Thermaltake, a leading PC DIY brand for premium hardware solutions, is delighted to announce that the Ceres 350 MX Mid Tower Chassis is available now, offered in 7 colors: Black, Snow, Matcha Green, Hydrangea Blue, Racing Green, Bumblebee, and Bubble Pink. The Ceres 350 MX is an ATX case built with a focus on visual appeal. It supports the latest hidden-connector motherboards for excellent cable management. Furthermore, this case features two interchangeable front panels, enabling PC enthusiasts to choose their preferred setup. Users also can upgrade the Ceres 350 MX with an additional 2.1" Circle LCD Screen Kit, achieving a more eye-catching build.

Besides standard motherboards, the Ceres 350 MX supports hidden-connector motherboards as well, including the ASUS BTF Series, the MSI PROJECT ZERO Series, and the GIGABYTE PROJECT STEALTH Series. It is beneficial for aesthetics inside the chassis by organizing messy cables to the rear. Through the 4 mm tempered glass panel on the left side of the Ceres 350 MX, the outstanding cable management and the RGB lighting of components can fully be displayed. The case comes with a dual interchangeable front panel design, users can install a tempered glass panel for wide viewing or a perforated panel for enhanced airflow.

With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024. Major CSPs are expected to start building AI server data centers based on this new platform, potentially driving the penetration rate of liquid cooling solutions to 10%.

Air and liquid cooling systems to meet higher cooling demands
TrendForce reports that the NVIDIA Blackwell platform will officially launch in 2025, replacing the current Hopper platform and becoming the dominant solution for NVIDIA's high-end GPUs, accounting for nearly 83% of all high-end products. High-performance AI server models like the B200 and GB200 are designed for maximum efficiency, with individual GPUs consuming over 1,000 W. HGX models will house 8 GPUs each, while NVL models will support 36 or 72 GPUs per rack, significantly boosting the growth of the liquid cooling supply chain for AI servers.

With the PhaseSheet PTM, Thermal Grizzly Holding GmbH presents an electrically non-conductive thermal pad based on a phase change material (PCM). With PhaseSheet PTM, Thermal Grizzly closes the gap between traditional thermal paste and thermal pads based on graphene or carbon thermal pads. This means that the respective advantages in terms of application and thermal conductivity can be combined in one product.

PhaseSheet PTM is a thermal pad that has been optimized for applications where maintenance cycles are subject to long intervals. It is more durable than traditional thermal conductive pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM develops and stabilizes after around ten thermal cycles above 60 degrees Celsius.

EK, the leading manufacturer of premium liquid cooling gear, is proud to introduce the EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi. This top-tier Ultrablock-class product, part of EK's renowned Quantum Line, is engineered for the ASUS ROG Maximus Z790 Extreme motherboard to ensure flawless compatibility.

The EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi is equipped with the award-winning EK-Quantum Velocity² cooling engine, delivering direct cooling to crucial motherboard components, such as the primary M.2 drive. This monoblock also features:

• Direct connection to Vector² GPU water block and Active Backplate Sets via bypass valves
• Temperature sensors
• Liquid flow meter
• Direct integration with the ROG water-cooling zone
• ILM Replacement Kit

XIGMATEK brought a huge selection of cases to the 2024 Computex, but they also unveiled several new CPU coolers and power supplies, which we'll cover in this article. The Loki M L750 and Loki M L850 are mainstream full-modular PSUs. These meet ATX 3.1 and PCIe Gen 5.1 specs, and put out a modern 12V-2x6 power connector. Under the hood, these feature a single +12 V rail design with DC-to-DC switching, active PFC, and 80 Plus Bronze efficiency. Cooling these PSUs are 120 mm fans tuned for low-noise.

XIGMATEK showed us three models of AIO liquid CPU coolers, the Frozr-O III, and the Frozr Connect Arctic series. The Frozr-O III come in sizes of up to 360 mm x 120 mm, with addressable RGB LEDs for the fans, and the pump-block. This comes in white and black. There is a premium variant of this cooler with a softer lighting diffuser on the pump, some tubing combs, higher static-pressure fans, and what looks like a thicker radiator.

Project XPG NeonStorm PCIe Gen 5 SSD, which won an award at Computex, has a dual active cooling system with an aluminium air duct, liquid cooling, and dual fans. This increases the Gen 5 SSD's cooling efficiency by 10%. The Legend 970 Pro PCIe Gen 5 SSD has read/write speeds up to 14,000/12,000 MB/s, using an aluminium heatsink and a micro fan for better heat dissipation.

The XPG Lancer Neon RGB DDR5 memory module uses a heat dissipating coating on the PCB, a heatsink made of 50% recycled materials, and an eco-friendly manufacturing process. It's the first eco-friendly RGB memory module, performing up to 8,000 MT/s with 16 GB and 24 GB capacities.

In addition to new PC cases, Phanteks brought several new cooling products to the Computex 2024 show, including a whole new NEXLINQ cooling system, Glacier EZ-Fit series of liquid cooling components and kits, as well as a rather interesting fan prototype that will hopefully find its way to the market.

The big part of the Phanteks showcase was the NEXLINQ, a set of cooling components, or an ecosystem as Phanteks likes to describe it, which includes the M25 G2 fans, Glacier One M25 G2 AIO, and a NEXLINQ Hub. The NEXLINQ and components will feature support for the whole new LINQ-6 connector that will be able to provide both power and D-RGB lighting to the fans.

According to Geekerwan, Apple's latest M4 silicon has achieved a remarkable milestone by using liquid nitrogen to chill Apple's M4 iPad Pro. This unconventional approach unlocked great single-core performance, surpassing even the M3 Max and M2 Ultra processors in Geekbench v6 benchmark tests. The setup involved cooling the M4 iPad Pro, equipped with a 3+6 core configuration, using a Kingpin Cooling T-Rex Rev 4 CPU LN2 pot filled with liquid nitrogen. This extreme cooling allowed the M4 processor to operate at an astonishing 4.41 GHz during the benchmark run, resulting in a staggering single-core score of 4,001 points. This score represents a 28% increase over the M3 Max found in the 16-inch MacBook Pro and an impressive 44% improvement over the M2 Ultra powering the Mac Studio.

Notably, the M4's single-core performance is capable of reaching scores in the 3,000s. With liquid nitrogen cooling, it suprases the 4,000-point mark, making this achievement all the more remarkable. While the M4's multi-core performance did not match the lofty expectations set by its single-core power, it still managed to achieve a score of 13,595 points, outperforming both the M3 Max and M2 Ultra, which scored 20,957 and 21,330 points, respectively. This was done on the 3+6 core configuration with three P-cores and six E-cores, which is not the top-end M4 configuration. This shows that with adequate cooling, like MacBooks, the upcoming M4 Pro and M4 Max chips could achieve much higher performance than their predecessors.

EK, a leader in premium liquid cooling solutions, proudly unveils the EK-Quantum Momentum² Quad RAM Module Set D-RGB, an advanced cooling solution meticulously designed for effective thermal management of DDR4 and DDR5 memory modules. This comprehensive set includes a water block capable of covering four RAM sticks with aluminium heatsinks, integrating high-quality cooling efficiency with dynamic RGB lighting to enhance both the performance and visual appeal of any high-end computing setup. The system is specifically engineered to support configurations with four RAM sticks, optimizing cooling for modern high-performance memory arrays.

Enhanced Cooling and Sophisticated Design
The EK-Quantum Momentum² Quad RAM Module Set D-RGB accommodates both single and double-sided DDR4 and DDR5 memory modules, ensuring versatility across different RAM configurations. It features four sleek, black, anodized aluminium heatsinks with an elox finish for enhanced durability and corrosion resistance. This treatment not only improves the heatsinks' appearance but also boosts their thermal conductivity and cooling effectiveness.

The world's leading memory module and flash memory brand, ADATA Technology's e-sports brand XPG specializes in high-performance and stylishly designed e-sports products that cater to gamers, tech enthusiasts, and overclockers. High temperatures generated by high-speed overclocked gaming memory affects system stability, performance, and reliability. Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. This new PCB thermal coating technology will be introduced in the second quarter on high-end overclocked DDR5 gaming memory with a clock speed of 8000MT/s or more, to ensure stable and efficient operation in this grade of memory.

Revolutionary heat dissipating coating effectively reduces temperatures by more than 10%
PCB heat dissipation adopts technology that integrates heat conduction, heat radiation, and insulation into an optimized solder mask which not only insulates, but also dissipates and conducts heat to achieve a superior cooling effect. Compared with standard overclocked DDR5 gaming memory heatsinks, this coating's thermal radiation and heat dissipation effects greatly increase dissipation area and efficiency, slowing heat generation at high clock speeds. Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%. Users can enjoy extreme overclocking while maintaining high performance, meeting all challenges without compromise.

BIG SPECIAL PROMOTION FOR THE COMPANY'S 23RD ANNIVERSARY—ARCTIC is blowing out the candles and celebrating its 23rd anniversary this year. Customers can look forward to numerous product offers with at least 23% discounts throughout 2024. Others only celebrate decadal birthdays, ARCTIC's 23 years are reason enough to look back with pride—and gratitude—on almost a quarter of a century of company history. From its beginnings as an underdog and insider tip to the no-brainer in the field of computer cooling, ARCTIC's path was characterized by dedication, with successes and setbacks but, above all, always close to the customers. These can now take part in a large-scale special promotion throughout 2024 with changing product offerings.

"We're turning 23, and we say thank you!" says founder Magnus Huber. "Not only do we look back on over 20 years of expertise, we also want to give something back to our customers for 23 years of loyalty and support." Pur promotion campaign begins with an ARCTIC top seller. The discount promotion starts with ARCTIC top selling and all-time favorite MX thermal paste: offering at least 23% off of all sizes of the MX-4 and MX-6. On Amazon, Ebay and many ARCTIC partners. Valid from January 30 to April 30, 2024. In the next months there will be new offers on Amazon, Ebay as well as in the online shop and by many ARCTIC partners. Customers can stay informed via the Newsletter.

MSI presented a massive table of GeForce RTX 40 SUPER series custom design graphics cards at CES 2024—TPU spent a lot of time photographing and documenting everything GPU-related at the tech company's booth. The kind-of mysterious GeForce RTX 4080 SUPER 16G EXPERT model seemed to get a lot of attention from online PC hardware communities. The brand new and very substantial EXPERT shroud design integrates a Zero Frozr cooling solution, but folks were quick to link its aesthetic (and vapor chamber setup) to NVIDIA's dual fan Founders Edition cooling solution. MSI has not yet published a dedicated GeForce RTX 4080 SUPER 16G EXPERT product page, while all of the other models from CES are uploaded and active.

A tipster on social media has posted a screenshot of the 16G EXPERT's specification sheet—wxnod has uncovered alleged factory settings ahead of review and launch day embargos, although pricing is still unknown at the time of writing. The leaked core figures include a boost clock of 2610 MHz in GAMING and SILENT modes (60 MHz above reference), while the MSI Center software suite can activate an Extreme Performance mode: 2625 MHz. These figures align with the SUPER SUPRIM model's core clock specs—the SUPRIM X sits above everything else as the fastest card in MSI's RTX 4080 SUPER stable. MSI's official introduction stated that the 16G EXPERT: "features a push-pull airflow design for enhanced cooling efficiency. The enclosure is constructed with aluminium Die-Casting for structural strength, while Core Pipe and a Vapor Chamber work to efficiently dissipate heat. Lastly, a patented fan design provides quiet yet reliable airflow." We hope to see the MSI GeForce RTX 4080 SUPER 16G EXPERT's addition to the TPU GPU database.

EK, the leading provider of premium liquid cooling solutions, is excited to announce the expanded compatibility of its esteemed EK-Quantum Magnitude sTRX4 water blocks. These flagship cooling solutions, known for their high performance and quality, are now fully compatible with the latest AMD sTR5 and AMD SP6 CPU sockets. This advancement ensures that users of the new sTR5 and SP6 platforms can experience the same superior cooling and craftsmanship that EK-Quantum Magnitude sTRX4 users have long come to trust.

The EK-Quantum Magnitude sTRX4 series, including the Full Nickel, Nickel Acetal, and Nickel Plexi models, maintains its renowned design and efficiency while embracing the evolving landscape of CPU technology. Customers can continue to rely on these solutions for their cooling needs without any changes in product naming or design. Refer to the EK Compatibility Configurator and EK Custom Loop Configurator database for a detailed compatibility list.

The TechPowerUp team visited the EK water blocks booth at the CES 2024 international show. We previously covered the company's latest direct-die all-in-one (AIO) water cooler, but many more products were on display. First in line is EK's Quantum-X NoCase chassis, which contradicts traditional PC enclosures with its open, no outer shell design. This radical departure from convention results in a nearly invisible frame crafted from aluminium for a featherlight weight of approximately 3 pounds. Its design is meticulously engineered to be as airy and lightweight as possible without compromising the support needed for essential hardware and liquid cooling components. The case integrates the advanced Reflection² distro plate, equipped with dual D5 pumps to facilitate separate cooling loops for both the CPU and GPU, ensuring optimal thermal management in a minimalist aesthetic.

During the CES 2024 show, EK unveiled an exciting new addition to their premium all-in-one (AIO) CPU cooler lineup—the EK-Nucleus AIO CR360 Direct Die D-RGB. As the name suggests, this new 360 mm AIO water cooler is purpose-built for direct die cooling of delidded Intel LGA1700 CPUs. The EK-Nucleus Direct Die stands out with its custom cold plate and mounting mechanism, which are exclusively engineered for exposed CPU dies. The nickel-plated copper base ensures compatibility with liquid metal TIMs like the included Thermal Grizzly Conductonaut, which comes in the package. EK has worked with der8auer to provide delidding service kits and tools to facilitate easy DIY removal of the integrated heat spreader (IHS).

The package also contains a contact frame and protective foam for safe liquid metal application. At the heart of the cooler is a powerful AIO pump EK co-developed with the OEM manufacturer, meaning it is not an off-the-shelf pump found in other AIOs and is capable of up to 500 L/h flow rate. The reinforced, sleeved rubber tubing is fitted with aluminium covers for durability. Integrated omnilink connectors allow daisy chaining of the three included 120 mm D-RGB fans for cable management. The EK-Nucleus Direct Die offers extensive RGB lighting customization with illuminated circle accents on the removable pump top covers. The diamond-cut brushed aluminium side panels and radiator cowl add to the premium aesthetic. The new AIO will be available for the Intel LGA1700 platform, with hopefully more versions later. The EK-Nucleus AIO CR360 Direct Die D-RGB is now available for pre-order at €202.90 MSRP price tag.

At CES 2024, Frore Systems, the pioneering developer of AirJet Mini, the world's first Solid-State Active Cooling Chip, unveiled the AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip.

Building on the success of the original AirJet Mini, which garnered widespread recognition, including the prestigious COMPUTEX 2023 Golden Award and CES 2024 "Best of Innovation" Award, Frore Systems continues to accelerate the pace of innovation in thermal management. The AirJet Mini Slim, featuring the same groundbreaking solid-state active cooling design of its predecessor, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.

DeepCool has unveiled a brand new cooling fan series at CES 2024—an intriguing selection of models include the high-performance FT12 and FT14 offerings. The company's engineers have designed these to be low-noise cooling solutions with excellent durability credentials. Their latest 120 mm and 140 mm models feature powerful 3-phase, 10-pole, 12-slot FOC closed-loop control motors with MQ magnets, and true high-grade fluid dynamic bearings. DeepCool is keen to highlight impressive specifications—namely (up to) 80,000 operating hours and a 5-year long limited warranty period.

The FT12's airflow performance is rated at a maximum of 79 CFM. According to the specification sheet on display at CES, the FT12 has static pressure rated at 4.2 mm/H20, while its noise level has been measured at around 29.9 dB(A). The F14's airflow also sits at 79 CFM, static pressure is 3.6 mm/H20 and noise level is similarly around the 29.9 dB(A) mark. DeepCool summarizes that the standard-sized FT fans are powerful, quiet and durable. Black or white color options were on display at the company's booth.

Featuring a dual pump, dual chamber design for unprecedented cooling efficiency, this AIO cooler is perfect for high-performance CPUs. It's not just about cooling; it's about customizability, style and setting new standards in the industry. Discover how the G11 AIO elevates your PC's performance and aesthetics.

Why Choose the G11 AIO
The G11 AIO is more than a cooling system; it's a commitment to innovative technology and user-centric design. It's perfect for enthusiasts who demand the best in performance, style and customization.

Discover the future of CPU cooling technology with Cooler Master's V8 3DVC. Engineered for high-performance, it features advanced superconductive heat pipes and a redesigned vapor chamber, offering unparalleled cooling efficiency. Perfect for demanding CPUs, it promises top-notch performance and sleek aesthetics. Tune in to explore how the V8 3DVC sets new benchmarks in cooling solutions.

Why Choose the V8 3DVC
The V8 3DVC is more than just a cooling solution; it's a testament to Cooler Master's commitment to innovation and quality. Whether you're a gamer, a creative professional, or a tech enthusiast, this cooler is designed to deliver exceptional performance, reliability, and style.

Intel is expanding immersion cooling collaborations with Taiwanese partners to strengthen its data center offerings for AI workloads. This includes developing an industry-first open IP complete immersion cooling solution and reference design. Partners like Kenmec and Auras Technology will be key in implementing Intel's advanced cooling roadmap. Intel is also cooperating with Taiwan's Industrial Research Institute on a new lab for certifying high-performance computing cooling technologies to international standards. With local ecosystem partners, Intel aims to accelerate next-generation cooling solutions for Taiwanese and global data centers. Advanced cooling allows packing more performance into constrained data center footprints, which is critical for AI's rapid growth. Intel touts a superfluid-based modular cooling system achieving 1500 Watts+ heat dissipation for high-density deployments.

Meanwhile, Kenmec offers a range of liquid cooling products, from Coolant Distribution Units (CDU) to customized Open Rack version 3 (ORv3) water cooling cabinets, with solutions already Intel-certified. Intel wants to solidify its infrastructure leadership as AI workloads surge by fostering an open, collaborative ecosystem around optimized cooling technologies. While progressing cutting-edge immersion and liquid cooling hardware, cultivating shared validation frameworks and best practices ensures broad adoption. With AI-focused data centers demanding ever-greater density, power efficiency, and reliability, cooling can no longer be an afterthought. Intel's substantial investments in a robust cooling ecosystem highlight it as a priority right alongside silicon advances. By lifting up Taiwanese partners as strategic cooling co-innovators, Intel aims to cement future competitiveness.

In the era of high-tech development and the ever-increasing demand for data processing power, data centers are consuming more energy and generating excess heat. As a global leader in thermal solutions, SUNON is at the forefront, offering a diverse range of cutting-edge liquid cooling solutions tailored to advanced data centers equipped with high-capacity CPU and GPU computing for AI, edge, and cloud servers.

SUNON's liquid cooling design services are ideally suited for modern data centers, generative AI computing, and high-performance computing (HPC) applications. These solutions are meticulously customized to fit the cooling space and server density of each data center. With their compact yet comprehensive design, they guarantee exceptional cooling efficiency and reliability, ultimately contributing to a significant reduction in a client's total cost of ownership (TCO) in the long term. In the pursuit of net-zero emissions standards, SUNON's liquid cooling solutions play a pivotal role in enhancing corporate sustainability. They o ff er a win-win scenario for clients seeking to transition toward greener and more digitalized operations.

The SG10 is an ambitious product designed to push the boundaries of fanless technology and create a gaming case capable of cooling high-performance CPUs and GPUs without the use of fans. This project collaboration between Streacom and Calyos is also aimed at showcasing the application of loop heat pipe technology in PC cooling and represents the first step in creating a viable mainstream high-performance solid-state alternative to water cooling solutions.

The spiritual successor to the SG10 began life as a Kickstarter project launched by Calyos as the NSG S0, and whilst having extensive expertise in cooling, the additional challenges of consumer product manufacturing proved to be a stumbling block. A search ensued to find a partner with suitable experience to get the project back on track, and with experience in both case manufacturing and fanless cooling, Streacom was the natural fit. As can be understood just by glancing at the image, the SG10 represents a complete redesign of the NSG S0. Not a single asset or component was carried over from the original case. This includes the Evaporator that pumps the coolant around the loop and the Condenser that radiates the heat, both core components that make this performance possible. Everything has been entirely re-engineered and improved far beyond the original specification and performance.

The Ryzen 7040 Series processor in Framework Laptop 16 is capable of running at a sustained 45 W TDP (Thermal Design Power) and we put together an excellent thermal solution to ensure it can do that while keeping CPU temperature, touch temperatures, and fan noise to a minimum. That 45 watts of CPU power needs to be efficiently conducted into the vapor chamber, heatpipes, and fins to be carried away through airflow from the fans.

Since neither the CPU die nor the vapor chamber surface are perfectly flat, a thermal interface material is needed to fill in gaps to avoid comparatively insulative air taking up that space. Traditionally, most computers use a thermal grease that has thermally conductive particles suspended in silicone. This works reasonably well, but the silicone itself isn't especially thermally conductive, and the paste can pump out or dry out over time, making it less effective.

EK, the renowned premium liquid cooling pioneer, proudly announces the debut of its latest masterpiece, the EK-Quantum Momentum² Aorus Z790 Master X D-RGB - Plexi. This monoblock is expertly designed for the Intel LGA 1700 socket and engineered with precision for seamless integration with the GIGABYTE Z790 AORUS MASTER X motherboard. The monoblock's addressable D-RGB LED effortlessly harmonizes with Gigabyte RGB Fusion 2.0 control, providing comprehensive lighting customization for each diode and ensuring a dynamic visual spectacle. This monoblock is also fully compatible with EK-Matrix7, further enhancing its versatility within EK's liquid cooling ecosystem.

EK-Quantum Momentum² Aorus Z790 Master X D-RGB - Plexi
This is a complete all-in-one (CPU and motherboard) liquid cooling solution for Intel's 12th, 13th, and 14th Gen processors. The monoblock seamlessly aligns with the LGA 1700 socket on the Gigabyte Z790 Aorus Master X motherboard. The monoblock's unique design, incorporating a specialized metal cover over the I/O section, is noteworthy. This cover serves a dual purpose: it facilitates the mounting of the stock I/O cover without compromising the factory-intended RGB lighting of the motherboard while also functioning as an elegant stand for the original LCD screen.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.