At CES 2024, Frore Systems, the pioneering developer of AirJet Mini, the world's first Solid-State Active Cooling Chip, unveiled the AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip.

Building on the success of the original AirJet Mini, which garnered widespread recognition, including the prestigious COMPUTEX 2023 Golden Award and CES 2024 "Best of Innovation" Award, Frore Systems continues to accelerate the pace of innovation in thermal management. The AirJet Mini Slim, featuring the same groundbreaking solid-state active cooling design of its predecessor, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.WHAT'S NEW
Thinner Design:
At an incredibly thin 2.5 mm and weighing only 8 g, the Airjet Mini Slim trims an additional 0.3 mm from the thickness and 1 g from the weight of the original AirJet Mini, while maintaining the same heat removal capability. This ultra-thin profile opens up new possibilities for manufacturers catering to consumer demand for higher performance in increasingly thinner devices. The AirJet Mini Slim is an ideal solution for ultra-thin products like fanless laptops, professional tablets, handheld gaming devices, SSD accessories and smartphones.

Intelligent Self-Cleaning:
Addressing an industry-wide challenge, the AirJet Mini Slim introduces intelligent self-cleaning feature to conquer dust. Dust accumulation has traditionally posed operational risks and decreased performance in electronic devices. The new AirJet Mini Slim tackles this concern with its self-cleaning function that automatically reverses airflow and clears any accumulated dust from the AirJet dust filters. This ensures sustained peak performance of AirJet over the long term and maintains the high performance of the host device. This intelligent self-cleaning feature is backward compatible and is also available with the AirJet Mini.

Thermoception:
The AirJet Mini Slim introduces Thermoception, a capability that enables AirJet to independently sense its temperature. This innovation allows the AirJet Mini Slim to optimize its performance autonomously, maximizing heat removal without relying on temperature sensors in the host device, opening new possibilities for cooling devices that lack integrated CPUs and temperature sensing components.

"Dr. Seshu Madhavapeddy, Founder and CEO of Frore Systems commented on the AirJet Mini Slim, stating, "Reducing the chip's thickness by 0.3 mm is a game-changer for products requiring excellent thermal management in increasingly thinner devices. AirJet Mini Slim will bring much-needed performance improvements to ultra-thin electronic devices like fanless laptops, tablets, and smartphones."

Frore Systems launched AirJet in January 2023 and has seen unprecedented demand for the small, highly effective active cooling chips. The latest product, AirJet Mini Slim with its new intelligent capabilities, is just 2.5 mm thick and 8 g, 0.3 mm thinner and 1 g lighter than the original AirJet Mini, while retaining the same tiny footprint, just 27.5 mm x 41.5 mm. Like all Frore System products, AirJet Mini Slim is a scalable solution, with additional heat removal achievable by simply adding more AirJet chips. Each chip removes 5 W of heat, and the easy integration of multiple chips means two chips can remove 10 W, three chips 15 W and so on.

AirJet's compact size and scalable nature means manufacturers can achieve enhanced heat removal for increased performance in a wide range of faster, thinner, lighter, silent, and dustproof devices. AirJet can enhance performance across numerous devices from Notebooks, Mini-PCs, tablets, smartphones and SSDs to the approaching tsunami of IOT devices; DSLR cameras, WiFi access points and LED lighting, and in markets as diverse as the datacenter and automotive industries.