air coolers family, AIOs like Aquapulse, Hydrotemp and Hydraview, Vortex and Pulsar fans, to power supply units like the Phantom and Hypervolt series.

We will go over each of them in a few moments (words), but what we would like to mention straightforward is that XYZ brand arrived with a very distinct and clear lineup of products, featuring a minimalist approach that relies on white and black tones with some dashes of color from RGB lighting, doubled by straight lines and sharp edges and corners. XYZ's lineup looks unified, which makes us believe that the company has a clear vision about how they want to present themselves.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."

xMEMS is a company that so far is best known for its MEMS—or microelectromechanical systems—based speaker drivers, but since around the middle of last year, the company has also developed a range of MEMS based cooling solutions. The xMEMS µCooling is competing with a range of new cooling solutions from several new companies and, although their current solution is unlikely to find its way into laptops today, the company has tested to cool hotter running chips using multiple MEMS µCooling modules to great success. The XMC-2400—also known as Sequoia—is the first product and it has an airflow of up to 35 cubic centimeters per second, which isn't a huge amount, but the cooler is said to be inaudible during operation and it also has the added benefit of being waterproof and the entire MEMS cooling module can be soldered in place. At an estimated power consumption of a mere 30 mW, it's also a very power efficient cooling solution. xMEMS had some demos at its booth, of which the one pictured below shows the XMC-2400 blowing or sucking air, with a small fan-wheel spinning to show the movement of the air. Another showcased the static pressure, pushing air through tubing and into a beaker filled with water. Potential applications include removing hot air from phones, although we may see some smaller SoCs getting cooled too.

Thermal Grizzly, a high-performance cooling solutions provider, introduces the Intel 1851 Delid-Die-Mate Heater V1, a tool designed to assist in removing the heat spreader from Intel Core Ultra 200 CPUs using the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of the CPU and the delidder to the required 165°C for delidding.

Delidding processors based on the Intel Arrow Lake architecture (Core Ultra, Pentium) carries a higher risk compared to older Intel CPUs. This is likely due to structural factors such as the size of the CPU die and the fact that the CPU die consists of multiple smaller dies, known as "tiles." To minimize the risk during delidding, the CPU should be heated to approximately 165°C / 330°F to soften the indium solder.

GIGABYTE, the world's leading computer brand, announced the launch of NVIDIA GeForce RTX 50 Series graphics cards powered by NVIDIA Blackwell and AI, including the GeForce RTX 5090, RTX 5090 D, RTX 5080, RTX 5070 Ti, and RTX 5070, at CES. The latest GIGABYTE graphics card models leverage cutting-edge cooling solutions designed for NVIDIA GeForce RTX 50 Series GPUs to enhance performance in demanding games. Accomplished with the product design concept "Evolution of Ten", GIGABYTE's GeForce RTX 50 Series graphics cards improve thermal performance by up to 10% and reduce overall card volume by up to 10% for a more compatible PC-building experience.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio. Plus, access NVIDIA NIM microservices - state-of-the-art AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready systems.

HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announced today at this year's Consumer Electronics Show (CES) that the THICC Q80 Trio, a 360 mm version of its renowned THICC Q60 all-in-one (AIO) liquid cooler, is now available for pre-order at the MSRP of $319.99. Set to launch in Q1 2025, this new cooler builds on HYTE's design and cooling innovations with increased performance capabilities thanks to its thicker size while offering more personalization options thanks to HYTE's flagship Nexus 2.0 software solution. To pre-order the THICC Q80 Trio, please visit: https://hyte.com/q80

"THICC"-ER PERFORMANCE GAINS
Designed to fit the HYTE Y70 and Y70 Touch Infinite cases down to the last millimeter while remaining compatible with a plethora of additional chassis, the THICC Q80 Trio is capable of even more performance thanks to its ginormous heat exchanger, which measures 360 mm long and 52 mm thick for maximum cooling capacity and efficiency. The THICC Q80 Trio also boasts a larger, second-generation copper cold plate with a revised liquid flow path that further enhances temperatures while improving socket compatibility.

European tech brand ENDORFY is making its first official appearance at CES 2025 in Las Vegas. Running through January 9, the company will showcase its latest PC components and peripherals to a global audience at the world's most influential tech event.

ENDORFY is expanding to the US market with a portfolio of high-quality PC components and accessories. This expansion supports the company's goal of reaching all modern technology enthusiasts with a range of products praised for combining advanced technology with reliability, efficiency, and great value for gamers, content creators, and tech enthusiasts.

NVIDIA's brand new 25 Watt "little tiny Jetson Nano" - the Jetson Orin Nano Super - capable of 67 trillion operations per second (TOPS) of AI performance, is going to generate a lot of heat that could limit its performance if the device isn't supported by adequate cooling. Thanks to the high AI performance of the Jetson Orin Nano Super, breakthrough AI models such as NVIDIA Isaac for robotics, NVIDIA Metropolis for vision AI, and NVIDIA Holoscan for sensor processing, NVIDIA Omniverse Replicator for synthetic data generation (SDG) and NVIDIA TAO Toolkit for fine-tuning pretrained AI models may now run at the Edge, delivering compute efficiency, reduced latency and data privacy. But without adequate heat dissipation, the Jetson Orin Nano Super will be forced to throttle, significantly reducing its performance and diminishing the capabilities of Edge AI applications supported including robotics, industrial automation, smart cities, healthcare, and retail analytics.

AirJet PAK 5C-25 from Frore Systems, can provide the full 25 Watts of cooling NVIDIA's Jetson Orin Nano Super needs. The AirJet PAK 5C-25 is a fully self-contained, autonomous, plug and play, solid-state active cooling thermal module, that is thin, silent, dustproof, water resistant, and enables the full performance of the Jetson Nano Super, even in the toughest operating conditions. The AirJet PAK 5C-25 can be combined with the Jetson Orin Nano Super to remove 25 Watts of heat, even in industrial grade casings that are ultra compact, silent, vibration free, dustproof and water-resistant. These industrial grade casings, enabled by the AirJet PAK, are massively smaller and lighter than comparable fanless casings that require large, heavy heat sinks to dissipate heat.

Ventiva, the leader in thermal solutions, today announced its ICE9 thermal management suite can now cool laptops that operate at up to 40 watts TDP (Thermal Design Power), enabling thinner, faster, and utterly silent computing devices—without the compromises of traditional, fan-based cooling systems. This allows the ICE9 solution to cool the powerful CPUs required for the next-generation of feature-rich, AI-enabled, high-performance laptops.

The ICE9 thermal management suite is based on Ventiva's patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans, using intelligent software control to enable optimal performance in electronics devices—without any moving parts, noise or vibration.

With the new Core Distro Plate 280, Core Distro Plate 420 and Core Distro Plate 480, Alphacool presents the perfect addition for high-end water cooling projects. With its Core design, it is not only an absolute eye-catcher, but also a functional masterpiece that facilitates the construction and planning of complex water circuits and offers uncomplicated installation.

The Core Distro Plate 280 is available in two versions - with a pump connection on either the left or right side. This offers maximum flexibility for different casing configurations. The Core Distro Plate 420 and Core Distro Plate 480 come with a pump connection on the left-hand side and are ideal for larger builds.

Phanteks introduces the NEXLINQ ecosystem, a next-gen solution for enhanced cooling, fan and lighting control, and refined system aesthetics. Featuring the new Linq 6 connector, NEXLINQ simplifies cable management and elevates DIY PC builds. The ecosystem includes the NEXLINQ Hub, M25 Gen 2 Fans, and Glacier One 360M25 G2 AIO Liquid CPU Cooler, delivering ultimate performance and customization. Fully compatible with the G400A chassis and future products, NEXLINQ offers a seamless, optimized setup for gamers and PC enthusiasts.

The Phanteks NEXLINQ Hub, with the Linq 6 connector and NEXLINQ App, simplifies fan and lighting control across your system. The hub streamlines connectivity, reducing cable clutter, while the app offers an intuitive interface for fine-tuning fan speeds and lighting effects. With support for CPU/GPU temperature-based fan RPM adjustments and customizable RGB effects, users can easily personalize and optimize their builds. The Phanteks M25 Gen 2 Fans boost cooling efficiency with a daisy-chained unified fan frame and Linq 6 connector, ensuring fast, clean connections and reducing cable clutter. Designed for optimal airflow, they excel at cooling radiators and heatsinks under heavy loads. With options for regular or reverse airflow, users can fine-tune thermal performance. The fans also feature integrated D-RGB lighting, delivering dynamic, infinity mirror style visual effects.

Hypertec proudly announces the launch of its latest breakthrough product, the TRIDENT iG series, an immersion-born GPU server line that brings extreme density, sustainability, and performance to the AI and HPC community. Purpose-built for the most demanding AI applications, this cutting-edge server is optimized for generative AI, machine learning (ML), deep learning (DL), large language model (LLM) training, inference, and beyond. With up to six of the latest NVIDIA GPUs in a 2U form factor, a staggering 8 TB of memory with enhanced RDMA capabilities, and groundbreaking density supporting up to 200 GPUs per immersion tank, the TRIDENT iG server line is a game-changer for AI infrastructure.

Additionally, the server's innovative design features a single or dual root complex, enabling greater flexibility and efficiency for GPU usage in complex workloads.

Corsair today launched the LX-R RGB Series of reverse flow cooling fans, a complement to its high-performance LX RGB fans and acclaimed iCUE LINK ecosystem. Proving that amazing lighting and high-performance cooling don't have to be mutually exclusive, the LX RGB series has redefined user expectations for PC cooling fans. The LX-R series answers community demand for a reverse flow fan, ideal in situations such as case or radiator intakes where traditional fan hub and support arms would obstruct the fan lighting from being visible.

LX-R RGB fans are available in 120 mm and 140 mm sizes, in your choice of black or white to match the aesthetic of your build. Each LX-R RGB fan features 18 individually addressable RGB LEDs spread across an inner and outer light loop, creating spectacular, fully customizable lighting effects - including the iCUE LINK-exclusive Time Warp mode that creates mesmerizing optical illusions. All of this can be controlled from the Corsair iCUE software, making it easier than ever before to customize and switch between lighting effects or synchronizing them to your games.

CoolIT Systems (CoolIT), the world leader in liquid cooling systems for AI and high-performance computing, introduces the CHx1000, the world's highest-density liquid-to-liquid coolant distribution unit (CDU). Designed for mission-critical applications, the CHx1000 is purpose-built to cool the NVIDIA Blackwell platform and other demanding AI workloads where liquid cooling is now necessary.

"CoolIT created the CHx1000 to provide the high capacity and pressure delivery required to direct liquid cool NVIDIA Blackwell and future generations of high-performance AI accelerators," said Patrick McGinn, CoolIT's COO. "Besides exceptional performance, serviceability and reliability are central to the CHx1000's design. The single rack-sized unit is fully front and back serviceable with hot-swappable critical components. Precision coolant controls and multiple levels of redundancy provide for steady, uninterrupted operation."

Today, Hewlett Packard Enterprise announces its new high performance computing (HPC) and artificial intelligence (AI) infrastructure portfolio that includes leadership-class HPE Cray Supercomputing EX solutions and two systems optimized for large language model (LLM) training, natural language processing (NLP) and multi-modal model training. The new supercomputing solutions are designed to help global customers fast-track scientific research and invention.

"Service providers and nations investing in sovereign AI initiatives are increasingly turning to high-performance computing as the critical backbone enabling large-scale AI training that accelerates discovery and innovation," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "Our customers turn to us to fast-track their AI system deployment to realize value faster and more efficiently by leveraging our world-leading HPC solutions and decades of experience in delivering, deploying and servicing fully-integrated systems."

Even more versatile in the second revision: Developed on the basis of its proven predecessor model, the new version of the Freezer 4U-M offers optimised cooling performance, not only for powerful server CPUs from AMD and Intel, but also for the ARM processors of the Ampere Altra series.

Multi-compatible with additional flexibility
The 2nd revision of the Freezer 4U-M also impresses with its case and socket compatibility. In addition, it has been specially adapted to support Ampere Altra processors with 32 to 128 cores.

GameMax, an emerging brand of PC gaming components, including gaming cases and power supply units, is thrilled to announce the new Infinity Pro gaming chassis. The chassis features a dual-chamber layout with a panoramic tempered glass design. The GameMax Infinity Pro is perfect for showcasing the beauty of internal components and RGB illumination, with tempered glass panels on the front, side, and top of the case. The GameMax Infinity Pro comes equipped with five 120 mm PWM ARGB fans and a fan and ARGB controller hub, providing sufficient cooling for high-end gaming configurations right out of the box. Additionally, the fan and ARGB controller hub include 81 built-in lighting effects and support motherboard RGB sync technologies when connected to the motherboard's RGB header.

The GameMax Infinity Pro gaming chassis also supports back-connector motherboards such as the ASUS BTF motherboards, GIGABYTE STEALTH motherboards, and MSI PROJECT ZERO motherboards. For cooling, the chassis supports up to 360 mm radiators for liquid cooling. The chassis supports a maximum of 8x 120 mm fans. The GameMax Infinity Pro gaming chassis is available in black and white models.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is excited to announce the global release of the TOUGHFAN EX12/14 Pro High Static Pressure PC Cooling Fan - Swappable Edition (3-Fan Pack) in a brand-new White color. With its MagForce 2.0 system and pristine aesthetic, this latest edition is perfect for those looking to build sleek, high-performance non-RGB setups. The new White finish offers a clean, modern look, bringing elegance to any build. Whether you're assembling an all-white rig or want to add a fresh, minimalist touch to your current system, the TOUGHFAN EX12/14 Pro White offers the perfect blend of style and function.

At the core of the TOUGHFAN EX12/14 Pro White is the MagForce 2.0 Quick Connect Design. This upgraded system uses larger pogo pin contact pads, ensuring perfect fan alignment with each magnetic connection. Whether you're daisy-chaining fans or reducing cable clutter, this design makes installation simpler and more efficient. Equipped with a swappable fan blade design, the TOUGHFAN EX Pro gives users the flexibility to switch between standard and reverse blades, allowing the front of the fan to face forward in any configuration. Plus, the fan blades are designed for easy removal, making maintenance as simple as popping them out for cleaning and popping them back in.

Polartherm, the latest name in Thermal Interface Materials, has launched to deliver high performance Thermal Pastes at an accessible price point. Formulated for DIY Builders, PC Gamers and everyday users to achieve efficient heat transfer between critical components.

With today's processors and graphics cards requiring more power and operating much closer to their thermal limits every degree counts. Polartherm has entered the market to enable everyone to get the most from their cooling solutions, by offering products that provide high quality, straightforward application and durability at competitive prices.

The CHIEFTEC Iceberg is an all-in-one CPU cooler, featuring a 240 mm/360 mm water-cooling radiator and Snap-On interlocking (ARGB) PWM fans that ensure excellent heat dissipation. With fan speeds reaching up to 2200 rpm, it provides efficient cooling for a wide range of CPUs. The innovative parallel fin radiator design maximizes the contact area between water tubes and radiator fins, while maintaining a high surface area exposed to the cooling airflow, thereby enhancing overall thermal transfer and heat dissipation.

The Iceberg Series includes an infinity mirror ARGB cooling block and a 360-degree rotatable CHIEFTEC logo. Installation is hassle-free thanks to the robust braided steel tubing and the convenient mounting clip kit. The snap-on interlocking (ARGB) PWM fans minimize the number of cables ensuring an easy and clean build. The Iceberg Series is your trusted and reliable choice for pushing your CPU to maximum performance, while ensuring optimal thermals and noise levels.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

In close cooperation with hyperscalers and server OEMs, Rittal has developed a modular cooling distribution unit (CDU) that delivers a cooling capacity of over 1 MW. It will be the centerpiece exhibit at Rittal's booth A24 at 2024 OCP Global Summit. The CDU uses direct liquid cooling based on water - and is thus an example for new IT infrastructure technologies that are enablers for AI applications.

New technology, familiar handling?
"To put the technology into practice, it is not enough to simply provide the cooling capacity and integrate the solution into the facility - which also still poses challenges," says Lars Platzhoff, Head of Rittal's Business Unit Cooling Solutions: "Despite the new technology, the solutions must remain manageable by the data center team as part of the usual service. At best, this should be taken into account already at the design stage."

MSI's latest MAG CORELIQUID I Series Liquid Cooler receives high praise for its DIY-friendly features, designed to simplify the assembly process. With pre-installed fans, streamlined cables, and UNI bracket, users can save time and effort while enjoying their assembly experience. MSI continues to prioritize delivering the best cooling solutions for our users. To support the latest Intel Core Ultra desktop processors (series 2), our engineering team has developed the LGA 1851 Offset Kit Enhancer-I for the MAG CORELIQUID I Series, engineered to optimize cooling performance. As a token of appreciation for our users, MSI is offering the LGA 1851 Offset Kit Enhancer-I to users free of charge. We invite you to apply and enhance your cooling experience.

Boosting Cooling Efficiency with LGA 1851 OFFSET KIT ENHANCER-I
The new MSI MAG CORELIQUID I Series is tailor-made for Intel Core Ultra desktop processors (series 2) platform. The enhanced LGA 1851 OFFSET KIT ENHANCER-I addresses the heat source shifting of the LGA 1851 socket. This upgraded mounting bracket precisely targets the core heat source, boosting cooling efficiency by approximately 3% when overclocking and ensuring stable operation even under heavy loads. For gamers pushing the limits of performance, this upgrade is about improved cooling performance and a fundamental breakthrough in system stability. MSI's optimized cooling design lets you enjoy top-tier performance output and stable system performance even during intense overclocking or extended operation, fully satisfying the ultimate desire for extreme performance.